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公开(公告)号：EP0633579A3
公开(公告)日：1995-02-22
申请号：EP94304726.6
申请日：1994-06-28
发明人： Ayala-Esquilin, Juan , Beaman, Brian Samuel , Haring, Rudolf Adriaan , Hedrick, James Lupton , Shih, Da-Yuan , Walker, George Frederick
IPC分类号： H01B3/46
CPC分类号： H01B3/46 , H01L23/145 , H01L23/5384 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention relates to an improved pinless connector for use in microelectronics having an elastomer resin comprising polysiloxane and filler. In particular the elastomer resin has a tensile strength greater than 170 psi and comprises (i) a crosslinked polysiloxane comprising about 70 to 90 weight % of a crosslinked random copolymer of dimethylsiloxane and diphenylsiloxane and (ii) about 10 to 30 weight % of filler comprising zinc oxide and a lanthanide oxide.
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2.发明授权Method for making an interconnection means for an electronic packaging structure 失效一种用于制造连接结构用于电子封装结构的方法
公开(公告)号：EP0593966B1
公开(公告)日：1998-12-30
申请号：EP93115996.6
申请日：1993-10-04
发明人： Beaman, Brian Samuel , Doany, Fuad Elias , Fogel, Keith Edward , Hedrick Jr., James Lupton , Lauro, Paul Alfred , Norcott, Maurice Heathcote , Ritsko, John James , Shi, Leathen , Shih, Da-Yuan , Walker, George Frederick
IPC分类号： H01L23/538 , H01L25/065
CPC分类号： G01R1/07371 , G01R1/06711 , G01R1/0675 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174 , H01L2924/00 , H01L2924/00014 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
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3.发明公开Three dimensional high performance interconnection package 失效Dreidimensionale Verbindungspackung hoher Leistung。
公开(公告)号：EP0593966A1
公开(公告)日：1994-04-27
申请号：EP93115996.6
申请日：1993-10-04
发明人： Beaman, Brian Samuel , Doany, Fuad Elias , Fogel, Keith Edward , Hedrick Jr., James Lupton , Lauro, Paul Alfred , Norcott, Maurice Heathcote , Ritsko, John James , Shi, Leathen , Shih, Da-Yuan , Walker, George Frederick
IPC分类号： H01L23/538 , H01L25/065
CPC分类号： G01R1/07371 , G01R1/06711 , G01R1/0675 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174 , H01L2924/00 , H01L2924/00014 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： The present invention is directed to a structure (2) for packaging electronic devices, such as semiconductor chips (36, 38), in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies (4, 6). Each assembly is formed from a substrate (8) having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means (49) electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate of each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends (50, 54) of the plurality of conductors in the electrical interconnection means (49) are fabricated so that upon compression between adjacent assemblies (4, 6) there is a wiping action between the conductor ends (e.g. 50) and contact locations (e.g. 30) on the adjacent assemblies to form a good electrical contact therewith.
摘要翻译： 本发明涉及用于以三维结构封装诸如半导体芯片（36,38）的电子器件的结构（2），其允许电信号水平和垂直地传播。 该结构由多个组件（4,6）形成。 每个组件由在多个电子装置的至少一个表面上设置的基板（8）形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连装置（49），电连接每个组件。 电互连装置由弹性插入件形成。 弹性体插入件由具有多个电导体的弹性体材料形成，所述电导体以聚集或非聚集的方式布置。 电互连装置被制造成具有延伸穿过其中的多个孔。 孔阵列对应于基片上的电子器件阵列。 孔和电互连装置设置在电子装置的阵列上，使得电互连装置在相邻的电子装置之间。 组合堆叠被压缩，从而压缩相邻组件之间的电互连装置。 每个组件的基板由诸如金刚石的导热材料形成。 散热装置热连接到基板的边缘以提取结构内产生的热量。 描述了用于制造作为独立弹性片的电互连装置的方法。 电互连装置（49）中的多个导体的端部（50,54）制造成使得在相邻组件（4,6）之间压缩时，在导体端部（例如50）和接触位置之间存在擦拭作用 （例如30）在相邻的组件上以形成与其的良好的电接触。
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公开(公告)号：EP0633579A2
公开(公告)日：1995-01-11
申请号：EP94304726.6
申请日：1994-06-28
发明人： Ayala-Esquilin, Juan , Beaman, Brian Samuel , Haring, Rudolf Adriaan , Hedrick, James Lupton , Shih, Da-Yuan , Walker, George Frederick
IPC分类号： H01B3/46
CPC分类号： H01B3/46 , H01L23/145 , H01L23/5384 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention relates to an improved pinless connector for use in microelectronics having an elastomer resin comprising polysiloxane and filler. In particular the elastomer resin has a tensile strength greater than 170 psi and comprises (i) a crosslinked polysiloxane comprising about 70 to 90 weight % of a crosslinked random copolymer of dimethylsiloxane and diphenylsiloxane and (ii) about 10 to 30 weight % of filler comprising zinc oxide and a lanthanide oxide.
摘要翻译： 本发明涉及一种用于具有包含聚硅氧烷和填料的弹性体树脂的微电子学中的改进的无销连接器。 特别地，弹性体树脂具有大于170psi的拉伸强度并且包含（i）包含约70-90重量％的二甲基硅氧烷和二苯基硅氧烷的交联无规共聚物的交联聚硅氧烷，和（ii）约10-30重量％ 氧化锌和镧系元素氧化物。
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公开(公告)号：EP0299300B1
公开(公告)日：1993-02-03
申请号：EP88110561.3
申请日：1988-07-01
发明人： Barbee, Steven George , Huang, Hung-Chang , Hunt, Donald John , Kim, Jungihl , Park, Jae Myung , Perry, Charles Hampton , Shih, Da-Yuan
IPC分类号： C03C17/22 , C03C17/23 , C04B41/87 , H05K1/03 , H01L23/14 , H01L21/48 , C23C16/30 , C23C14/34
CPC分类号： C04B41/009 , C03C17/225 , C03C17/23 , C03C2217/213 , C03C2217/281 , C03C2218/152 , C03C2218/154 , C04B41/5035 , C04B41/5062 , C04B41/87 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24926 , C04B41/0072 , C04B35/10 , H01L2924/00
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6.发明公开Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate 失效用于将陶瓷输入/输出引脚嵌入陶瓷基板的多层薄膜冶金
公开(公告)号：EP0245697A3
公开(公告)日：1988-11-23
申请号：EP87106178
申请日：1987-04-28
发明人： Arnold, Anthony Francis , Corso, Joseph Alfred , Kapur, Shukla , Lange, Walter Frederick , Shih, Da-Yuan
CPC分类号： H05K3/244 , H01L21/4853 , H01L23/538 , H01L2224/16 , H01L2224/16225 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15192 , H01L2924/15312 , H05K1/0271 , H05K1/0306 , Y10T428/24926
摘要： A multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate is disclosed. A thin adhesion layer (22), which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate (10). A thick stress reducing layer (24) of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer (28) which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is completed by finally depositing a gold layer (30) over the reaction barrier layer.
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公开(公告)号：EP0299300A3
公开(公告)日：1989-10-18
申请号：EP88110561.3
申请日：1988-07-01
发明人： Barbee, Steven George , Huang, Hung-Chang , Hunt, Donald John , Kim, Jungihl , Park, Jae Myung , Perry, Charles Hampton , Shih, Da-Yuan
IPC分类号： C03C17/22 , C03C17/23 , C04B41/87 , H05K1/03 , H01L23/14 , H01L21/48 , C23C16/30 , C23C14/34
CPC分类号： C04B41/009 , C03C17/225 , C03C17/23 , C03C2217/213 , C03C2217/281 , C03C2218/152 , C03C2218/154 , C04B41/5035 , C04B41/5062 , C04B41/87 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24926 , C04B41/0072 , C04B35/10 , H01L2924/00
摘要： The article comprises a sintered ceramic, and an adherent coating of a dielectric material on at least a part of the surface of said ceramic, said coating forming a compressive layer on said part of said ceramic surface. The method for forming e.g. such articles comprises, depositing onto at least a portion of said ceramic article an adherent layer of dielectric material, said layer forming a compressive layer on cooling.
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8.发明公开Article strengthened by a compressive layer and method 失效Durch einezusammendrückendeSchichtverstärkterGegenstand und Verfahren。
公开(公告)号：EP0299300A2
公开(公告)日：1989-01-18
申请号：EP88110561.3
申请日：1988-07-01
发明人： Barbee, Steven George , Huang, Hung-Chang , Hunt, Donald John , Kim, Jungihl , Park, Jae Myung , Perry, Charles Hampton , Shih, Da-Yuan
IPC分类号： C03C17/22 , C03C17/23 , C04B41/87 , H05K1/03 , H01L23/14 , H01L21/48 , C23C16/30 , C23C14/34
CPC分类号： C04B41/009 , C03C17/225 , C03C17/23 , C03C2217/213 , C03C2217/281 , C03C2218/152 , C03C2218/154 , C04B41/5035 , C04B41/5062 , C04B41/87 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24926 , C04B41/0072 , C04B35/10 , H01L2924/00
摘要： The article comprises a sintered ceramic, and an adherent coating of a dielectric material on at least a part of the surface of said ceramic, said coating forming a compressive layer on said part of said ceramic surface.
The method for forming e.g. such articles comprises, depositing onto at least a portion of said ceramic article an adherent layer of dielectric material, said layer forming a compressive layer on cooling.摘要翻译： 所述制品包括烧结陶瓷和在所述陶瓷的至少一部分表面上的介电材料的粘附涂层，所述涂层在所述陶瓷表面的所述部分上形成压缩层。 形成方法 这样的物品包括：在所述陶瓷制品的至少一部分上沉积介电材料的粘附层，所述层在冷却时形成压缩层。
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9.发明公开Zirconium as an adhesion material in a multi-layer wiring substrate 失效Zirkonium als Klebstoff in einem Mehrschicht-Verbindungssubstrat。
公开(公告)号：EP0264134A2
公开(公告)日：1988-04-20
申请号：EP87115097.5
申请日：1987-10-15
CPC分类号： H01L23/49866 , H01L2224/16225 , H01L2924/09701 , H01L2924/15312 , H01L2924/19107 , H05K1/0306 , H05K1/0346 , H05K3/38 , Y10T428/12743 , Y10T428/12806 , Y10T428/12903
摘要： A layer of zirconium (44) can be used as an adhesion layer between a ceramic or polyimide substrate (40) and subsequently applied metallic layers (46,48,50). Following the zirconium layer, copper can be deposited (46) followed by a reaction barrier layer (48) and a wettable surface layer (50) such as gold. This type of structure can be used for pin brazing, chip joining, and/or wire connections.
摘要翻译： 可以将一层锆（44）用作陶瓷或聚酰亚胺基板（40）和随后施加的金属层（46,48,50）之间的粘合层。 在锆层之后，可以沉积铜（46），然后沉积反应阻挡层（48）和可润湿的表面层（50）如金。 这种类型的结构可用于引脚钎焊，芯片接合和/或电线连接。
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公开(公告)号：EP0633579B1
公开(公告)日：1999-04-07
申请号：EP94304726.6
申请日：1994-06-28
发明人： Ayala-Esquilin, Juan , Beaman, Brian Samuel , Haring, Rudolf Adriaan , Hedrick, James Lupton , Shih, Da-Yuan , Walker, George Frederick
IPC分类号： H01B3/46
CPC分类号： H01B3/46 , H01L23/145 , H01L23/5384 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
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