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    WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
    2.
    发明公开
    WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD 有权
    接线板和制造接线板的方法

    公开(公告)号：EP2717658A1

    公开(公告)日：2014-04-09

    申请号：EP12789574.6

    申请日：2012-05-23

    申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

    发明人： OZAKI, Kiminori ,  KOIKE, Yasuhiro ,  ASANO, Hiroaki ,  SATO, Harumitsu ,  WATANABE, Hiroki ,  KACHI, Tadayoshi ,  SUZUKI, Takahiro ,  SHIMADU, Hitoshi ,  FURUTA, Tetsuya ,  MIYAKE, Masao ,  HAYAKAWA, Takahiro ,  ASAI, Tomoaki ,  YAMAUCHI, Ryou

    IPC分类号： H05K1/11 ,  H05K3/40

    CPC分类号： H05K1/11 ,  H05K1/0263 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2203/033 ,  H05K2203/1178 ,  Y10T29/49165

    摘要： An electrically conductive path (50) is configured from a first copper plate (30), a second copper plate (40), and solder (60). The first copper plate (30) has a first bent section (32) extended from a first joining section (31) joined to an electrically insulative board (20) and bent toward the rear surface of the electrically insulative board (20). The second copper plate (40) has a second bent section (42) which is extended from a second joining section (41) joined to the electrically insulative board (20), is bent toward the front surface of the electrically insulative board (20), and is disposed so as to cover, together with the first bent section (32), the inner wall surface of a base-material through-hole (21). Through-holes (43, 44) are provided in the portions of the second copper plate (40) which face the inside of the base-material through-hole (21). Solder (60) is filled between the first bent section (32) and the second bent section (42) including the insides of the through-holes (43, 44). The configuration provides a wiring board and a method for manufacturing a wiring board which are configured so that a large current can be conducted through the electrically conductive path which connects the first copper plate (30) and the second copper plate (40) and that the amount of an electricity conductive material which forms the electrically conduction path can be reduced.

    摘要翻译： 导电路径（50）由第一铜板（30），第二铜板（40）和焊料（60）构成。 第一铜板30具有从接合到电绝缘板20并朝电绝缘板20的后表面弯曲的第一接合部分31延伸的第一弯曲部分32。 第二铜板40具有从与电绝缘板20接合的第二接合部41延伸并朝向电绝缘板20的前表面弯曲的第二弯曲部42， 配置成与第一弯曲部32一起覆盖基材贯通孔21的内壁面。 在第二铜板（40）的与基材贯通孔（21）的内侧相对的部分设有贯通孔（43,44）。 在第一弯曲部分32和包括通孔43,44的内侧的第二弯曲部分42之间填充焊料60。 该结构提供一种布线基板以及布线基板的制造方法，该布线基板以及布线基板的制造方法构成为能够通过连接第一铜板（30）和第二铜板（40）的导电路径传导大电流， 可以减少形成导电路径的导电材料的量。

    SUBSTRATE AND METAL LAYER MANUFACTURING METHOD
    3.
    发明授权
    SUBSTRATE AND METAL LAYER MANUFACTURING METHOD 有权
    基板和金属层制造方法

    公开(公告)号：EP2916625B1

    公开(公告)日：2017-07-05

    申请号：EP13852017.6

    申请日：2013-10-23

    申请人： Kabushiki Kaisha Toyota Jidoshokki

    发明人： OZAKI, Kiminori ,  KOIKE, Yasuhiro ,  ASANO, Hiroaki ,  SHIMADU, Hitoshi ,  KAWAGUCHI, Shigeki ,  ASAI, Tomoaki

    IPC分类号： H05K1/02

    CPC分类号： H05K1/115 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/112 ,  H05K3/4084 ,  H05K2201/066

    摘要： This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

    摘要翻译： 该基板包括具有第一表面和第二表面的绝缘基板以及结合到第一表面的金属板的金属层。 绝缘基板具有通孔。 所述金属层包括：弯曲部分，所述弯曲部分插入所述通孔并从所述第一表面向所述第二表面凸出; 以及位于弯曲部分周围并与第一表面结合的外周部分。 弯曲部分具有位于相对侧上的第一端部和第二端部，并且在第一端部和第二端部处相对于外周部分弯曲。 外周部分分成第一外周部分和第二外周部分，第一外周部分和第二外周部分分别与弯曲部分的第一端和第二端连续。

    MODULE
    5.
    发明公开
    MODULE 审中-公开

    公开(公告)号：EP2916626A1

    公开(公告)日：2015-09-09

    申请号：EP13851712.3

    申请日：2013-10-01

    申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

    发明人： OZAKI, Kiminori ,  KOIKE, Yasuhiro ,  ASANO, Hiroaki ,  SHIMADU, Hitoshi ,  KAWAGUCHI, Shigeki ,  ASAI, Tomoaki

    IPC分类号： H05K1/18 ,  H05K1/14 ,  H05K7/20

    CPC分类号： H05K1/144 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R12/716 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/2072 ,  H05K2203/167 ,  Y02P70/613

    摘要： This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located.

    摘要翻译： 该模块包括：绝缘基板，具有位于彼此相对侧的第一表面和第二表面;第一金属层，设置在绝缘基板的第一表面上并且包括金属板;第二金属层 设置在所述绝缘基板的所述第二表面上的第一电路板，所述第一电路板包括所述绝缘基板，所述第一金属层和所述第二金属层;电子部件，所述电子部件接合到所述第一金属层;以及定位部分， 第一金属层和电子元件之间的接合表面，其中第一金属层和电子元件通过凹凸投影关系彼此接合。 绝缘基板位于第二金属层与定位部所在的第一金属层的一部分之间。

    SUBSTRATE AND METAL LAYER MANUFACTURING METHOD
    6.
    发明公开
    SUBSTRATE AND METAL LAYER MANUFACTURING METHOD 有权
    金属矿产资源基金会（METALLSCHICHTHERSTELLUNGSVERFAHREN）

    公开(公告)号：EP2916625A1

    公开(公告)日：2015-09-09

    申请号：EP13852017.6

    申请日：2013-10-23

    申请人： Kabushiki Kaisha Toyota Jidoshokki

    发明人： OZAKI, Kiminori ,  KOIKE, Yasuhiro ,  ASANO, Hiroaki ,  SHIMADU, Hitoshi ,  KAWAGUCHI, Shigeki ,  ASAI, Tomoaki

    IPC分类号： H05K1/02

    CPC分类号： H05K1/115 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/112 ,  H05K3/4084 ,  H05K2201/066

    摘要： This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

    摘要翻译： 该基板包括具有第一表面和第二表面的绝缘基板和与第一表面结合的金属板的金属层。 绝缘基板具有通孔。 金属层包括：弯曲部分，其穿过通孔插入并从第一表面朝向第二表面凸出; 以及外周部分，其位于弯曲部分周围并且结合到第一表面。 弯曲部具有位于相对侧的第一端和第二端，并且在第一端和第二端处相对于外周部弯曲。 外周部被分成与弯曲部的第一端和第二端分别连续的第一外周部和第二外周部。