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公开(公告)号：EP2099118B1
公开(公告)日：2017-05-03
申请号：EP09003025.5
申请日：2009-03-03
CPC分类号： H02M7/003 , H01G2/06 , H01G9/28 , H01L23/642 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/165 , H01L2224/48 , H01L2224/49433 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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公开(公告)号：EP1533839B1
公开(公告)日：2016-04-27
申请号：EP04024415.4
申请日：2004-10-13
IPC分类号： H01L23/24
CPC分类号： H01L23/24 , H01L23/495 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：EP2099119B1
公开(公告)日：2014-11-19
申请号：EP09003026.3
申请日：2009-03-03
发明人： Nagashima, Takashi , Onishi, Hiroyuki , Nagase, Toshiaki , Ishikawa, Jun , Kontani, Kazuyoshi , Fukatsu, Toshinari
CPC分类号： H02M7/003 , H01L23/642 , H01L24/73 , H01L25/072 , H01L25/165 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/00012 , H01L2924/00
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公开(公告)号：EP2124325A3
公开(公告)日：2014-09-10
申请号：EP09004350.6
申请日：2009-03-26
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K7/1432 , H01L2924/00014 , H01L2924/00
摘要： A power converter includes a switching device composed of parallel-connected semiconductor chips evenly divided into two groups. The power converter includes a positive conductor, a capacitor and an output electrode. The positive conductor includes first and second terminal portions. The output electrode includes an end portion joined to a base portion having first and second connecting portions. The output electrode is formed so as to reduce or cancel a difference existing between an inductance L1 of a current path from a positive terminal of the capacitor to the first terminal portion and an inductance L2 of a current path from the positive terminal to the second terminal portion, by providing a difference between an inductance L3 of a current path from the first connecting portion to the end portion and an inductance L4 of a current path from the second connecting portion to the end portion.
摘要翻译： 功率转换器包括由均匀分成两组的并联连接的半导体芯片构成的开关器件。 功率转换器包括正导体，电容器和输出电极。 正导体包括第一和第二端子部分。 输出电极包括接合到具有第一和第二连接部分的基部的端部。 输出电极形成为减小或消除从电容器的正端子到第一端子部分的电流路径的电感L1与从正端子到第二端子的电流路径的电感L2之间存在的差异 通过提供从第一连接部分到端部分的电流路径的电感L3与从第二连接部分到端部分的电流路径的电感L4之间的差值。
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公开(公告)号：EP1722413A3
公开(公告)日：2013-05-08
申请号：EP06113040.7
申请日：2006-04-25
IPC分类号： H01L23/482 , H01L23/485 , H01G4/228 , H02M7/00 , H01L25/07
CPC分类号： H01L25/072 , H01G4/228 , H01L23/645 , H01L2924/0002 , H02M7/003 , H01L2924/00
摘要： A first wiring member and a second wiring member, through which currents flow in directions opposite to each other, each have a flat plate shape and are arranged to be adjacent and opposed to each other, to thereby reduce inductances of the first wiring member and the second wiring member due to an effect of a mutual inductance. A joint of the first wiring member and a joint of the second wiring member are joined to the positive terminal and the negative terminal of the semiconductor device through ultrasonic bonding, respectively. As a result, the joint of the first wiring member and the joint of the second wiring member are not required to be provided with exclusive portions for screw mounting unlike a conventional manner, so each of the joints can have a small area, to thereby making it possible to reduce inductances of the first wiring member and the second wiring member.
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公开(公告)号：EP1028465B1
公开(公告)日：2007-01-03
申请号：EP00102456.1
申请日：2000-02-04
IPC分类号： H01L25/07
CPC分类号： H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/05553 , H01L2224/05599 , H01L2224/0603 , H01L2224/45124 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49176 , H01L2224/85399 , H01L2924/01005 , H01L2924/01013 , H01L2924/01057 , H01L2924/13091 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A plurality of MOS transistors are arranged on the top surface of a conductor substrate which is a drain electrode. The drain contact of each MOS transistor is connected to the conductor substrate. The source contact of each MOS transistor is connected to the output conductor path which is a source electrode through a bonding wire. The gate contact of each MOS transistor is connected to a drive signal conductor path which is a gate electrode through a bonding wire. The source contacts of the MOS transistors are interconnected through a bridge electrode and a bonding wire.
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公开(公告)号：EP2897275B1
公开(公告)日：2019-01-02
申请号：EP15150598.9
申请日：2015-01-09
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公开(公告)号：EP2897275A2
公开(公告)日：2015-07-22
申请号：EP15150598.9
申请日：2015-01-09
CPC分类号： H01L25/165 , H01L23/053 , H01L25/0655 , H01L2924/0002 , H01L2924/1011 , H02M7/003 , H05K1/0265 , H05K1/181 , H05K7/1432 , H01L2924/00
摘要： A plurality of arm elements is arrayed along a first direction of a substrate. Each arm element includes a plurality of semiconductor elements connected in parallel. Each arm element is configured such that a plurality of semiconductor elements is arrayed along a second direction of the substrate which is perpendicular to the first direction and separated into a first element group and a second element group. The substrate includes a first region where the semiconductor element included in the first element group is arranged and a second region where the semiconductor element included in the second element group is arranged, and the first region and the second region are separated along the second direction. An input electrode unit and an output electrode unit are arranged along the first direction in a region provided between the first region and the second region on the substrate.
摘要翻译： 多个臂元件沿衬底的第一方向排列。 每个臂元件包括并联连接的多个半导体元件。 每个臂元件被构造成使得沿着垂直于第一方向的衬底的第二方向排列多个半导体元件并将其分离成第一元件组和第二元件组。 衬底包括布置包括在第一元件组中的半导体元件的第一区域和布置有包括在第二元件组中的半导体元件的第二区域，并且第一区域和第二区域沿着第二方向分离。 输入电极单元和输出电极单元沿着第一方向布置在设置在基板上的第一区域和第二区域之间的区域中。
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公开(公告)号：EP1722413B1
公开(公告)日：2015-03-04
申请号：EP06113040.7
申请日：2006-04-25
IPC分类号： H01L23/482 , H01L23/485 , H01G4/228 , H02M7/00 , H01L25/07
CPC分类号： H01L25/072 , H01G4/228 , H01L23/645 , H01L2924/0002 , H02M7/003 , H01L2924/00
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公开(公告)号：EP1533839A3
公开(公告)日：2011-09-07
申请号：EP04024415.4
申请日：2004-10-13
IPC分类号： H01L23/24
CPC分类号： H01L23/24 , H01L23/495 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes larger at a cavity in the first electrode, the rising motion of the gel stops at the level of the cavity. More specifically, the gel is prevented from reaching portions of the first electrode and a second electrode for connection with external terminals. Further, since the rising motion of the gel can be prevented by the cavity, the first electrode and the second electrode can be arranged in a close relationship with each other.
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