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公开(公告)号：EP2703449B1
公开(公告)日：2016-06-29
申请号：EP11873964.8
申请日：2011-12-08
发明人： YI, Qingfeng , JIANG, Sujun , MAI, Jiehong , JIANG, Zhingqiang , LONG, Jieming , YAN, Xia , NING, Kaijun , CAI, Tongmin
CPC分类号： C08K13/04 , C08K3/22 , C08K7/04 , C08K7/14 , C08K2003/2241 , C08K2003/2296 , H01L33/60 , C08L77/06
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2.发明公开HEAT RESISTANT POLYAMIDE COMPOSITION AND APPLICATION THEREOF 有权HITZEBESTÄNDIGEPOLYAMIDZUSAMMENSETZUNG UND IHRE VERWENDUNG
公开(公告)号：EP2703449A1
公开(公告)日：2014-03-05
申请号：EP11873964.8
申请日：2011-12-08
发明人： YI, Qingfeng , JIANG, Sujun , MAI, Jiehong , JIANG, Zhingqiang , LONG, Jieming , YAN, Xia , NING, Kaijun , CAI, Tongmin
CPC分类号： C08K13/04 , C08K3/22 , C08K7/04 , C08K7/14 , C08K2003/2241 , C08K2003/2296 , H01L33/60 , C08L77/06
摘要： The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.
摘要翻译： 本发明公开了耐热性聚酰胺组合物及其应用。 该组合物包含以下重量百分比的组分：40％至90％的耐热聚酰胺树脂，5％至35％的矿物纤维A，0至35％的矿物填料B，0.1％至1％的光稳定剂 ，0.1％〜1％的流动改性剂和0.1％〜1％的抗氧化剂。 在本发明中，选择具有0.1〜0.8的胺封端基和羧基封端基的比例的耐热聚酰胺树脂与长宽比为2〜6的变形玻璃纤维匹配，矿物填料B和 流动改性剂以获得耐热聚酰胺组合物。 耐热性聚酰胺组合物不仅具有高的初始白度，高反射率和优异的耐热性，而且具有良好的成型性和良好的尺寸稳定性; 因此，耐热性聚酰胺组合物能够用于准备用于诸如便携式电话，计算机，电视机等的LCD背光源的这种光源的反射支撑，以及汽车，仪表板和照明器具的前灯， 等等
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3.发明公开HALOGEN-FREE FIRE-RETARDANT POLYAMIDE COMPOSITION, AND PREPARATION METHOD AND APPLICATION THEREOF 审中-公开HALOGENFREIE FEUERFESTE POLYAMIDZUSAMMENSETZUNG SOWIE HERSTELLUNGSVERFAHRENDAFÜRUND ANWENDUNG DAVON
公开(公告)号：EP2813549A1
公开(公告)日：2014-12-17
申请号：EP12865375.5
申请日：2012-01-09
发明人： LONG, Jieming , JIANG, Sujun , YI, Qingfeng , YAN, Xia , MAI, Jiehong , CHEN, Jian , NING, Kaijun , CAI, Tongmin
IPC分类号： C08L77/06 , C08K5/5313 , C08K3/00
CPC分类号： C08K5/5313 , C08K3/013 , C08K7/14 , C08K2201/019 , C08L77/00
摘要： Disclosed are a halogen-free fire-retardant polyamide composition, and a preparation method and application thereof. The halogen-free fire-retardant polyamide composition is prepared from 35 to 71.5% of a semi-aromatic polyamide, 10 to 35% of a fire retardant and 0 to 50% of an inorganic reinforcing filler, the terminal amino group content of the semi-aromatic polyamide being 80 to 150 mol/t. The halogen-free fire-retardant polyamide composition of the present invention has good heat stability and releases only a small amount of gas in production; mold dirt is not easily formed, and the halogen-free fire-retardant polyamide composition can be produced continuously.
摘要翻译： 公开了一种无卤阻燃聚酰胺组合物及其制备方法和应用。 无卤阻燃聚酰胺组合物由半芳族聚酰胺的35〜71.5％，阻燃剂的10〜35％，无机增强填料的0〜50％的半固态成分制成，半 - 芳族聚酰胺为80〜150mol / t。 本发明的无卤阻燃聚酰胺组合物具有良好的热稳定性，并且在生产中仅释放少量气体; 模具污垢不容易形成，并且可以连续生产无卤阻燃聚酰胺组合物。
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公开(公告)号：EP4386050A1
公开(公告)日：2024-06-19
申请号：EP22869104.4
申请日：2022-09-08
发明人： YAN, Kun , XU, Xianjun , JIANG, Sujun , CAO, Min , MAI, Jiehong , YANG, Huixin , JIANG, Zhiqiang
摘要： The present invention relates to a polyester resin composition, a preparation method thereof and use thereof. The polyester resin composition includes a PCT resin, a white pigment, a reinforcing material, a polyester elastomer, and other additives. The polyester resin composition provided by the present invention has a strong binding force with a silica gel; when the polyester resin composition is made into an LED reflecting support, the LED reflecting support is not easy to separate from the silica gel in high temperature and high humidity environments, such that the service life of an LED lamp bead can be effectively prolonged; and meanwhile, the polyester resin composition has good toughness, and would not cause the problem of powder falling under repeated stress.
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5.发明公开
公开(公告)号：EP4386052A1
公开(公告)日：2024-06-19
申请号：EP22869311.5
申请日：2022-09-15
发明人： YANG, Huixin , HUANG, Xianbo , MAI, Jiehong , JIANG, Sujun , JIANG, Zhiqiang , YAN, Kun , LI, Jianwei , XU, Xianjun
摘要： The present invention provides a semi-aromatic polyamide molding composite material that can be used for producing an LED display screen light source reflection support. Generally, by selecting a semi-aromatic polyamide resin having a specific repeating unit, and enabling the crystallization peak width at half maximum ΔT1/2 to be 4-11°C, the whiteness to be less than 26.5, the reflectivity under a 460 nm light source to be less than 6% etc., the semi-aromatic polyamide molding composite material has the advantages of reduced blue light, high contrast ratio and high gray scale, and can meet requirements for the packaging process and long-term reliability. The package product can be used for manufacturing high-contrast LED display screen light source refection supports for use in multiple environments.
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6.发明公开
公开(公告)号：EP3375821A1
公开(公告)日：2018-09-19
申请号：EP17809166.6
申请日：2017-06-09
发明人： ZHANG, Chuanhui , CAO, Min , JIANG, Sujun , HUANG, Xianbo , MAI, Jiehong , LONG, Jieming , SHI, Zhenguo , YAN, Kun , FAN, Liming
IPC分类号： C08L77/06
CPC分类号： C08K2201/004 , C08K2201/016 , C08L77/06 , C08L2205/025 , C08L2205/03
摘要： The present invention discloses a semiaromatic polyamide resin, a preparation method thereof, and a polyamide molding composition consisting of the same, which consists of following components:
(A) 20 to 95 wt% of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and
(B) 5 to 80 wt% of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid.
Particularly, (A) + (B) =100 wt%.
In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.-
7.发明公开
公开(公告)号：EP4406992A1
公开(公告)日：2024-07-31
申请号：EP22871866.4
申请日：2022-09-15
发明人： YAN, Kun , XU, Xianjun , JIANG, Sujun , CAO, Min , MAI, Jiehong , YANG, Huixin , JIANG, Zhiqiang
IPC分类号： C08G69/40 , C08K7/14 , C08K5/5313 , C08K5/3492 , C08L77/06
摘要： Disclosed is a furan diacid-based polyamide resin, which is derived from the following repeating units: (A) 2,5-furandicarboxylic acid, (B) 1,4-cyclohexanedicarboxylic acid, and (C) 1,10-decanediamine, where based on the total molar percentage of the diacid units, (A) accounts for 5-45 mol% of the diacid units. On one hand, by selecting the bio-based 2,5-furandicarboxylic acid, the resin is more environmentally friendly, and has the advantages of a melting point of 290-336°C , low water absorption rate, and good size stability (a water absorption rate lower than that of a polyamide with the same amido bond density); on the other hand, the rigidity of cyclohexane is higher than that of an aromatic ring, such that more hard carbon layers can be formed during combustion. In addition, the furan diacid-based polyamide has a relatively high amido bond density, and can generate a relatively excellent synergistic effect with a flame retardant, such that the flame retardant effect is excellent under the synergistic effect of the two.
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8.发明公开
公开(公告)号：EP4403605A1
公开(公告)日：2024-07-24
申请号：EP22869310.7
申请日：2022-09-15
发明人： YANG, Huixin , HUANG, Xianbo , MAI, Jiehong , JIANG, Sujun , JIANG, Zhiqiang , YAN, Kun , LI, Jianwei , XU, Xianjun
摘要： The present invention provides a PA10T molding composite material that can be used to produce LED display light source reflection supports. The width of the crystallization peak at half height ΔT1/2 is adjusted to 3°C-10°C, the whiteness is adjusted to be less than 26, and the 460 nm light source reflectivity is adjusted to be less than 6.5%, such that the PA10T molding compound has the advantages of low blue light, high contrast, and high grayscale, can satisfy requirements of a packaging process and long-term reliability, and can be used as a packaging product to manufacture high-contrast LED display light source reflection supports applicable in multiple scenarios.
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