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    PACKAGE FOR ACCOMMODATING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
    1.
    发明公开
    PACKAGE FOR ACCOMMODATING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP4325656A1

    公开(公告)日：2024-02-21

    申请号：EP22788101.8

    申请日：2022-04-05

    Applicant: Kyocera Corporation

    Inventor： SHIRASAKI, Takayuki

    IPC: H01P5/08 ,  H01P5/02

    Abstract: A signal line includes, in order from a coaxial line side, a first section, a second section, and a third section. A width of a signal conductor in the second section is constant, is less than or equal to a width of the signal conductor in the first section, and is greater than a width of the signal conductor in a center portion of the third section. A distance between the signal conductor and each first ground conductor is constant in the second section, is less than the distance in the first section, and is greater than the distance in the center portion of the third section. The second section has a length of from 1/3 times to 3/2 times a distance H between the signal conductor and a second ground conductor on a side opposite to the coaxial line from a position at which a distal end portion of a pin terminal is present as viewed in a direction perpendicular to a first surface.

    ELECTRONIC ELEMENT STORING PACKAGE AND ELECTRONIC DEVICE
    4.
    发明公开
    ELECTRONIC ELEMENT STORING PACKAGE AND ELECTRONIC DEVICE 审中-实审

    公开(公告)号：EP4369514A1

    公开(公告)日：2024-05-15

    申请号：EP22837754.5

    申请日：2022-07-08

    Applicant: Kyocera Corporation

    Inventor： SHIRASAKI, Takayuki

    IPC: H01P5/08 ,  H01L23/04

    CPC classification number: H01P5/08 ,  H01L23/04

    Abstract: A coaxial line includes a central conductor long in one direction, an outer peripheral conductor, and a dielectric located therebetween and having a first end face facing a transmission line. A wall body includes an opening leading to the first end face and including an annular space contacting the first end face. An outer diameter of the annular space is larger than that of a space opposite the first end face in the opening. The central conductor includes a first section having a first thickness and at least partially projecting from the first end face and a second section having a second thickness smaller than the first thickness and located within the dielectric; an end of the first section on an anti-projection side is located between the first end face and a specific position within the dielectric in a longitudinal direction of the central conductor. The specific position is a position separated from the first end face toward the inside of the dielectric by 1/8 of an effective wavelength of a transmission signal.

    HIGH FREQUENCY MODULE AND WIRING BOARD
    5.
    发明公开
    HIGH FREQUENCY MODULE AND WIRING BOARD 审中-公开
    HOCHFREQUENZMODUL UND LEI​​TERPLATTE

    公开(公告)号：EP2211419A1

    公开(公告)日：2010-07-28

    申请号：EP08833130.1

    申请日：2008-09-29

    Applicant: Kyocera Corporation

    Inventor： SUGIMOTO, Yoshimasa ,  SHIRASAKI, Takayuki

    IPC: H01P5/107 ,  H01P1/04

    CPC classification number: H01P5/107

    Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furhermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.

    Abstract translation: 高频模块具有布线基板，其包括电介质基板，形成在电介质基板的第一表面上的线路导体和形成在与电介质的第一表面相对的第二表面上的第一接地导体层 基板，并且具有设置在第一开口周围的第一开口和第二开口; 并且连接到第二表面的波导具有与第一开口相对的开口，并且与线路导体电磁耦合。 布线板具有垂直的扼流部分，其在垂直于第二表面的方向上从第二开口至少部分地延伸。 此外，沿着波导的开口和第二开口之间的第二表面，在布线板和波导之间形成水平的扼流部。

    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME
    7.
    发明授权
    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME 有权

    公开(公告)号：EP3041040B1

    公开(公告)日：2018-06-13

    申请号：EP14840234.0

    申请日：2014-08-27

    Applicant: Kyocera Corporation

    Inventor： SHIRASAKI, Takayuki

    IPC: H01L23/02 ,  H01L23/057

    CPC classification number: H05K7/1427 ,  H01L23/057 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is an element housing package that can suppress a deterioration in the connection reliability of a wiring base plate and a connector. An element housing package (3) of the present invention is provided with: a base plate (31) including, on a top surface (31a), a mounting region (31b) for mounting an element (2); a frame body (32) disposed on the top surface (31a) of the base plate (31) so as to surround the mounting region (31b), the frame body (32) including a through-hole (T); a connector (33) disposed so as to pass through the through-hole T of the frame body (32) and to extend from the inside to the outside of the frame body (32); a pedestal member (34) disposed on the top surface (31a) of the base plate (31) so as to be positioned in the frame body (32); and a wiring base plate (35) bonded to a top surface (34a) of the pedestal member (34) with a first bonding material (B1) placed therebetween and connected to the connector (33). In a longitudinal section along the through direction of the through-hole (T), a thickness of the frame body (32) along the through direction is greater than a thickness of the base plate (31). In the longitudinal section along the through direction of the through-holes (T), a width of the pedestal member (34) is greater than a height of the pedestal member (34). A side surface (34c) of the pedestal member (34) is bonded to an inner surface (32b) of the frame body (32) with a second bonding member (B2) placed therebetween, while a bottom surface (34b) of the pedestal member (34) is not bonded to the top surface (31a) of the base plate (31).

    SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
    8.
    发明公开
    SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：EP3493252A1

    公开(公告)日：2019-06-05

    申请号：EP17834215.0

    申请日：2017-07-24

    Applicant: KYOCERA Corporation

    Inventor： KIMURA, Taito ,  SHIRASAKI, Takayuki

    IPC: H01L23/12 ,  H05K3/46

    Abstract: A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor. The first substrate includes a mount area and a peripheral area. The second substrate is located in the peripheral area to align with an outer edge of the first substrate and surrounds the mount area. The signal line extends on an upper surface of the second substrate from an inner edge to an outer edge of the second substrate. The groove extends on a side surface of the first substrate from a lower surface to an upper surface of the first substrate. The feedthrough conductor is inside the second substrate and connected to the signal line. The side conductor is on an inner surface of the groove and electrically connected to the feedthrough conductor. The groove is inward from the outer edge of the second substrate.

    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME
    9.
    发明公开
    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME 有权
    用于包装外壳部件和组装结构，

    公开(公告)号：EP3041040A1

    公开(公告)日：2016-07-06

    申请号：EP14840234.0

    申请日：2014-08-27

    Applicant: Kyocera Corporation

    Inventor： SHIRASAKI, Takayuki

    IPC: H01L23/02

    CPC classification number: H05K7/1427 ,  H01L23/057 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is an element housing package that can suppress a deterioration in the connection reliability of a wiring base plate and a connector. An element housing package (3) of the present invention is provided with: a base plate (31) including, on a top surface (31a), a mounting region (31b) for mounting an element (2); a frame body (32) disposed on the top surface (31a) of the base plate (31) so as to surround the mounting region (31b), the frame body (32) including a through-hole (T); a connector (33) disposed so as to pass through the through-hole T of the frame body (32) and to extend from the inside to the outside of the frame body (32); a pedestal member (34) disposed on the top surface (31a) of the base plate (31) so as to be positioned in the frame body (32); and a wiring base plate (35) bonded to a top surface (34a) of the pedestal member (34) with a first bonding material (B1) placed therebetween and connected to the connector (33). In a longitudinal section along the through direction of the through-hole (T), a thickness of the frame body (32) along the through direction is greater than a thickness of the base plate (31). In the longitudinal section along the through direction of the through-holes (T), a width of the pedestal member (34) is greater than a height of the pedestal member (34). A side surface (34c) of the pedestal member (34) is bonded to an inner surface (32b) of the frame body (32) with a second bonding member (B2) placed therebetween, while a bottom surface (34b) of the pedestal member (34) is not bonded to the top surface (31a) of the base plate (31).

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