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1.发明授权
公开(公告)号：EP2822049B1
公开(公告)日：2016-11-02
申请号：EP13755907.6
申请日：2013-02-19
摘要： The present invention provides a thermoelectric conversion material having a low thermal conductivity and having an improved figure of merit, and a method for producing it. The thermoelectric conversion material has, as formed on a substrate having a nano-level microporous nanostructure, a thermoelectric semiconductor layer prepared by forming a thermoelectric semiconductor material into a film, wherein the substrate is a block copolymer substrate formed of a block copolymer that comprises a polymethyl methacrylate unit and a polyhedral oligomeric silsesquioxane-containing polymethacrylate unit, and the thermoelectric semiconductor material is a p-type bismuth telluride or an n-type bismuth telluride. The production method comprises a substrate formation step of forming the nanostructure-having block copolymer substrate, and a film formation step of forming a p-type bismuth telluride or an n-type bismuth telluride into a film to thereby provide a thermoelectric semiconductor layer.
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2.发明公开
公开(公告)号：EP2822049A1
公开(公告)日：2015-01-07
申请号：EP13755907.6
申请日：2013-02-19
摘要： The present invention provides a thermoelectric conversion material having a low thermal conductivity and having an improved figure of merit, and a method for producing it. The thermoelectric conversion material has, as formed on a substrate having a nano-level microporous nanostructure, a thermoelectric semiconductor layer prepared by forming a thermoelectric semiconductor material into a film, wherein the substrate is a block copolymer substrate formed of a block copolymer that comprises a polymethyl methacrylate unit and a polyhedral oligomeric silsesquioxane-containing polymethacrylate unit, and the thermoelectric semiconductor material is a p-type bismuth telluride or an n-type bismuth telluride. The production method comprises a substrate formation step of forming the nanostructure-having block copolymer substrate, and a film formation step of forming a p-type bismuth telluride or an n-type bismuth telluride into a film to thereby provide a thermoelectric semiconductor layer.
摘要翻译： 本发明提供了具有低的热导率和具有改进的品质因数，以及用于制造它的方法的热电转换材料。 的热电转换材料具有作为形成在具有纳米级微孔纳米结构的衬底，通过形成的热电半导体材料为膜，worin的衬底上制备的热电半导体层中形成嵌段共聚物的嵌段共聚物的基板那样包括 聚甲基丙烯酸甲酯单元和多面体低聚倍半硅氧烷包含-聚甲基丙烯酸酯单元，和上述热电半导体材料是p型碲化铋或n型碲化铋。 的制造方法，包括形成具有纳米结构的嵌段共聚物的基板的基板形成工序和形成p型碲化铋或n型碲化铋为膜，从而提供一种热电半导体层的膜形成步骤。
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公开(公告)号：EP3240053A1
公开(公告)日：2017-11-01
申请号：EP15873183.6
申请日：2015-12-24
申请人： Lintec Corporation
摘要： To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.
摘要翻译： 提供具有优异的热电性能和柔性并且可以以低成本容易地制造的珀尔帖冷却元件。 一种珀尔帖冷却元件，其含有热电转换材料和含有热电转换材料的方法，所述热电转换材料含有其上具有含热电半导体微细颗粒的热电半导体组合物，耐热树脂和离子液体的热电半导体组合物的薄膜的载体， 所述热电半导体组合物包含热电半导体组合物，所述热电半导体组合物包含其上具有含热电半导体组合物的薄膜，耐热树脂和离子液体的薄膜，所述方法包括：涂布包含热电半导体细颗粒，耐热树脂 和离子液体在支持体上并干燥以形成薄膜; 并对该薄膜进行退火处理。
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4.发明公开HEAT-CONDUCTIVE ADHESIVE SHEET, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC DEVICE USING SAME 有权WLERELETENDE KLEBEFOLIE，HERSTELLUNGSVERFAHRENDAFÜRUND ELEKTRONISCHE VORRICHTUNG DAMIT
公开(公告)号：EP3035397A1
公开(公告)日：2016-06-22
申请号：EP14848730.9
申请日：2014-09-24
申请人： Lintec Corporation
发明人： KATO, Kunihisa , MORITA, Wataru , MUTOU, Tsuyoshi
IPC分类号： H01L35/30 , C09J7/02 , C09J183/04 , C09J201/00 , H01L35/32 , H01L35/34 , H02N11/00
CPC分类号： C09J9/02 , C08K3/04 , C08K3/041 , C08K3/042 , C08K3/046 , C08K3/22 , C08K3/28 , C08K3/38 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C09J7/22 , C09J2201/122 , C09J2201/602 , C09J2203/326 , C09J2205/106 , C09J2483/00 , H01L35/02 , H01L35/32
摘要： The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a base material comprising a high thermally conductive portion and a low thermally conductive portion; and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material, and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.
摘要翻译： 本发明提供一种可以层压在电子设备上的导热粘合片，以有效地散热并选择性地在特定方向上散热以向电子设备的内部提供足够的温差，其制造方法 ，以及使用该装置的电子装置。 本发明包括一种导热粘合片，它包括一个包含高导热部分和低导热部分的基材; 以及粘合剂层，其中所述粘合剂层层压在所述基材的一个面上，并且所述基材的另一个面由与所述粘合剂层接触的面相对的所述低导热部的面和 高导热部分与与粘合剂层接触的面相对的面，或者高导热部或低导热部中的至少一个构成基材厚度的一部分， 导热性粘合片，以及使用导热性粘合片的电子装置。
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5.发明公开HEAT-CONDUCTIVE ADHESIVE SHEET, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC DEVICE USING SAME 审中-公开导热胶粘片，其制造方法以及使用该导电胶片的电子装置
公开(公告)号：EP3035396A1
公开(公告)日：2016-06-22
申请号：EP14848514.7
申请日：2014-09-24
申请人： Lintec Corporation
发明人： MORITA, Wataru , KATO, Kunihisa , MUTOU, Tsuyoshi
IPC分类号： H01L35/30 , C09J7/00 , C09J9/00 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , H01L35/32 , H01L35/34 , H02N11/00
CPC分类号： C09J7/00 , C08G18/6229 , C08G18/6254 , C08G18/8116 , C08K3/08 , C08K3/22 , C08K3/28 , C08K2003/385 , C08K2201/001 , C09J7/10 , C09J9/00 , C09J9/02 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , C09J2201/40 , C09J2203/326 , C09J2205/102 , C09J2475/00 , C09J2483/00 , H01L35/30 , H01L35/32 , H01L35/34
摘要： The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.
摘要翻译： 本发明提供一种导热性粘接片，其能够容易地层叠在电子器件上而不需要粘接剂层，并且能够进一步选择性地使热量向特定的方向散热，对电子器件的内部赋予充分的温度差， 生产该产品和使用该产品的电子设备。 本发明包括导热粘合片，其包括高导热部分和低导热部分，其中高导热部分和低导热部分具有粘合性，并且高导热部分和低导热部分各自 独立地构成导热粘合片的整个厚度，或者至少高导热部分或低导热部分构成导热粘合片的厚度的一部分，以及用于制造导热粘合片的方法 以及使用该导热性粘合片的电子设备。
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6.发明授权
公开(公告)号：EP2634778B1
公开(公告)日：2019-04-24
申请号：EP11835915.7
申请日：2011-07-20
申请人： LINTEC Corporation
发明人： KATO, Kunihisa , MUTO, Tsuyoshi , UEMURA, Kazue , NAKAJIMA, Emi
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7.发明公开CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, POSITIVE ELECTRODE LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 有权ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR DEREN HERSTELLUNG
公开(公告)号：EP2623574A1
公开(公告)日：2013-08-07
申请号：EP11828586.5
申请日：2011-07-20
申请人： LINTEC Corporation
发明人： KATO, Kunihisa , MUTO, Tsuyoshi , NAKAJIMA, Emi
IPC分类号： C09J157/00 , C09J9/02 , C09J11/00 , C09J129/04 , C09J139/06 , C09J179/00 , H01B1/12 , H01L51/42
CPC分类号： H01L51/441 , C08G2261/3221 , C08G2261/3223 , C08K5/053 , C08K5/20 , C08K5/3415 , C08K5/41 , C08L29/04 , C08L33/02 , C08L39/06 , C08L65/00 , C08L79/00 , C08L81/00 , C08L2203/204 , C08L2205/03 , C09D165/00 , C09J9/02 , C09J11/06 , C09J11/08 , C09J125/18 , C09J129/04 , C09J133/04 , C09J139/06 , C09J165/00 , C09J179/02 , H01B1/127 , H01B1/128 , H01L51/0024 , H01L51/5056 , H01L51/5203 , Y10T428/2804
摘要： The present invention provides a conductive adhesive composition having excellent adhesiveness and low surface resistance and capable of being used as a buffer layer of an electronic device.
The conductive adhesive composition according to the present invention includes (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, wherein the organic additive (B) is at least one member selected from water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected from polyanilines, polypyrroles, polythiophenes, and derivatives thereof. In addition, the present invention provides an electronic device having a conductive layer composed of the foregoing conductive adhesive composition, a cathodic laminate having a conductive layer composed of the foregoing conductive adhesive composition laminated therein, and a method for manufacturing the same electronic device.摘要翻译： 本发明提供具有优异的粘合性和低表面电阻的导电粘合剂组合物，并且能够用作电子器件的缓冲层。 根据本发明的导电粘合剂组合物包括（A）水溶性聚乙烯基聚合物，（B）有机添加剂和（C）导电有机聚合物化合物，其中有机添加剂（B）选自至少一种 来自水溶性多元醇，水溶性吡咯烷酮和亲水性非质子传递溶剂，导电性有机高分子化合物（C）为选自聚苯胺，聚吡咯，聚噻吩及其衍生物中的至少一种。 此外，本发明提供一种具有由上述导电性粘合剂组合物构成的导电层的电子器件，具有由上述导电性粘合剂组合物构成的导电层的阴极层叠体及其制造方法。
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公开(公告)号：EP2830106B1
公开(公告)日：2018-05-02
申请号：EP13765181.6
申请日：2013-03-11
发明人： KATO, Kunihisa , MUTOU, Tsuyoshi , MIYAZAKI, Koji
摘要： The present invention provides a thermoelectric conversion material excellent in thermoelectric performance and flexibility and capable of being produced in a simplified manner and at a low cost, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer, and the method for producing a thermoelectric conversion material includes a step of applying the thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer onto the support and drying it to form a thin film thereon.
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公开(公告)号：EP2623574B1
公开(公告)日：2016-06-15
申请号：EP11828586.5
申请日：2011-07-20
申请人： LINTEC Corporation
发明人： KATO, Kunihisa , MUTO, Tsuyoshi , NAKAJIMA, Emi
IPC分类号： C09J9/02 , C09J11/06 , C09J129/04 , C09J133/02 , H01B1/12 , H01L51/42
CPC分类号： H01L51/441 , C08G2261/3221 , C08G2261/3223 , C08K5/053 , C08K5/20 , C08K5/3415 , C08K5/41 , C08L29/04 , C08L33/02 , C08L39/06 , C08L65/00 , C08L79/00 , C08L81/00 , C08L2203/204 , C08L2205/03 , C09D165/00 , C09J9/02 , C09J11/06 , C09J11/08 , C09J125/18 , C09J129/04 , C09J133/04 , C09J139/06 , C09J165/00 , C09J179/02 , H01B1/127 , H01B1/128 , H01L51/0024 , H01L51/5056 , H01L51/5203 , Y10T428/2804
摘要： The present invention provides a conductive adhesive composition having excellent adhesiveness and low surface resistance and capable of being used as a buffer layer of an electronic device. The conductive adhesive composition according to the present invention includes (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, wherein the organic additive (B) is at least one member selected from water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected from polyanilines, polypyrroles, polythiophenes, and derivatives thereof. In addition, the present invention provides an electronic device having a conductive layer composed of the foregoing conductive adhesive composition, a cathodic laminate having a conductive layer composed of the foregoing conductive adhesive composition laminated therein, and a method for manufacturing the same electronic device.
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10.发明公开THERMOELECTRIC CONVERSION MATERIAL, METHOD FOR PRODUCING SAME, AND THERMOELECTRIC CONVERSION MODULE 有权热敏电阻UMWANDLUNGSMATERIAL，VERFAHREN ZUR HERSTELLUNG DAVON UND THERMOELEKTRISCHES WANDLERMODUL
公开(公告)号：EP2963694A1
公开(公告)日：2016-01-06
申请号：EP14756698.8
申请日：2014-02-18
发明人： KATO, Kunihisa , MUTOU, Tsuyoshi , MIYAZAKI, Koji , HARADA, Aiko
摘要： The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.
摘要翻译： 本发明提供一种具有低导热性和改善的品质因数的热电转换材料和该材料的制造方法，并且还提供一种热电转换模块。 热电转换材料在具有微小孔的多孔基材上具有由热电半导体材料形成的热电半导体层，其中，多孔基材在塑料膜（A）上具有聚合物层（B），微细孔形成在 聚合物层（B）和塑料膜（A）的一部分。 热电转换材料的制造方法包括：形成包括步骤1，工序2和工序3的多孔质基材的基板形成步骤，其包括通过成膜热电半导体形成热电半导体层的成膜工序 多孔基材上的材料。 热电转换模块使用热电转换材料。
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