公开(公告)号：EP2980177A1

公开(公告)日：2016-02-03

申请号：EP14776419.5

申请日：2014-03-17

申请人： Lintec Corporation

发明人： YAMAGISHI Masanori

IPC分类号： C09J7/02 ,  B32B27/00 ,  B60C19/00 ,  C09J7/04 ,  C09J201/00

CPC分类号： B60C13/001 ,  B32B3/00 ,  B32B3/14 ,  B32B7/00 ,  B32B7/02 ,  B32B7/12 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/10 ,  B32B27/28 ,  B32B27/32 ,  B32B27/36 ,  B32B29/00 ,  B32B2250/00 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/50 ,  B32B2307/544 ,  B32B2307/546 ,  B32B2307/70 ,  B32B2307/732 ,  B32B2405/00 ,  B32B2519/00 ,  B32B2605/00 ,  B32B2605/08 ,  C09J7/29 ,  C09J2400/226 ,  C09J2400/283

摘要： Provided are an adhesive sheet for a tire, which can finely conform to spews or concavities and convexities on the surface and can prevent lifting and peeling of the adhesive sheet, regardless of whether the adhesion is achieved by hand or by an automatic label applicator; a method of producing an adhesive sheet for a tire; and a method of using an adhesive sheet for a tire.
Disclosed is an adhesive sheet for a tire, the adhesive sheet including a substrate and an adhesive layer, in which the Gurley bending resistance of the substrate in the machine direction according to JIS L 1085 (1998) has a value within the range of 0.10 to 0.40 mN, and the Gurley bending resistance in the cross direction has a value within the range of 0.10 to 0.50 mN.

摘要翻译： 本发明提供了在粘合片的轮胎，其可精细地符合喷出的表面上或凹凸，并且可以防止该粘合片的提升和剥落，而不管是否附着力通过手工或自动在标签敷贴实现; 粘合片用于轮胎的制造的方法; 并使用粘合片的轮胎的方法。 公开了一种用于轮胎的粘合片，所述粘合片包括基材和粘合剂层上，其中，所述格利弯曲的基板的电阻在机器方向雅丁于JIS L 1085（1998）具有0.10至的范围内的值 ○时40 Mn和在横向方向上的格利耐弯曲性具有以零点50分的Mn 0时10分的范围内的值。

公开(公告)号：EP3355341A1

公开(公告)日：2018-08-01

申请号：EP16862110.0

申请日：2016-11-02

申请人： LINTEC Corporation

发明人： SATO Akinori ,  YAMAGISHI Masanori

IPC分类号： H01L21/301 ,  B32B7/02 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12

CPC分类号： B32B7/02 ,  H01L21/56 ,  H01L23/00 ,  H01L23/12

摘要： This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80°C is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

公开(公告)号：EP3373326A1

公开(公告)日：2018-09-12

申请号：EP16862116.7

申请日：2016-11-02

申请人： Lintec Corporation

发明人： YAMAGISHI Masanori ,  SATO Akinori

IPC分类号： H01L21/60 ,  C09J7/00 ,  C09J201/00 ,  H01L21/304

CPC分类号： C09J7/385 ,  B32B27/08 ,  B32B27/26 ,  B32B27/38 ,  C09J7/00 ,  C09J7/383 ,  C09J201/00 ,  H01L21/304 ,  H01L21/683 ,  H01L21/78 ,  H01L23/3171 ,  H01L24/27

摘要： This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160°C for one hour, a yellow index (YI 1 ) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm 2 , and light intensity of 510 mJ/cm 2 , a yellow index (YI 2 ) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

公开(公告)号：EP3351605A1

公开(公告)日：2018-07-25

申请号：EP16862107.6

申请日：2016-11-02

申请人： Lintec Corporation

发明人： YAMAGISHI Masanori ,  SATO Akinori

IPC分类号： C09J7/02 ,  B32B27/00 ,  C09J5/00 ,  C09J201/00 ,  H01L21/304 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/568 ,  B32B27/00 ,  B32B37/025 ,  B32B2457/14 ,  C09J5/00 ,  C09J5/06 ,  C09J7/20 ,  C09J7/29 ,  C09J7/38 ,  C09J7/401 ,  C09J201/00 ,  C09J2423/006 ,  C09J2463/005 ,  C09J2467/006 ,  C09J2475/00 ,  H01L21/304 ,  H01L21/56 ,  H01L21/563 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31

摘要： The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 µm or more, and the thickness of the curable resin layer is 20 µm to 100 µm.