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1.发明公开Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种制备具有所施加的图案的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260A2
公开(公告)日：2002-06-12
申请号：EP01128169.8
申请日：2001-11-27
发明人： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2201/047 , B81B2203/0118
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
摘要翻译： 本发明提供了一种微机械或微光学机械结构。 该结构是由一种方法，包括限定通过从层基底绝缘层上分离的单晶硅层上的图案产生的; 限定在单晶硅层的结构; 沉积和在单晶硅层上蚀刻多晶硅层，与其余polysilcon形成该结构的机械或光学元件; 和释放所形成的结构。
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2.发明公开Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219A2
公开(公告)日：2002-06-05
申请号：EP01128160.7
申请日：2001-11-27
发明人： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC分类号： B81B3/00
CPC分类号： B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
摘要： The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
摘要翻译： 本发明提供了通过包括限定在通过从基材层绝缘层上分离的单晶硅层的结构的方法制造的微机械或微光机械结构; 选择性地蚀刻所述单晶硅层; 沉积和绝缘体层上蚀刻的多晶硅层，用剩余的多晶硅形成该结构的机械元件; 金属化结构的背面; 和释放所形成的结构。
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3.发明公开Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219A3
公开(公告)日：2004-06-16
申请号：EP01128160.7
申请日：2001-11-27
发明人： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC分类号： B81B3/00
CPC分类号： B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
摘要： The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
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4.发明授权Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step 有权一种用于制备微机械和microoptomechanical结构暴露单晶硅过程
公开(公告)号：EP1213259B1
公开(公告)日：2007-05-23
申请号：EP01128161.5
申请日：2001-11-27
发明人： Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2203/058 , B81C2201/014 , B81C2201/0164 , B81C2201/056 , G02B26/0833
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5.发明公开Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step 有权一种用于制备微机械和microoptomechanical结构暴露单晶硅过程
公开(公告)号：EP1213259A2
公开(公告)日：2002-06-12
申请号：EP01128161.5
申请日：2001-11-27
发明人： Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2203/058 , B81C2201/014 , B81C2201/0164 , B81C2201/056 , G02B26/0833
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
摘要翻译： 本发明提供了一种微机械或微光学机械结构。 该结构是由一种方法，包括限定通过从层基底绝缘层上分离的单晶硅层上的结构所产生; 沉积和在单晶硅层上蚀刻多晶硅层，与其余polysilcon形成该结构的机械或光学元件; 露出单晶硅层的选定区域; 和释放所形成的结构。
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6.发明公开Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种用于制备具有附接的样品的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260A3
公开(公告)日：2004-06-16
申请号：EP01128169.8
申请日：2001-11-27
发明人： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2201/047 , B81B2203/0118
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
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7.发明公开Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step 有权一种用于制备微机械和microoptomechanical结构，包括硅单晶的曝光的步骤的过程
公开(公告)号：EP1213259A3
公开(公告)日：2004-06-16
申请号：EP01128161.5
申请日：2001-11-27
发明人： Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2203/058 , B81C2201/014 , B81C2201/0164 , B81C2201/056 , G02B26/0833
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
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8.发明授权Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权一种制备具有所施加的图案的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260B1
公开(公告)日：2007-05-16
申请号：EP01128169.8
申请日：2001-11-27
发明人： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2201/047 , B81B2203/0118
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9.发明授权Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219B1
公开(公告)日：2007-05-16
申请号：EP01128160.7
申请日：2001-11-27
发明人： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC分类号： B81B3/00
CPC分类号： B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
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公开(公告)号：EP1243550A3
公开(公告)日：2004-06-16
申请号：EP02006203.0
申请日：2002-03-19
申请人： Xerox Corporation
发明人： Gulvin, Peter M. , Chen, Jingkuang
CPC分类号： B41J2/1639 , B41J2/16 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2002/14403 , B81B7/0006
摘要： A microstructure that may be used as an electrical connection in a microfabricated electro-mechanical system (MEMS) apparatus. The microstructure may have one or more isolatable electrical connections for signal transmission. The microstructure allows a MEMS apparatus to shield signal transmissions from the effects of electromagnetic interference or conductive fluids.
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