公开(公告)号：EP2578631A4

公开(公告)日：2015-05-06

申请号：EP11789805

申请日：2011-05-31

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： SOGAME MASANOBU ,  UEYAMA DAISUKE ,  OHTSUKA HAJIME

IPC分类号： C08L63/00 ,  B32B15/08 ,  B32B27/38 ,  C08J5/24 ,  C08K3/00 ,  C08K5/3415 ,  C08L65/00 ,  H05K1/03

CPC分类号： C09D163/00 ,  B32B15/092 ,  B32B27/38 ,  C08G59/4014 ,  C08G59/4042 ,  C08G2261/3424 ,  C08J5/24 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2379/04 ,  C08K3/22 ,  C08L63/00 ,  C08L65/00 ,  C09D165/00 ,  Y10T428/31529

摘要： There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

公开(公告)号：EP2947122A4

公开(公告)日：2016-08-31

申请号：EP14740816

申请日：2014-01-14

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： TOMIZAWA KATSUYA ,  CHIBA TOMO ,  TAKAHASHI HIROSHI ,  SHIGA EISUKE ,  UEYAMA DAISUKE ,  NOMIZU KENTARO

IPC分类号： C08J5/24 ,  C08K3/22 ,  C08K9/06 ,  C08K9/08 ,  H05K1/03

CPC分类号： C09D179/08 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/011 ,  C08L101/00 ,  C09D165/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31663 ,  Y10T442/2861 ,  Y10T442/2992 ,  C08L83/04

摘要： The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 µm to 100 µm; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

摘要翻译： 本发明提供一种树脂组合物，其包含：平均粒径为1.0nm〜100nm的氧化铝和/或勃姆石的纳米粒子（A） 平均粒径为0.20μm〜100μm的微粒（B）; 和热固性树脂（C），其中纳米粒子（A）的表面用聚硅氧烷类改性剂处理。

公开(公告)号：EP2845877A4

公开(公告)日：2015-11-25

申请号：EP13769340

申请日：2013-03-25

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： SAITO CHISATO ,  UEYAMA DAISUKE ,  SOGAME MASANOBU ,  MABUCHI YOSHINORI ,  KATO YOSHIHIRO

IPC分类号： C08L63/00 ,  B32B15/08 ,  B32B15/092 ,  C08G59/40 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08L61/14

CPC分类号： C08L63/00 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K2003/221 ,  C08K2003/2224 ,  C08L3/10 ,  C08L71/00 ,  C08L79/04 ,  C08L2201/08 ,  C08L2203/20 ,  Y10T428/24893 ,  Y10T442/2475 ,  Y10T442/3455 ,  Y10T442/656

摘要： The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.

公开(公告)号：EP2778198A4

公开(公告)日：2015-06-24

申请号：EP12847461

申请日：2012-10-26

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： UEYAMA DAISUKE ,  SOGAME MASANOBU ,  SAITO CHISATO ,  MABUCHI YOSHINORI ,  KATO YOSHIHIRO

IPC分类号： C08L63/00 ,  B32B15/08 ,  C08J5/24 ,  C08K3/00 ,  C08K5/3415 ,  C08K5/541 ,  C08L79/00

CPC分类号： H05K1/0373 ,  C08G73/0655 ,  C08G73/12 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/04 ,  C08K2201/003 ,  C08L79/04 ,  C09K5/14 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/25 ,  Y10T442/2475 ,  C08L63/00 ,  C08L79/085

摘要： The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

公开(公告)号：EP2684904A4

公开(公告)日：2014-08-27

申请号：EP12754288

申请日：2012-03-05

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： OHTSUKA HAJIME ,  UEYAMA DAISUKE ,  SOGAME MASANOBU

IPC分类号： C08G59/40 ,  C08J5/24 ,  C08K3/00 ,  C08K3/38 ,  C08K9/02 ,  C08L63/00

CPC分类号： H05K1/0373 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/20 ,  B32B27/26 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08K3/0033 ,  C08K3/013 ,  C08K3/38 ,  C08K9/02 ,  C08K2003/387 ,  H05K1/056 ,  Y10T428/31529 ,  C08L63/00

摘要： [Problem to be solved] To provide a resin composition which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. [Solution] There is used a resin composition comprising an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.