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12 条记录 (耗时 0.009 秒)

    Electronic module for removing heat from a semiconductor die and method of making
    2.
    发明公开
    Electronic module for removing heat from a semiconductor die and method of making 失效
    的电子模块在冷却半导体及其制备方法。

    公开(公告)号：EP0681330A3

    公开(公告)日：1997-05-28

    申请号：EP95106318.9

    申请日：1995-04-27

    申请人： MOTOROLA, INC.

    发明人： Romero, Guillermo L. ,  Martinez, Joe L.

    IPC分类号： H01L25/07

    CPC分类号： H01L23/473 ,  H01L25/0652 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).

    Semiconductor package and module and method for fabricating
    3.
    发明公开
    Semiconductor package and module and method for fabricating 失效
    壳体和模块用于半导体和制造过程。

    公开(公告)号：EP0646958A3

    公开(公告)日：1997-01-29

    申请号：EP94114986.6

    申请日：1994-09-23

    申请人： MOTOROLA, INC.

    发明人： Romero, Guillermo L.

    IPC分类号： H01L23/02

    CPC分类号： H01L23/04 ,  H01L23/053 ,  H01L23/06 ,  H01L23/3733 ,  H01L25/165 ,  H01L2924/0002 ,  Y10T29/49144 ,  H01L2924/00

    摘要： A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resistance to bowing as compared to a flat base. The lack of bowing provides improved thermal contact to a cold plate of the operating environment. The lack of bowing also reduces certain failure modes. The alignment mechanism (104) aligns module components during assembly, thereby simplifying assembly by eliminating the need for complicated fixtures which hold components in place.

    Power dissipation apparatus and method for making
    5.
    发明公开
    Power dissipation apparatus and method for making 失效
    Wärmeabfuhrgerätund dessen Herstellungsverfahren。

    公开(公告)号：EP0661917A1

    公开(公告)日：1995-07-05

    申请号：EP94120104.8

    申请日：1994-12-19

    申请人： MOTOROLA, INC.

    发明人： Romero, Guillermo L. ,  Anderson, Samuel J. ,  Pinder, Brent W.

    IPC分类号： H05K7/20 ,  H01L23/473

    CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L2924/0002 ,  Y10S428/901 ,  H01L2924/00

    摘要： A liquid cooled power dissipation apparatus (10) includes a metal matrix composite heat sink (11) with an insulation layer (17) integral to the apparatus (10). The insulation layer (17) is made integral to the apparatus (11) during infiltration of the metal matrix composite heat sink (11). Electronic components 23 are situated on top of the insulation layer (17).

    摘要翻译： 液体冷却功率耗散装置（10）包括具有与所述装置（10）成一体的绝缘层（17）的金属基体复合散热器（11）。 在金属基体复合散热器（11）的渗入期间，绝缘层（17）与装置（11）成一体。 电子部件23位于绝缘层（17）的顶部。

    Method for forming a power circuit package
    8.
    发明公开
    Method for forming a power circuit package 失效
    具有低工作电压的电压控制振荡器。

    公开(公告)号：EP0596236A3

    公开(公告)日：1994-05-18

    申请号：EP93115317.5

    申请日：1993-09-27

    申请人： MOTOROLA, INC.

    发明人： Anderson, Samuel J. ,  Romero, Guillermo L.

    IPC分类号： H03B5/12

    CPC分类号： H01L25/072 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03B7/06 ,  H03B2200/0034 ,  H03B2200/004 ,  H03B2201/0208 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21), and the second porous die mount (22) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20), the first porous die mount (21), and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.

    Wirebondless module package and method of fabrication
    9.
    发明公开
    Wirebondless module package and method of fabrication 失效
    赫尔斯特隆（Modsthehhuse ohne Drahtbonds und seine Herstellung）

    公开(公告)号：EP0747949A2

    公开(公告)日：1996-12-11

    申请号：EP96108832.5

    申请日：1996-06-03

    申请人： MOTOROLA, INC.

    发明人： Romero, Guillermo L. ,  Anderson, Samuel J.

    IPC分类号： H01L23/057 ,  H01L23/498

    CPC分类号： H01L24/82 ,  H01L23/057 ,  H01L23/49861 ,  H01L24/24 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/00

    摘要： A wirebondless module package and method of fabrication including a molded preform (15) of porous SiC with a cavity (16) having therein an AlN substrate (20) defining a plurality of pockets. The preform (15) being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die (30, 31) mounted on the Al in one of the pockets. A dielectric layer (35) covering the Al and defining openings (36 - 46) therethrough positioned to expose the aluminum and a connection to the die (30, 31). A conductive material positioned on the dielectric layer (35) in contact with the die (30, 31) and the Al so as to define terminals (36, 37, 38, 39) and interconnections (55, 56, 57) between the die (30, 31) and the terminals (36, 37, 38, 39).

    摘要翻译： 一种无引线模块封装和制造方法，包括具有空腔（16）的多孔SiC的模制预制件（15），其中限定多个凹穴的AlN基板（20）。 预成型件（15）被Al渗透，Al沉积在每个口袋中。 一个半导体管芯（30,31），其安装在其中一个凹穴中的Al上。 覆盖所述Al和限定开口（36-46）的电介质层（35），其定位成暴露所述铝以及与所述管芯（30,31）的连接。 定位在与所述管芯（30,31）和所述Al相接触的所述介电层（35）上的导电材料，以便限定所述管芯（30,31）和所述Al之间的端子（36,37,38,39）和互连（55,56,57） （30,31）和端子（36,37,38,39）。

    Electronic module for removing heat from a semiconductor die and method of making
    10.
    发明公开
    Electronic module for removing heat from a semiconductor die and method of making 失效
    Elektronisches Modul mitKühlungfürHalbleiter和seine Herstellung。

    公开(公告)号：EP0681330A2

    公开(公告)日：1995-11-08

    申请号：EP95106318.9

    申请日：1995-04-27

    申请人： MOTOROLA, INC.

    发明人： Romero, Guillermo L. ,  Martinez, Joe L.

    IPC分类号： H01L25/07

    CPC分类号： H01L23/473 ,  H01L25/0652 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).

    摘要翻译： 一种用于从半导体管芯（41）去除热量的电子模块（10）和制造电子模块（10）的方法。 电子模块（10）具有与隔离结构（23）配合的基板（11）。 隔离结构（23）具有三部分：第一部分结合到基板（11）的顶表面（12），第二部分结合到基板（11）的底表面（13），并且 第三部分结合到基板（11）的侧面（14）。 半导体管芯（41）接合到隔离结构（23）的第一部分，另一半导体管芯（41）接合到隔离结构（23）的第二部分。 基板（11）具有空腔（20），流体通过该空腔流动并从每个半导体管芯（41）传输热量。