摘要:
A high-frequency module (10) includes a first switch element (21) and a second switch element (22) that are mounted on a multilayer body (100). The first switch element (21) is equipped with a common terminal (Pc1) and individual terminals (Pi11, Pi12, Pi13 and Pi14). The second switch element (22) is equipped with a common terminal (Pc2) and individual terminals (Pi21, Pi22, Pi23 and Pi24). The individual terminals (Pi11, Pi12, Pi13, Pi21, Pi22 and Pi23) are connected to any of SAW filters (411, 412, 421 and 422) mounted on the multilayer body (100) or low loss filters (31 and 32) formed inside the multilayer body (100). The individual terminals (Pi14 and Pi24) are grounded by being connected to an inner layer ground electrode (DPG01) inside the multilayer body (100) by conductive via holes (131 and 132).
摘要:
To suppress a reduction in isolation characteristics between communication signals even in a compact module in which the spacing between mounting circuit elements is reduced. Duplexers (DUP1, DUP2, and DUP3) are aligned and mounted on a top face of a multilayer body (900). The WCDMA [band 5] duplexer (DUP2) the frequency band of which is apart from those of the WCDMA [band 1] duplexer (DUP1) and the WCDMA [band 2] duplexer (DUP3) is arranged between the WCDMA [band 1] duplexer (DUP1) and the WCDMA [band 2] duplexer (DUP3) the frequency bands of which are close to each other. This causes the spacing between the duplexers (DUP1, DUP3) the frequencies of signals transmitted and received through which are close to each other to be increased to suppress unnecessary electromagnetic field coupling between the duplexers (DUP1, DUP3). In addition, also with the duplexer (DUP2) the frequency band of which is apart from those of the duplexers (DUP1, DUP3) and which exists between the duplexers (DUP1, DUP3), the unnecessary electromagnetic field coupling is suppressed between the duplexers (DUP1, DUP3).
摘要:
The present invention provides a method for mounting an electronic-component module in which an adsorption head can adsorb and hold the electronic-component module, the electronic-component module can be efficiently mounted on a target board, and a height of the electronic-component module mounted on the target board can be sufficiently lowered and a method for manufacturing an electronic apparatus involving the method for mounting an electronic-component module, and an electronic-component module that can lower the height thereof. An adsorption face member 12 is provided on an electronic-component module 20 composed of an electronic-component base plate 1 and surface mount devices 2 (2a, 2b, 2c, 2d) mounted on the electronic-component base plate 1 in order to form an adsorption face 12a at a position that is substantially equal to or higher than that of an upper end of a transistor 2 (2c) that is the tallest surface-mount device. The adsorption head adsorbs the adsorption face to hold the electronic-component module and the electronic-component module is mounted on a motherboard 14 serving as the target board. Then a treatment is performed to prevent a situation in which an upper end of the adsorption face member is higher than the upper end of the tallest surface-mount device mounted on the electronic-component base plate.
摘要:
A high-frequency switch module (1) includes a switch element (SW1), high-frequency circuits (2 to 6), and a GND circuit (7). The switch element (SW1) includes an antenna port (Pa1), switch ports (Ps1 to Ps6), and an FET switch. The FET switch switches connection between the switch ports (Ps1 to Ps6) and the antenna port (Pa1). The high-frequency circuits (2 to 6) connect any of the switch ports (Ps1 to Ps6) to a signal processing circuit. In the GND circuit (7), the switch port (Ps6), which is not connected to the high-frequency circuits (2 to 6), is directly connected to a GND electrode.
摘要:
It is an object to provide a high-frequency component in which a low-frequency-band transmission characteristic is not degraded even when impedance mismatching is generated by providing a SAW filter in a high-frequency-band circuit. The high-frequency component includes a diplexer (1) having a high pass filter (102) and a low pass filter (101) connected in parallel to an antenna port, a high-frequency-band circuit serially connected to the high pass filter (102), and a low-frequency-band circuit serially connected to the low pass filter (101). A filter causing impedance mismatching is connected to the high-frequency-band circuit. The high pass filter (102) includes a first series resonant circuit (102A) and a second series resonant circuit (102B), and the resonance frequency of the first series resonant circuit (102A) is a trap frequency of a signal in the low-frequency band, and the resonance frequency of the second series resonant circuit (102B) is a trap frequency of undesired resonance generated in the transmission characteristic of the filter of the low-frequency-band side.