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公开(公告)号：EP2810971B1
公开(公告)日：2018-09-19
申请号：EP13743143.3
申请日：2013-01-24
CPC分类号： H05K1/0373 , C08G59/245 , C08G59/4014 , C08K3/00 , C08L63/00 , H05K1/0366 , H05K1/056 , H05K1/115 , H05K2201/0209 , Y10T428/24355 , Y10T428/24802 , Y10T428/24917 , Y10T428/31529
摘要： The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).
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2.发明公开RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL-LAMINATED BOARD, AND PRINTED CIRCUIT BOARD EMPLOYING SAME 审中-公开HARZZUSAMMENSETZUNGFÜRLEITERPLATTENMATERIAL UND PREPREG，HARZFOLIE，METALLFOLIENLAMINIERTE PLATTE UND LEITERPLATTE DAMIT
公开(公告)号：EP3006503A1
公开(公告)日：2016-04-13
申请号：EP14807917.1
申请日：2014-06-02
CPC分类号： H01B3/40 , B32B5/26 , B32B15/04 , B32B15/14 , B32B27/12 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2264/10 , B32B2264/102 , B32B2307/304 , B32B2307/306 , B32B2457/08 , C08J5/043 , C08J5/24 , C08J2363/02 , C08K3/013 , C08K5/3415 , C08K5/5442 , H05K1/02 , H05K1/0373 , C08L63/00
摘要： A resin composition used as a material of an insulating layer of a printed wiring board comprising the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition comprising: an epoxy compound (A); a cyanate compound (B); a maleimide compound (C); an inorganic filler (D); and an imidazole silane (E), wherein the maleimide compound (C) comprises a predetermined maleimide compound, a content of the maleimide compound (C) is 25% by mass or less based on 100% by mass of a total content of the epoxy compound (A), the cyanate compound (B), and the maleimide compound (C), and the imidazole silane (E) comprises a compound represented by the following formula (3).
摘要翻译： 一种树脂组合物，其用作印刷线路板的绝缘层的材料，该印刷电路板包括绝缘层和通过电镀形成在绝缘层的表面上的导体层，该树脂组合物包含：环氧化合物（A）; 氰酸酯化合物（B）; 马来酰亚胺化合物（C）; 无机填料（D）; 和咪唑硅烷（E），其中马来酰亚胺化合物（C）包含预定的马来酰亚胺化合物，马来酰亚胺化合物（C）的含量相对于环氧树脂的总含量100质量％为25质量％以下 化合物（A），氰酸酯化合物（B）和马来酰亚胺化合物（C），咪唑硅烷（E）包含由下式（3）表示的化合物。
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公开(公告)号：EP3321298B1
公开(公告)日：2020-08-19
申请号：EP16821360.1
申请日：2016-07-04
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公开(公告)号：EP3006503B1
公开(公告)日：2019-05-08
申请号：EP14807917.1
申请日：2014-06-02
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5.发明公开RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD 审中-公开树脂组合物，预浸料，金属箔包层板和印刷电路板
公开(公告)号：EP3321298A1
公开(公告)日：2018-05-16
申请号：EP16821360.1
申请日：2016-07-04
发明人： KASHIMA, Naoki , TOMIZAWA, Katsuya , ITO, Meguru , HAMAJIMA, Tomoki , SHIGA, Eisuke , TAKANO, Kentaro , KOGA, shota
摘要： The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.
摘要翻译： 本发明提供含有含烯丙基的化合物（A）和马来酰亚胺化合物（B）的树脂组合物，其中含烯丙基的化合物（A）具有除烯丙基以外的反应性官能团。
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6.发明公开RESIN COMPOSITION; PREPREG OR RESIN SHEET USING SAID RESIN COMPOSITION; LAMINATE PLATE USING SAID PREPREG OR RESIN SHEET; AND PRINTED WIRING BOARD 审中-公开树脂组合物; 使用所述树脂组合物的预浸料或树脂片材; 使用所述预浸料或树脂片材的层压板; 和印刷线路板
公开(公告)号：EP3321289A1
公开(公告)日：2018-05-16
申请号：EP16821357.7
申请日：2016-07-04
发明人： TAKANO, Yoichi , OHNISHI, Nobuyoshi , TOMIZAWA, Katsuya , KASHIMA, Naoki , TAKAHASHI, Hiroshi , SHIGA, Eisuke
IPC分类号： C08F2/44 , B32B5/28 , B32B17/04 , B32B27/00 , C08F222/40 , C08F236/20 , C08G73/00 , C08J5/24 , H05K1/03
CPC分类号： C08J5/24 , B32B5/02 , B32B5/28 , B32B15/14 , B32B17/04 , B32B27/00 , B32B2250/02 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2311/12 , B32B2457/08 , C08F2/44 , C08F222/40 , C08F236/20 , C08G73/00 , C08G73/106 , C08J2333/24 , C08K3/36 , H01L21/4846 , H01L23/145 , H01L23/562 , H05K1/03
摘要： The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C) .
摘要翻译： 本发明的树脂组合物含有链烯基取代的降冰片烯二酰亚胺（A），马来酰亚胺化合物（B）和氨基改性聚硅氧烷（C）。
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公开(公告)号：EP2733177B1
公开(公告)日：2017-08-30
申请号：EP12811367.7
申请日：2012-07-03
CPC分类号： H05K1/0373 , C08G59/40 , C08G59/4014 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08K3/013 , C08K3/22 , C08K3/36 , C08K5/29 , C08K5/3415 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0296 , H05K1/0366 , H05K3/0055 , H05K3/022 , H05K3/07 , H05K3/108 , H05K3/182 , H05K3/188 , H05K3/381 , H05K3/4676 , H05K2203/0773 , H05K2203/0793 , H05K2203/0796 , H05K2203/1152 , Y10T428/24355 , Y10T428/24802 , Y10T428/24917 , Y10T428/31529
摘要： Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.
摘要翻译： 本发明提供一种树脂组合物，其不论所使用的粗糙化条件如何，都能够在绝缘层上使用时在印刷线路板材料中的绝缘层表面上形成具有低粗糙度的粗糙表面，并且还能够形成 导电层具有优异的粘合性，耐热性，吸湿时的耐热性，热膨胀性和对粗糙表面的耐化学性。 一种树脂组合物，含有（A）可溶于酸的无机填料，（B）氰酸酯化合物和（C）环氧树脂。
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8.发明公开RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING SAME 审中-公开树脂组合物印刷电路板材料和半固化片，树脂片材，金属薄膜包衣层压板和印刷电路板订单
公开(公告)号：EP2810971A1
公开(公告)日：2014-12-10
申请号：EP13743143.3
申请日：2013-01-24
CPC分类号： H05K1/0373 , C08G59/245 , C08G59/4014 , C08K3/00 , C08L63/00 , H05K1/0366 , H05K1/056 , H05K1/115 , H05K2201/0209 , Y10T428/24355 , Y10T428/24802 , Y10T428/24917 , Y10T428/31529
摘要： The present invention provides a resin composition which is capable of forming a roughened surface with low roughness on a surface of an insulating layer regardless of roughening conditions when used as a material of an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also which has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. Disclosed is a resin composition including an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).
摘要翻译： 本发明提供的树脂组合物的所有其能够在绝缘层的表面上形成具有低粗糙度的粗糙化的表面无论粗糙化条件当用作印刷电路板的绝缘层的材料中使用的，并且具有优异的之间的粘附 的绝缘层和导体镀层，因此具有低的热膨胀系数（线膨胀系数），高玻璃化转变温度，并因此具有优异的耐湿热性。 本发明公开了一种树脂组合物包括环氧化合物（A）的氰酸酯化合物（B）和无机填料（C）的，worin氰酸酯化合物（B）是选自下组的萘酚芳烷基型的选择的至少一个 氰酸酯化合物，以芳香族烃甲醛型氰酸酯化合物，联苯芳烷基型氰酸酯化合物和酚醛清漆型氰酸酯化合物; 和环氧化合物（A）的含量为60〜75％（重量）基于环氧化合物（A）和氰酸酯化合物（B）的总量计。
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公开(公告)号：EP2733177A1
公开(公告)日：2014-05-21
申请号：EP12811367.7
申请日：2012-07-03
CPC分类号： H05K1/0373 , C08G59/40 , C08G59/4014 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08K3/013 , C08K3/22 , C08K3/36 , C08K5/29 , C08K5/3415 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0296 , H05K1/0366 , H05K3/0055 , H05K3/022 , H05K3/07 , H05K3/108 , H05K3/182 , H05K3/188 , H05K3/381 , H05K3/4676 , H05K2203/0773 , H05K2203/0793 , H05K2203/0796 , H05K2203/1152 , Y10T428/24355 , Y10T428/24802 , Y10T428/24917 , Y10T428/31529
摘要： Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.
摘要翻译： 本发明提供一种树脂组合物，无论使用粗糙化条件如何，在绝缘层上使用时，能够在印刷电路板材料的绝缘层的表面上形成具有低粗糙度的粗糙面的粗糙化表面，并且还可以形成 导电层具有优异的粘附性，耐热性，吸湿下的耐热性，在粗糙化表面上的热膨胀特性和耐化学性。 一种树脂组合物，其包含（A）可溶于酸的无机填料，（B）氰酸酯化合物和（C）环氧树脂。
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