公开(公告)号：EP2704537A4

公开(公告)日：2014-10-08

申请号：EP12777596

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

公开(公告)号：EP2712281A4

公开(公告)日：2015-06-24

申请号：EP12785591

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: Provided are a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body kp which is formed of a plurality of stacked ceramic layers S, which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces 3 and 2, and which has side surfaces 4 each being located between the paired main surfaces 3 and 2, and having a groove surface 6 located on a side toward the first main surface (back surface) 3 and a fracture surface 5 located between the groove surface 6 and the second main surface 2; and a notch 11 which has a concave shape in plan view, and which is provided on a side surface 4 only on a side toward the first main surface 3 so as to extend in a thickness direction of the side surface 4, wherein, in the side surface 4 having the notch 11, the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11, the first curved portions R1 being convex toward the first main surface 3 of the substrate main body kp in side view; and also has a second curved portion R2 on a second-main-surface side of the notch 11, the second curved portion R2 being convex toward the second main surface (front surface) 2 of the substrate main body kp in side view.

公开(公告)号：EP2701469A4

公开(公告)日：2015-03-18

申请号：EP12773834

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

Abstract: Provided are a ceramic wiring substrate having few burrs in the vicinity of a notch provided on a side surface of a substrate main body, in which a conductor layer provided on the inner wall of the notch exhibits excellent solderability; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate 1a includes a substrate main body 2a which has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 8a located on a side toward the front surface 3 and a fracture surface 7 located on a side toward the back surface 4; and a notch 6 which has a concave shape in plan view, and which is provided on at least one of the side surfaces 5 so as to extend between the front surface 3 and the back surface 4, wherein, in the side surface 5 having the notch 6, the boundary 11 between the groove surface 8a and the fracture surface 7 has curved portions 11r on opposite sides of the notch 6, the curved portions 11r being convex toward the front surface 3 of the substrate main body 2a in side view.

公开(公告)号：EP2701470A4

公开(公告)日：2015-01-14

申请号：EP12774076

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.