公开(公告)号：EP3254020B1

公开(公告)日：2018-06-06

申请号：EP16701480.2

申请日：2016-01-25

Applicant: Philips Lighting Holding B.V.

Inventor： VAN ASSELT, Robert ,  VERHOEVEN, Mark Johannes Antonius ,  VREHEN, Joris Jan ,  LIJTEN, Gerardus Franciscus Cornelis Maria ,  BAX, Laurens ,  VAN DEN EERENBEEMD, Chris

IPC: F21V3/02 ,  F21V31/00 ,  F21K99/00 ,  F21Y115/10

CPC classification number: F21V31/005 ,  F21K9/90 ,  F21V3/02 ,  F21V17/06 ,  F21V17/101 ,  F21V19/0015 ,  F21Y2115/10 ,  H05K1/056 ,  H05K1/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1147 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: This invention relates to the field of lighting modules employing light emitting diodes (LEDs), and more particularly to LED modules suitable for exposed lens plate luminaires. There is herein provided an LED module having a printed circuit board comprising at least two layers, wherein the interface between two layers at a side surface of the printed circuit board is covered by a protrusion of an optically transmissive cover plate. The same said optically transmissive cover plate is also adapted to cover at least one LED positioned in or on the printed circuit board.

公开(公告)号：EP2627159A4

公开(公告)日：2018-01-17

申请号：EP11830572

申请日：2011-09-30

Applicant: NGK SPARK PLUG CO

Inventor： YOSHIDA YOSHITAKA ,  YAMAMOTO HIROAKI

IPC: H05K1/03 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

公开(公告)号：EP3073523A4

公开(公告)日：2017-06-28

申请号：EP14864041

申请日：2014-11-19

Applicant: DAINIPPON PRINTING CO LTD

Inventor： KURAMOCHI SATORU ,  KOIWA SUMIO ,  YOSHIOKA HIDENORI

IPC: H01L23/32 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/522 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/11

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0665 ,  H01L2924/07025

公开(公告)号：EP2993384A1

公开(公告)日：2016-03-09

申请号：EP15175821.6

申请日：2015-07-08

Applicant: vosla GmbH

Inventor： WINKLER, Markus ,  ENENKEL, Martin

IPC: F21K9/232 ,  F21K9/90 ,  F21S4/00 ,  H05K1/02 ,  F21Y115/10 ,  F21Y103/10 ,  F21Y107/00 ,  H05K1/18

CPC classification number: F21K9/90 ,  F21K9/232 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/05 ,  H05K1/189 ,  H05K2201/057 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09827 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/1053 ,  H05K2201/2009 ,  H05K2203/1194

Abstract: Die Erfindung betrifft eine bandförmige Leuchtmittelvorrichtung (1), eine Lampe (12) mit wenigstens einer solchen bandförmigen Leuchtmittelvorrichtung (1) und ein Verfahren zum Herstellen der bandförmige Leuchtmittelvorrichtung (1). Die bandförmige Leuchtmittelvorrichtung (1) für eine Lampe (12), insbesondere LED-Lampe, weist auf: Wenigstens einen ersten Abschnitt (5, 5') und wenigstens einen zweiten Abschnitt (6, 6'), wobei der erste Abschnitt (5, 5') gegenüber dem zweiten Abschnitt (6, 6') eine reduzierte Biegesteifigkeit aufweist, wobei die bandförmige Leuchtmittelvorrichtung (1) in dem wenigstens einen ersten Abschnitt (5, 5') mit der reduzierten Biegesteifigkeit derart gebogen ist, dass eine ebene Ausgangsform der bandförmigen Leuchtmittelvorrichtung (1) eine dreidimensionale Endform annimmt.

Abstract translation: 本发明涉及一种条带的照明装置，用绑扎照明装置的灯，以及用于制造条带照明装置的方法。 条带照明设备（1）用于所述灯，爱尤其是在LED灯。 条带照明装置包括至少一个第一部分（5,5“）和至少一个第二部分（6，6”），worin所述第一部分（5,5“）的弯曲强度小于所述第二的 段（6，6“）。 条带的照明设备（1）能够在所述至少第一部分（5,5“）具有较低的抗弯强度弯曲，所以做了绑扎照明设备（1）能够从在初始的平面形状变形为最终的三维形状 ，

公开(公告)号：EP2627159A1

公开(公告)日：2013-08-14

申请号：EP11830572.1

申请日：2011-09-30

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： YOSHIDA Yoshitaka ,  YAMAMOTO Hiroaki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array.
A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

Abstract translation: 提供了一种多分片阵列，其中在划分或划分之后难以从划分槽附近发生切屑，破裂或断裂，并且其具有高可靠性，并且制造多层结构的方法 -piece阵列。 多片阵列1通过层叠多个陶瓷层s1和s2而形成，并具有前表面2和后表面3.多片阵列1包括产品区域4a，其中多个布线板部分 在平面图中具有矩形形状并且包括空腔5的图4以矩阵形式布置，沿着产品区域4a的周边定位的边缘部分6和形成在前部的至少一个上的分隔槽8和9 表面2和背面3沿着布线板部分4和4之间的边界以及布线板部分4和边缘部分6之间的边界。分隔槽8和9的最深部分8b具有弧形，并且每个 分割槽8,9在与延伸方向正交的截面上包括在最深部分8b和凹槽入口8c之间的中间部分8a。 最深部8b的宽度w2大于槽入口8c的宽度w3，中间部分8a的宽度w1等于或小于槽入口8c的宽度w3。

公开(公告)号：EP1038417B1

公开(公告)日：2006-02-15

申请号：EP99970553.6

申请日：1999-10-12

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： FILLION, Arthur, J. ,  KOGAMI, Osamu ,  KURATA, Kanji 2-8 Aza-Furumachi ,  MURRAY, Jeffrey, A. ,  SMITH, Terrence, A.

IPC: H05K1/16 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0256 ,  H05K1/162 ,  H05K3/0052 ,  H05K2201/0355 ,  H05K2201/09154 ,  H05K2201/09309 ,  H05K2203/0228 ,  H05K2203/0346 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/4981 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: The present invention provides thin-laminate panels (i.e., thin-laminate panels (2) having dielectric layers (8) about 0.006 inches (0.15 mm) or less and conductive layers (6) on either side of the dielectric layer (8)), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. 'Finishing' methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.

公开(公告)号：EP0926935A1

公开(公告)日：1999-06-30

申请号：EP98403209.4

申请日：1998-12-18

Applicant: AEROSPATIALE SOCIETE NATIONALE INDUSTRIELLE

Inventor： Bedos, Jean-Philippe ,  Sune, Gérard

IPC: H05K3/40 ,  H05K1/14

CPC classification number: H05K1/141 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/049 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10689

Abstract: La présente invention concerne l'interconnexion de deux dispositifs électroniques (2 et 3), par l'intermédiaire d'un dispositif d'interconnexion (1).
Selon l'invention, le dispositif d'interconnexion (1) comporte des rainures métallisées (17, 18) dans son chant, chacune en liaison électrique avec un de ses contacts inférieurs (15). Des doses de soudure (20), partiellement logées dans les rainures (17, 18), assurent la fixation du dispositif d'interconnexion (1) sur le dispositif électronique (3), ainsi que les liaisons électriques entre les dispositifs (1 et 3).

Abstract translation: 中间连接板具有上接触点，连接到所述电子部件。 有在侧壁，其中连接到下部印刷电路板和互连，以将电子部件后垫连接已经发生FORMED导电凹槽。

公开(公告)号：EP0921566A1

公开(公告)日：1999-06-09

申请号：EP98402905.8

申请日：1998-11-20

Applicant: ELA MEDICAL (Société anonyme)

Inventor： Legay, Thierry ,  Gilet, Dominique ,  Van Campenhout, Yves

IPC: H01L23/485 ,  H01L23/31 ,  H01L23/00 ,  G01P15/08

CPC classification number: H05K3/3442 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: Dans ce composant (10), une puce comporte un microsystème réalisé notamment par dépôt, photolithographie et micro-usinage de couches successives. Le microsystème comporte une pluralité de plots de liaison électrique (16). La puce est pourvue d'un enrobage externe (20) pour permettre son report sur un substrat (28). Cet enrobage porte en surface une pluralité de métallisations externes (22) reliées électriquement, au travers du matériau d'enrobage, aux plots de la puce situés en vis-à-vis et noyés dans l'épaisseur du matériau d'enrobage. Le composant enrobé a dans le sens de la longueur et de la largeur sensiblement les mêmes dimensions que celles de la puce avant enrobage. L'enrobage n'est formé que sur une partie réduite de la puce, essentiellement dans la région des plots et des métallisations, la partie non enrobée étant une partie sensible du microsystème, préservée des contraintes mécaniques engendrées par l'application et le durcissement du matériau d'enrobage.

Abstract translation: 一种微机电部件（10），其包括微系统中通过沉积，光刻和微制造连续层制成的芯片。 微系统包括接触垫用于电连接（16）多个。 该芯片上设置有局部外部涂层（20），以允许其转印到基板（28）。 这种涂层在其表面上通过涂覆材料，电连接到芯片的底层接触焊盘金属化的外部（22）的复数。 经过涂敷的部件具有大致相同的长度和宽度的那些涂层前的芯片。 涂层仅在在芯片的一个缩小部分的局部区域形成时，基本上在焊盘和金属化，微系统的检测部不是那么涂覆和从致机械约束因此被保护的区域中，由于应用 和硬化涂层材料的。

公开(公告)号：EP0259716B1

公开(公告)日：1994-05-25

申请号：EP87112511.8

申请日：1987-08-28

Applicant: Held, Kurt

Inventor： Held, Kurt

IPC: B23D45/20 ,  B23D47/00

CPC classification number: B27G19/10 ,  B23D45/20 ,  B23D47/005 ,  B23D59/006 ,  B23D59/008 ,  B23D61/026 ,  B27B33/20 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/068 ,  H05K2203/1545 ,  Y10T83/7507 ,  Y10T83/7863 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1741

公开(公告)号：EP0493103A3

公开(公告)日：1993-04-14

申请号：EP91312002.8

申请日：1991-12-23

Applicant: XEROX CORPORATION

Inventor： Mikkelsen, James C. ,  Meuli, William ,  Bruce, Richard ,  Ho, Jackson

IPC: H05K3/34 ,  H05K1/14

CPC classification number: H05K1/142 ,  G09F9/35 ,  H01R4/02 ,  H01R12/52 ,  H05K1/117 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/36 ,  H05K2201/09154 ,  H05K2203/049 ,  Y10T29/49149

Abstract: A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the end faces (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to form the bridges. The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed. These low profile bridges (16) are especially advantageous tn that they allow a protective plastics or similar cover sheet, or a liquid crystal laminate, to be surface mounted on the adjacent array (10) without causing detrimental surface blemishes or ridges. The small area of the bridges (16) greatly reduces the non-transmitting area of the visual display. The bridges (16), being substantially narrower than the pads (14) which they connect, are more likely to connect the intended pads (14) and less likely to "short" pads (14) which are not in accurate alignment.