Abstract:
Prepregs (100) having a UV curable resin layer (102) located adjacent to a thermally curable resin layer (104) wherein the UV curable resin layer includes at least one UV cured resin portion (125) and at least one UV uncured resin (127) as well as methods for preparing flexible printed circuit boards using the prepregs.
Abstract:
A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.
Abstract:
A support structure (10) for lighting devices includes a ribbon-like support member (12) with electrically conductive lines with mounting locations (18) for electrically powered light radiation sources, e.g. LED sources. The structure includes a sequence of adjacent units (U) having end regions, and it can be cut between mutually facing end regions of two adjacent units U. Said units include, at said end regions, one or more electrical connection formations including: - a proximal portion (22a), electrically coupled to the electrically conductive lines of the respective unit, and - a distal portion (22b), electrically insulated from proximal portion (22a) and being electrically coupled to the distal portion (22b) of an electrical connection formation provided in an adjacent unit in the sequence of adjacent units (U), and being separable therefrom by severing support structure (10). Said distal portion (22b) and proximal portion (22a) may be connected to each other via electrically conductive bridge members.
Abstract:
Provided are a ceramic wiring substrate having few burrs in the vicinity of a notch provided on a side surface of a substrate main body, in which a conductor layer provided on the inner wall of the notch exhibits excellent solderability; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate 1a includes a substrate main body 2a which has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 8a located on a side toward the front surface 3 and a fracture surface 7 located on a side toward the back surface 4; and a notch 6 which has a concave shape in plan view, and which is provided on at least one of the side surfaces 5 so as to extend between the front surface 3 and the back surface 4, wherein, in the side surface 5 having the notch 6, the boundary 11 between the groove surface 8a and the fracture surface 7 has curved portions 11r on opposite sides of the notch 6, the curved portions 11r being convex toward the front surface 3 of the substrate main body 2a in side view.
Abstract:
Die Erfindung betrifft ein Verbindungskabel (10), insbesondere zur Verbindung elektrischer Baugruppen (1, 2), welches als flexible Leiterplatte (11) mit wenigstens einer Leiterbahn (3) ausgebildet ist, wobei die flexible Leiterplatte (11) wenigstens zwei aneinander liegende und über wenigstens einen Biegeabschnitt (12) verbundene Leiterplattenabschnitte (13) umfasst und aneinander liegende Bereiche der flexiblen Leiterplatte (11) wenigstens über einen Steg (14) trennbar verbunden sind; erfindungsgemäß ist vorgesehen, dass die Leiterplatte (11) mit einem ersten und zweiten Leiterplattenendabschnitt (15 1 , 15 2 ) und dazwischen liegenden aus einer Anzahl von 2n+1 (n≥1) von im Wesentlichen gleich langen Leiterplattenabschnitten (13 1 , 13 2 , 13 3 , 13 4 , 13 5 ) ausgebildet ist, die Leiterplattenendabschnitte (15 1 , 15 2 ) als Anschlussstellen in Richtung der Leiterplattenabschnitte (13 1 , 13 2 , 13 3 , 13 4 , 13 5 ) gegenüberliegende Biegeabschnitte (12 1 , 12 2 , 12 3 , 12 4 ) überragend ausgebildet sind, wobei deren Ausdehnung quer zur Richtung der Leiterplattenabschnitte (13 1 , 13 2 , 13 3 , 13 4 , 13 5 ) im Wesentlichen der Breite der aneinander liegenden Leiterplattenabschnitte (13 1 , 13 2 , 13 3 , 13 4 , 13 5 ) entspricht, und die Leiterplattenendabschnitte (15 1 , 15 2 ) mit den benachbarten Biegeabschnitten (12 1 , 12 2 , 12 3 , 12 4 ) jeweils mit wenigstens einem Steg (14 1 , 14 2 , 14 3 , 14 4 ) trennbar verbunden sind. Eine weitere Lösung besteht darin, dass die flexible Leiterplatte (11) beginnend mit einem ersten Leiterplattenendabschnitt (15 1 ) spiralförmig in einer Ebene mit mehreren Spiralgängen (21 1 , 21 2 , 23 3 ) nach außen verlaufend und in einem zweiten Leiterplattenendabschnitt (15 2 ) endend ausgebildet ist, und zwischen den Spiralgängen (21 1 , 21 2 , 23 3 ) jeweils Stege (22, 23) vorgesehen sind, welche benachbarte Spiralgänge (21 1 , 21 2 , 23 3 ) der Leiterplatte (11) trennbar verbinden. Schließlich wird gemäß einer weiteren Lösung vorgeschlagen, dass zwei flexible Leiterplattenabschnitte (13 1 , 13 2 ) beginnend mit einem die Leiterplattenabschnitte (13 1 , 13 2 ) verbindenden Biegeabschnitt (12) bifilar senkrecht zur Ebene der Leiterplatte (11) spiralförmig mit mehreren Spiralgängen (22) nach außen verlaufend mit Leiterplattenendabschnitten (15 1 , 15 2 ) endend gerollt ausgebildet sind. Ferner betrifft die Erfindung eine Messbaugruppe mit einem erfindungsgemäßen Verbindungskabel.
Abstract:
A circuit board layer (2) in accordance with the present invention includes a conductive sheet (4) sandwiched between an insulating top layer (10) and an insulating bottom layer (14). The top and bottom layers (10) and (14) and the conductive sheet (4) define the circuit board layer (2) having an edge that includes an edge (20) of the conductive sheet (4). An insulating edge layer (18) covers substantially all of the edge (20) of the conductive sheet (4).