公开(公告)号：EP3247180A1

公开(公告)日：2017-11-22

申请号：EP16737191.3

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.

Abstract translation: 陶瓷基板包括主要由玻璃陶瓷形成的陶瓷层和主要由银（Ag）形成的导体迹线。 在与导体迹线相邻的相邻区域中，陶瓷层中包含的硼原子（B）的浓度朝着导体迹线增加。

公开(公告)号：EP3247181A1

公开(公告)日：2017-11-22

申请号：EP16737189.7

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: This circuit-board production method is provided with: a step for preparing a conductor paste obtained by adding, to silver (Ag) powder, a powder of a metal boride and/or a metal silicide; a step in which the conductor paste is applied to the surface of a baked ceramic substrate; a step in which a glass paste is applied to the surface of the ceramic substrate after the conductor paste has been applied; a step in which the conductor paste applied to the surface is baked to form a conductor pattern; and a step in which the glass paste applied to the surface is baked to form a coating layer.

Abstract translation: 该电路基板的制造方法具备：准备在银（Ag）粉末中添加金属硼化物和/或金属硅化物的粉末而得到的导体膏的工序; 将导体膏施加到烘烤的陶瓷基底的表面上的步骤; 在施加导体膏之后，将陶瓷基板的表面涂布玻璃膏的工序; 烘焙施加到表面的导体膏以形成导体图案的步骤; 以及将涂布于表面的玻璃糊剂烘烤以形成涂层的步骤。

公开(公告)号：EP3247184A1

公开(公告)日：2017-11-22

申请号：EP16737190.5

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K3/46 ,  H05K1/03

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: This ceramic-substrate production method is provided with: a step for preparing a ceramic paste obtained by adding, to a starting-material powder of a glass ceramic, a powder of a metal boride and/or a metal silicide; a step in which the ceramic paste is applied to a green sheet which will become a ceramic layer after being baked; a step in which a conductor paste which will become a conductor pattern after being baked is applied on the ceramic paste applied to the green sheet; and a step in which the green sheet having the ceramic paste and the conductor paste applied thereto is baked.

Abstract translation: 该陶瓷基板制造方法具备：准备在玻璃陶瓷的原料粉末中添加金属硼化物和/或金属硅化物的粉末而成的陶瓷糊剂的工序; 将陶瓷糊剂涂布在烧成后成为陶瓷层的生片上的工序; 在涂布在生片上的陶瓷膏上涂布成为烧成后的导体图案的导体膏的工序; 以及将涂布有陶瓷糊剂和导体糊剂的生片烧成的工序。

公开(公告)号：EP3247182A1

公开(公告)日：2017-11-22

申请号：EP16737192.1

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: A method for manufacturing a ceramic substrate containing glass, the method being provided with a firing step in which an unfired silver-based conductor material is arranged in an unfired ceramic layer and then fired, and the unfired silver-based conductor material containing a metal boride and/or a metal silicide

Abstract translation: 一种含有玻璃的陶瓷基板的制造方法，其特征在于，具备：烧成工序，将未烧成的银系导体材料配置于未烧成的陶瓷层中，然后进行烧成;以及未烧成的银系导体材料，其含有金属硼化物 和/或金属硅化物