Abstract:
There is provided a composition for forming an antistatic film that has a superior coating performance on the surface of a resist film and forms antistatic film capable of protecting a resist film from being charged. A composition for forming an antistatic film, comprising: an oligomer compound of Formula (1A):
(where R 1 is a hydrogen atom or a group of Formula (2), each of R 2 and R 3 is independently a hydrogen atom, a group of Formula (3), or a group of Formula (4), at least one of the plurality of Rs is a sulfo group, a and b are positive integers satisfying 2 ≤ (a + b) ≤ 6; and each of a plurality of xs is independently an integer from 0 to 4):
Abstract:
There is provided an underlayer film for a self-assembled film and that does not intermix (layer-mix) with the self-assembled film as the upper layer and that enables the formation of a vertical pattern of the self-assembled film. An underlayer film-forming composition for a self-assembled film comprising a polymer including 0.2% by mole or more of a unit structure of a polycyclic aromatic vinyl compound relative to all unit structures of the polymer. The polymer includes 20% by mole or more of a unit structure of an aromatic vinyl compound relative to all the unit structures of the polymer and includes 1% by mole or more of a unit structure of the polycyclic aromatic vinyl compound relative to all the unit structures of the aromatic vinyl compound. The aromatic vinyl compound includes an optionally substituted vinylnaphthalene, acenaphthylene, or vinylcarbazole, and the polycyclic aromatic vinyl compound is vinylnaphthalene, acenaphthylene, or vinylcarbazole. The aromatic vinyl compound includes an optionally substituted styrene and an optionally substituted vinylnaphthalene, acenaphthylene, or vinylcarbazole, and the polycyclic aromatic vinyl compound is vinylnaphthalene, acenaphthylene, or vinylcarbazole.
Abstract:
It is an object to provide a resist underlayer film forming composition having a large selection ratio of a dry etching rate, and having a k value and an n value at a short wavelength such as an ArF excimer laser, both of which exhibit desired values. There is provided a resist underlayer film forming composition containing a polymer obtained by reacting at least a tetracarboxylic dianhydride having an alicyclic structure or an aliphatic structure and a diepoxy compound having two epoxy groups with an organic solvent containing an alcohol-based compound having an OH group, and a solvent.
Abstract:
There is provided a resist underlayer film-forming composition for EUV lithography which shows good resist shape. A resist underlayer film-forming composition for EUV lithography, comprising: a hydrolyzable organosilane, a hydrolyzed product thereof, or a hydrolyzed condensate thereof, as a silane; and a salt of a sulfonic acid ion containing a hydrocarbon group with an onium ion. The hydrolyzable organosilane preferably comprises at least one organic silicon compound selected from the group consisting of compounds of Formula (1):
R 1 a Si(R 2 ) 4-a Formula (1)
and compounds of Formula (2):
[R 3 c Si(R 4 ) 3-c ] 2 Y b Formula (2)
a hydrolyzed product thereof, or a hydrolyzed condensate thereof. A method for manufacturing a semiconductor device, the method comprising: forming an organic underlayer film on a semiconductor substrate; forming a resist underlayer film by applying the resist underlayer film-forming composition onto the organic underlayer film, and then baking the applied resist underlayer film-forming composition; forming a resist film by applying a composition for EUV resists onto the resist underlayer film; EUV-exposing the resist film; and obtaining a resist pattern by developing the exposed resist film.
Abstract translation:提供了用于EUV光刻的抗蚀剂下层膜形成组合物,其显示出良好的抗蚀剂形状。 一种用于EUV光刻的抗蚀剂下层膜形成组合物,包括:可水解的有机硅烷,其水解产物或其水解缩合物作为硅烷; 以及含有烃基的磺酸离子与鎓离子的盐。 可水解的有机硅烷优选包含至少一种选自式(1)的化合物的有机硅化合物:€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 1 a Si(R 2)4-a €ƒ€ƒ€ƒ€ƒFormula(1)和式(2)的化合物:€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ[R 3 c Si(R 4)3-c] (2)其水解产物,或其水解缩合物。 一种制造半导体器件的方法,所述方法包括:在半导体衬底上形成有机下层膜; 通过将抗蚀剂下层膜形成组合物涂覆在有机下层膜上形成抗蚀剂下层膜,然后烘烤所形成的抗蚀剂下层膜组合物; 通过在抗蚀剂下层膜上施加用于EUV抗蚀剂的组合物形成抗蚀剂膜; EUV曝光抗蚀膜; 并通过显影曝光的抗蚀剂膜获得抗蚀剂图案。
Abstract:
There is provided a composition for forming an antistatic film that has a superior coating performance on the surface of a resist film and forms antistatic film capable of protecting a resist film from being charged. A composition for forming an antistatic film, comprising: an oligomer compound of Formula (1A): (where R 1 is a hydrogen atom or a group of Formula (2), each of R 2 and R 3 is independently a hydrogen atom, a group of Formula (3), or a group of Formula (4), at least one of the plurality of Rs is a sulfo group, a and b are positive integers satisfying 2 ‰¤ (a + b) ‰¤ 6; and each of a plurality of xs is independently an integer from 0 to 4): (where n is an integer satisfying 1 ‰¤ n
Abstract:
Disclosed is a composition for forming a resist underlayer film having high selectivity ratio of etching rate, while having desired k value and n value for a short wavelength such as an ArF excimer laser. Specifically disclosed is a composition for forming a resist underlayer film, which contains a polymer and a solvent. The polymer is obtained from a reaction using at least a tetracarboxylic acid dianhydride having an alicyclic structure or an aliphatic structure and a diepoxy compound having two epoxy groups, which reaction is performed together with an organic solvent containing an alcohol compound having an OH group.
Abstract:
There is provided anti-reflective coating forming composition containing a reaction product of an isocyanuric acid compound having two or three 2,3-epoxypropyl groups with a benzoic acid compound. The anti-reflective coating obtained from the composition has a high preventive effect for reflected light, causes no intermixing with photoresists, can form a photoresist pattern having no footing at the lower part, and can use in lithography process by use of a light such as ArF excimer laser beam and F2 excimer laser beam, etc.
Abstract:
There is provided a composition for forming an underlayer film used for an underlayer of a self-organizing film. An underlayer film-forming composition of a self-organizing film, the underlayer film-forming composition comprising: a polymer consisting of a unit structure derived from an optionally substituted styrene and a unit structure derived from a crosslink forming group-containing compound, the polymer containing 60 mol% to 95 mol% of the unit structure derived from the styrene and 5 mol% to 40 mol% of the unit structure derived from the crosslink forming group-containing compound relative to the whole unit structures of the polymer. The crosslink forming group is a hydroxy group, an epoxy group, a protected hydroxy group, or a protected carboxy group. The crosslink forming group-containing compound is hydroxyethyl methacrylate, hydroxyethyl acrylate, hydroxypropyl methacrylate, hydroxypropyl acrylate, hydroxystyrene, acrylic acid, methacrylic acid, glycidyl methacrylate, or glycidyl acrylate.