摘要:
A method for manufacturing a semiconductor device comprising: a step for readying each of a semiconductor element (1), a substrate (2) having Cu as a principal element at least on a surface, and a ZnAl solder chip (3') having a smaller shape than that of the semiconductor element; a step for disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; a step for increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load (31) to the ZnAl solder chip, causing the ZnAl solder chip to melt, and forming a ZnAl solder layer (3); and a step for reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.
摘要:
A semiconductor module has a pair of semiconductor devices 16, 18 that are connected in series with each other and have first terminals 12, 14 electrically connected to a first power system BT and a second terminal 13 electrically connected to a second power system M, a heat sink 7, a first electrode 10 that is electrically connected both to the first terminal 12, that is one of the first terminals, and to one of electrodes of the semiconductor device 16, that is one of the pair of semiconductor devices, an output electrode 11 that is electrically connected both to the second terminal 13 and to one of electrodes of the semiconductor device 18, that is the other one of the pair of semiconductor devices, and a second electrode 9 that is electrically connected to the first terminal 14, that is the other one of the first terminals. The second electrode 9 is connected to the heat sink 7 via a first insulating member 8a, and the output electrode 11 is connected to the second electrode 9 via a second insulating member 8b.
摘要:
A switching circuit includes: a first switching element (Q1); a resistor (11) inserted between a control electrode (G) of the first switching element (Q1) and a control circuit (13) which performs switching control on the first switching element (Q1); and a first capacitor (15) and a second switching element (14) connected between the control electrode (G) of the first switching element (Q1) and a low potential-side electrode (S) of the first switching element (Q1). A high potential-side electrode of the second switching element (14) is connected to the control electrode (G) of the first switching element (Q1). A low potential-side electrode of the second switching element (14) is connected to one electrode of the first capacitor (15). The other electrode of the first capacitor (15) is connected to the low potential-side electrode (S) of the first switching element (Q1). A control electrode of the second switching element (14) is connected to an electrode of the resistor (11) connected to the control circuit (13).
摘要:
The present disclosure includes by controlling at least either one of a switching frequency of a switching element (S) or a duty ratio indicating an ON period of the switching element, securing delay time from voltage at both ends of the switching element reaches zero voltage by resonance of the resonant circuit (L 0 , C 0 ) in an OFF state of the switching element until the switching element is turned on, and turning on the switching element within the delay time.
摘要:
A method for manufacturing a semiconductor device comprising: a step for readying each of a semiconductor element (1), a substrate (2) having Cu as a principal element at least on a surface, and a ZnAl solder chip (3') having a smaller shape than that of the semiconductor element; a step for disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; a step for increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load (31) to the ZnAl solder chip, causing the ZnAl solder chip to melt, and forming a ZnAl solder layer (3); and a step for reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.
摘要:
To meet various requirements with a circuit formed from a semiconductor substrate. The present invention is provided with a semiconductor substrate (2A), an electrode group (4) that is formed on the semiconductor substrate (2A), and insulators (2B), wherein a plurality of capacitors (C1-C3) are formed. The plurality of capacitors (C1-C3) have a structure in which the insulators (2B) are sandwiched between each electrode of the electrode group (4). At least one of the plurality of capacitors (C1-C3) is set to be different in at least one of a tolerance, which is a capability of the capacitors (C1-C3) to withstand a prescribed voltage, and a conductance, which is an ease with which a leakage current flows in the capacitors (C1-C3).
摘要:
There is provided a power conversion device including a plurality of Direct Current (DC) power sources (VB) that converts an output voltage of each of the DC power sources into an Alternating Current (AC) voltage, and outputs the converted AC voltage in series connection, and the device includes: a DC/DC converter (21) connected to each of the DC power sources (VB) to convert the output voltage of the DC power sources; a control device (31) that controls an output voltage of the each DC/DC converter (21); and an H-bridge circuit (22) provided on the output side of the DC/DC converter (21) to convert the voltage output from the DC/DC converter (21) into an AC voltage.