公开(公告)号：EP3378288A1

公开(公告)日：2018-09-26

申请号：EP16785648.3

申请日：2016-10-11

Applicant: Northrop Grumman Systems Corporation

Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, H. Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

IPC: H05K1/02 ,  H01L39/22 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/303 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09763

Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.

公开(公告)号：EP3763178A1

公开(公告)日：2021-01-13

申请号：EP19709605.0

申请日：2019-02-20

Applicant: Northrop Grumman Systems Corporation

Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, Harlan Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

IPC: H05K7/20

公开(公告)号：EP3378291A1

公开(公告)日：2018-09-26

申请号：EP16794778.7

申请日：2016-10-11

Applicant: Northrop Grumman Systems Corporation

Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, H. Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

IPC: H05K5/02 ,  H01L23/44

CPC classification number: H05K1/0204 ,  H01L23/445 ,  H05K1/00 ,  H05K5/0213 ,  H05K13/00

Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.