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21 条记录 (耗时 0.032 秒)

    Method of printing smooth micro-scale features
    1.
    发明公开
    Method of printing smooth micro-scale features 有权
    Verfahren zum Drucken glatter Elemente imMikromaßstab

    公开(公告)号：EP1937045A1

    公开(公告)日：2008-06-25

    申请号：EP07123357.1

    申请日：2007-12-17

    申请人： Palo Alto Research Center Incorporated

    发明人： Srinivasan, Uma ,  White, David Stephen ,  Shrader, Eric J. ,  Ready, Steven E. ,  Limb, Scott J.

    IPC分类号： H05K3/12

    CPC分类号： H05K3/125 ,  H05K1/0266 ,  H05K2203/013 ,  H05K2203/162

    摘要： A method of jet-printing smooth micro-scale features is presented. The desired feature prior to being printed is masked by various decimation filters and the decimation is performed at various pitches. The subsequently printed image is then scanned and analyzed to determine the roughness of the lines. The optimum decimation pitch is determined by the feature that exhibits the least amount of droplet spreading and has the lowest edge roughness. The optimum decimation pitch may also be calculated from the material properties and the dynamics of fluids.

    摘要翻译： 提出了一种喷墨打印平滑微尺度特征的方法。 在打印之前的期望特征被各种抽取滤波器掩蔽，并且以各种间距进行抽取。 然后扫描并分析随后打印的图像以确定线的粗糙度。 最佳抽取间距由表现出最小量的液滴扩散并具有最低边缘粗糙度的特征决定。 也可以根据流体的材料性质和动力学来计算最佳抽取间距。

    Method for Obtaining Controller Sidewall Profile in Print-Patterned Structures
    8.
    发明公开
    Method for Obtaining Controller Sidewall Profile in Print-Patterned Structures 有权
    Verfahren zum Erzielen eines kontrollierten Profiler derSeitenwände在Druckmusterstrukturen

    公开(公告)号：EP2062849A2

    公开(公告)日：2009-05-27

    申请号：EP08169504.1

    申请日：2008-11-20

    申请人： Palo Alto Research Center Incorporated

    发明人： Shrader, Eric J. ,  Srinivasan, Uma ,  Crawford, Clark W. ,  Limb, Scott J.

    IPC分类号： B81C1/00 ,  H05K3/00

    CPC分类号： G03F7/2018 ,  H05K3/0079 ,  H05K3/108 ,  H05K3/184 ,  H05K2203/013 ,  H05K2203/0577 ,  H05K2203/0588

    摘要： High aspect ratio structures can be obtained by print-patterning masking features in feature stacks such that each feature has a lateral edge which is aligned in a plane roughly perpendicular to the plane of the substrate on which the features are formed. Due to the differential lateral spreading between features formed on a substrate and formed atop other features, the print head is indexed less than the radius of a droplet to a position where a droplet ejected by the print head forms an upper feature atop a lower feature such that the lateral edges of the upper and lower features are aligned in the plane roughly perpendicular to the plane of the substrate. Feature stacks of two or more features may provide a vertical (or re-entrant) sidewall mask for formation of high aspect ratio structures, by e.g., electroplating, etc.

    摘要翻译： 可以通过在特征堆叠中的印刷图案化掩模特征来获得高纵横比结构，使得每个特征具有在大致垂直于其上形成有特征的基底的平面的平面中对准的横向边缘。 由于形成在基板上并形成在其它特征上的特征之间的差分横向扩展，打印头被折射小于液滴的半径到由打印头喷射的液滴在下部特征顶部形成上部特征的位置，例如 上和下特征的侧边缘在大致垂直于基板的平面的平面中对齐。 两个或多个特征的特征堆叠可以提供用于形成高纵横比结构的垂直（或重入）侧壁掩模，例如通过电镀等。

    A method and system for patterning a mask layer
    9.
    发明公开
    A method and system for patterning a mask layer 有权
    Verfahren und System zur Strukturierung einer Maskenschicht

    公开(公告)号：EP1975699A2

    公开(公告)日：2008-10-01

    申请号：EP08151996.9

    申请日：2008-02-27

    申请人： Palo Alto Research Center Incorporated

    发明人： Limb, Scott J. ,  Shrader, Eric J. ,  Srinivasan, Uma

    IPC分类号： G03F1/00

    CPC分类号： G03F7/2018 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/28 ,  H05K2203/0551

    摘要： The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

    摘要翻译： 目前描述的实施例使用打印过程，例如， 蜡印刷技术，用于对例如印刷电路的掩模层（例如焊接掩模层）进行图案化。 可以维持开发焊接掩模和曝光工艺中的所有其他常规工艺。 根据目前描述的实施例，每个印刷电路将具有匹配均匀和非均匀跳动的独特图案。 在一种形式中，图案由具有特定间隙的蜡单滴组成，以使得该过程对于当前行业实践是透明的。 此外，单滴可以用于大小区域而没有任何显影时间差。 在至少一种形式中，间隙中的蜡图案和焊接掩模在显影期间被去除。