公开(公告)号：EP2121513A2

公开(公告)日：2009-11-25

申请号：EP08707208.8

申请日：2008-01-23

申请人： STMicroelectronics S.r.l.

发明人： BALDO, Lorenzo ,  COMBI, Chantal ,  CORTESE, Mario, Francesco

IPC分类号： B81B7/00 ,  G01L9/00 ,  G01L13/02 ,  G01D11/24

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: a substrate (2) provided with at least one passing opening (5), a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at least one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises: a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).

公开(公告)号：EP1945561A2

公开(公告)日：2008-07-23

申请号：EP06777802.7

申请日：2006-07-14

申请人： STMicroelectronics S.r.l.

发明人： COMBI, Chantal ,  VIGNA, Benedetto ,  ZIGLIOLI, Federico Giovanni ,  BALDO, Lorenzo ,  MAGUGLIANI, Manuela ,  LASALANDRA, Ernesto ,  RIVA, Caterina

IPC分类号： B81B7/02

CPC分类号： B81B7/0061 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R1/04 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.

摘要翻译： 具有A衬底级组件的半导体材料的器件衬底具有顶面和外壳的第一集成器件，包括器件衬底内形成的掩埋空腔，并用悬浮在在顶面的接近掩埋空腔的膜。 甲封盖衬底耦合到所述顶面之上的器件衬底，以便覆盖所述第一集成器件在寻求做的膜上方提供第一空白空间的方式。 电接触元件电连接与所述衬底级组件的外部集成器件。 在一个实施例中，器件衬底至少集成设置有respectivement膜的进一步集成器件，和另外的空的空间，从所述第一空的空间流体地隔离，则在进一步的集成器件的respectivement膜提供。