公开(公告)号：EP2180772A4

公开(公告)日：2013-08-28

申请号：EP07807279

申请日：2007-09-13

Applicant: SUMITOMO BAKELITE CO

Inventor： KONDO MASAYOSHI ,  KATO MASAAKI ,  CHUMA TOSHIAKI ,  KOMIYATANI TOSHIO ,  IIDA TAKAHISA ,  KANEMASA KENICHI

IPC: H05K3/46

CPC classification number: H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2099036A4

公开(公告)日：2011-07-06

申请号：EP07859652

申请日：2007-12-20

Applicant: SUMITOMO BAKELITE CO

Inventor： OBATA HIROSHI ,  KOMIYATANI TOSHIO

IPC: H01B1/22 ,  C08K3/08 ,  C08K5/134 ,  C08L61/06 ,  C08L101/00

CPC classification number: H01B1/22 ,  C08K5/134 ,  C08L61/06 ,  C08L101/12 ,  H05K1/095

公开(公告)号：EP2071000A4

公开(公告)日：2011-01-12

申请号：EP07827837

申请日：2007-09-28

Applicant: SUMITOMO BAKELITE CO

Inventor： KOMIYATANI TOSHIO ,  HIRANO TAKASHI ,  MAEJIMA KENZOU ,  KATSURAYAMA SATORU ,  YAMASHIRO TOMOE

IPC: H05K3/46 ,  C09J7/00 ,  C09J133/20 ,  C09J163/00 ,  C09J171/08 ,  C09J201/06

CPC classification number: H05K3/4614 ,  C08L33/10 ,  C08L33/20 ,  C08L2666/04 ,  C09D133/06 ,  C09D133/20 ,  C09J7/10 ,  C09J163/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2203/0191 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511

Abstract: The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.