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公开(公告)号:EP2134415B1
公开(公告)日:2017-05-03
申请号:EP08731734.3
申请日:2008-03-07
发明人: AGRAWAL, Rajat , GREENBERG, Robert J. , HUMAYUN, Mark S. , LITTLE, James Singleton , MECH, Brian V. , NEYSMITH, Jordan Matthew , TALBOT, Neil Hamilton , ZHOU, Dao Min
IPC分类号: A61N1/05
CPC分类号: A61N1/05 , A61N1/0541 , A61N1/0543
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公开(公告)号:EP1949437A1
公开(公告)日:2008-07-30
申请号:EP06844265.6
申请日:2006-11-02
发明人: GREENBERG, Robert J. , TALBOT, Neil Hamilton , NEYSMITH, Jordan Matthew , OK, Jerry , JIANG, Honggang
CPC分类号: A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: An implantable hermetically sealed microelectronic device, and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition ('IBAD'), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
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公开(公告)号:EP1949437B1
公开(公告)日:2014-01-01
申请号:EP06844265.6
申请日:2006-11-02
发明人: GREENBERG, Robert J. , TALBOT, Neil Hamilton , NEYSMITH, Jordan Matthew , OK, Jerry , JIANG, Honggang
CPC分类号: A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
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