公开(公告)号：EP3125405A4

公开(公告)日：2018-07-04

申请号：EP15769352

申请日：2015-03-27

Applicant: TDK CORP

Inventor： SHIMBO NOBUYUKI ,  GOTOH MASASHI

IPC: H02K1/27 ,  H01F7/02

CPC classification number: H01F7/021 ,  G01R33/383 ,  H02K1/2706 ,  H02K1/2713 ,  H02K1/2786 ,  H02K15/03 ,  H02K2213/03

Abstract: This arcuate magnet piece (1) is provided with: coupling side surfaces (6, 7) which are coupled with other adjacently joined arcuate magnet pieces (1A); a curved inner peripheral surface (3); and a curved outer peripheral surface (2) which faces the inner peripheral surface (3). The coupling side surfaces (6, 7) are provided with tip surfaces (6a, 7a) which intersect, at prescribed angles (¸1, ¸2), tangents (T1, T2) to the direction of curvature of the outer peripheral surface (2). The coupling side surfaces (6, 7) are polarized such that, in cases when the gaps formed with the coupling side surfaces of the other arcuate magnet pieces (1A) are disposed so as to be substantially parallel, the magnetic poles of the other joined arcuate magnet pieces (1A) are different.

公开(公告)号：EP1020908A4

公开(公告)日：2003-08-20

申请号：EP98935341

申请日：1998-08-04

Applicant: TDK CORP

Inventor： GOTOH MASASHI ,  KANAZAWA JITSUO ,  YAMAMOTO SHUICHIRO

IPC: H03H9/145 ,  H01L23/10 ,  H01L23/498 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H01L23/12 ,  H03H9/02 ,  H05K1/11

CPC classification number: H05K3/403 ,  H01L23/10 ,  H01L23/49805 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H05K3/0052 ,  H05K3/244 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K2203/0723 ,  H01L2224/0401

Abstract: Resin-sealed surface mounting type electronic parts which are formed in such a way that an electronic part element (5) is mounted on a resin-made wiring board (1) and a sealed area having a cavity housing the element (5) is formed by bonding a lid member to the board (1) so as to cover the element (5), and then side-face electrodes (21) are formed in through conductive grooves provided inside the bonding surface of the cap member on the board (1). Plated layers in the through conductive grooves have conductors (10 and 11) on the upper and lower surfaces of the board (1) each constituted of two or more kinds of metallic layers containing a plated gold layer (13) formed as the uppermost layer and a plated copper layer (12) and connected to the peripheral edges of the conductive grooves. On the upper conductor (10), however, only the plated copper layer (12) is formed and the other plated layers including the gold layer (13) are not formed on the conductor (10) so as to improve the reliability of the adhesion between the board (1) and cap member. Therefore, the reliability of the adhesion between the board (1) and the cap member for forming the sealed area having a cavity housing the element (5) is improved and the reliability of the airtight sealing of the element (5) is improved.

Abstract translation: 电子元件5安装在树脂布线基板1上，盖构件1以布线基板1的方式接合以覆盖电子元件5，从而构成电子元件5容纳的封装区域， 其内部具有空腔，侧电极21由设置在所述布线基板上的盖构件接合面中的导电贯通槽形成。 所述导电通槽内的镀层由至少两层金属层构成，所述金属层包括作为最上层的Au镀层13和Cu镀层12，并且具有与所述导电通槽的周向周边连接的导体10和11 所述布线基板1的上表面和下表面，同时在导体10上形成单独的Cu镀层12，并且在上表面上不形成包括Au镀层13的其它镀层，以提高接合的可靠性。 提高构成围绕电子元件的封装区域并且具有空腔的树脂布线基板和盖构件的粘合的可靠性，并且提高了气密密封的可靠性。