公开(公告)号：EP2490004A1

公开(公告)日：2012-08-22

申请号：EP09850381.6

申请日：2009-10-14

申请人： Tohoku University ,  Kabushiki Kaisha Toyota Chuo Kenkyusho ,  Toyota Jidosha Kabushiki Kaisha

发明人： MUROYAMA, Masanori ,  ESASHI, Masayoshi ,  TANAKA, Shuji ,  MATSUZAKI, Sakae ,  MAKIHATA, Mitsutoshi ,  NONOMURA, Yutaka ,  FUJIYOSHI, Motohiro ,  NAKAYAMA, Takahiro ,  YAMADA, Hitoshi ,  YAMAGUCHI, Ui

IPC分类号： G01L5/16 ,  G01L5/00

CPC分类号： G01L5/228 ,  G01L1/142 ,  G01L1/144 ,  G01L1/146 ,  G06F3/0414

摘要： Provided are multiple normal stress detection sensor units 300 capable of detecting a normal stress, and a sheet layer portion 200. The sheet layer portion 200 includes an exterior sheet layer portion 210, a force detection sheet layer portion 230 incorporating normal stress detection units 300, and an intermediary layer 220 sandwiched between the exterior sheet layer portion 210 and the force detection sheet layer portion 230. The exterior sheet layer portion 210 and the force detection sheet layer portion 230 include multiple protrusions 212 and 232 protruding in directions opposed to each other, and are disposed such that the protrusions 212 and 232 engage each other with the intermediary layer 220 interposed therebetween. Each normal stress detection sensor unit 300 includes a central portion detection sensor device 310 disposed immediately below a central portion of the protrusions 232 provided on the force detection sheet portion 230, and at least two edge detection sensor devices 321 to 324 disposed immediately below edge portions of the protrusion 232 provided on the force detection sheet portion 230.

摘要翻译： 提供能够检测法向应力的多个法向应力检测传感器单元300和片层部分200.片层部分200包括外部片层部分210，包含法向应力检测单元300的力检测片层部分230， 以及夹在外部片层部210和力检测用片层部230之间的中间层220.外部片层部210和力检测片层部230具有在彼此相反的方向突出的多个突起212,232， 并且被布置成使得突起212和232彼此接合，中间层220插入其间。 每个法向应力检测传感器单元300包括设置在力检测片部分230上的突起232的中心部分的正下方的中心部分检测传感器装置310，以及至少两个边缘检测传感器装置321至324， 设置在力检测片部230上的突起232。

公开(公告)号：EP2490001B1

公开(公告)日：2016-12-14

申请号：EP09850379.0

申请日：2009-10-14

申请人： Tohoku University ,  Kabushiki Kaisha Toyota Chuo Kenkyusho ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： MUROYAMA, Masanori ,  ESASHI, Masayoshi ,  TANAKA, Shuji ,  MATSUZAKI, Sakae ,  MAKIHATA, Mitsutoshi ,  NONOMURA, Yutaka ,  FUJIYOSHI, Motohiro ,  NAKAYAMA, Takahiro ,  YAMAGUCHI, Ui ,  YAMADA, Hitoshi

IPC分类号： G01L1/00 ,  G01L5/00 ,  G06F13/362 ,  H04L12/413

CPC分类号： H04L12/40032 ,  G01L1/142 ,  G01L1/146 ,  G01L5/228 ,  G06F13/376 ,  H04L12/40013

摘要： A touch sensor system 100 includes buses 110, a plurality of touch sensor devices 200 disposed on the buses 110, and an information integrating device 140 that is connected to all the buses 110 and integrates information from the touch sensor device 200. The touch sensor device 200 includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

公开(公告)号：EP2490001A1

公开(公告)日：2012-08-22

申请号：EP09850379.0

申请日：2009-10-14

申请人： Tohoku University ,  Kabushiki Kaisha Toyota Chuo Kenkyusho ,  Toyota Jidosha Kabushiki Kaisha

发明人： MUROYAMA, Masanori ,  ESASHI, Masayoshi ,  TANAKA, Shuji ,  MATSUZAKI, Sakae ,  MAKIHATA, Mitsutoshi ,  NONOMURA, Yutaka ,  FUJIYOSHI, Motohiro ,  NAKAYAMA, Takahiro ,  YAMAGUCHI, Ui ,  YAMADA, Hitoshi

IPC分类号： G01L1/00 ,  G01L5/00 ,  G06F13/362 ,  H04L12/413

CPC分类号： H04L12/40032 ,  G01L1/142 ,  G01L1/146 ,  G01L5/228 ,  G06F13/376 ,  H04L12/40013

摘要： A touch sensor system 100 includes buses 110, a plurality of touch sensor devices 200 disposed on the buses 110, and an information integrating device 140 that is connected to all the buses 110 and integrates information from the touch sensor device 200. The touch sensor device 200 includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

摘要翻译： 触摸传感器系统100包括总线110，布置在总线110上的多个触摸传感器装置200以及连接到所有总线110并且集成来自触摸传感器装置200的信息的信息集成装置140.触摸传感器装置 200包括传感器单元和信号处理单元，其通过总线将通过处理模拟传感器信号而生成的传感器数据信号发送到信息积分装置。 信号处理单元包括数字转换单元，当传感器值超过预设阈值时给出信号处理的开始许可的阈值评估单元，将传感器信号加上发射机标识号的ID添加单元和数据 发送单元，其将传感器数据信号输出到总线的信号线。 快速响应成为可能，而不增加数据量和主机处理负载，同时包含许多触摸传感器元件。

公开(公告)号：EP2490004B1

公开(公告)日：2016-03-23

申请号：EP09850381.6

申请日：2009-10-14

申请人： Tohoku University ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： MUROYAMA, Masanori ,  ESASHI, Masayoshi ,  TANAKA, Shuji ,  MATSUZAKI, Sakae ,  MAKIHATA, Mitsutoshi ,  NONOMURA, Yutaka ,  FUJIYOSHI, Motohiro ,  NAKAYAMA, Takahiro ,  YAMADA, Hitoshi ,  YAMAGUCHI, Ui

IPC分类号： G01L5/16 ,  G01L5/00 ,  G01L5/22 ,  G01L1/14 ,  G06F3/041

CPC分类号： G01L5/228 ,  G01L1/142 ,  G01L1/144 ,  G01L1/146 ,  G06F3/0414

公开(公告)号：EP2500704A1

公开(公告)日：2012-09-19

申请号：EP10823197.8

申请日：2010-10-13

申请人： Tohoku University ,  Toyota Jidosha Kabushiki Kaisha

发明人： TANAKA, Shuji ,  ESASHI, Masayoshi ,  MUROYAMA, Masanori ,  MATSUZAKI, Sakae ,  MAKIHATA, Mitsutoshi ,  NONOMURA, Yutaka ,  FUJIYOSHI, Motohiro ,  NAKAYAMA, Takahiro ,  YAMAGUCHI, Ui ,  YAMADA, Hitoshi

IPC分类号： G01L5/00 ,  G01L1/14 ,  H01L23/12 ,  H01L25/00 ,  H01L29/84

CPC分类号： B81C1/00238 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/0792 ,  G01L1/146 ,  G01L1/148 ,  G01L5/228 ,  H01L23/10 ,  H01L24/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00

摘要： Provided is a technique for packaging a sensor structure (300) having a contact sensing surface and a signal processing LSI (420) that processes a sensor signal. The sensor structure (300) has the contact sensing surface and sensor electrodes (320, 330). The signal processing integrated circuit (420) is embedded in a semiconductor substrate (400). The sensor structure (300) and the semiconductor substrate (400) are bonded by a bonding layer (500), forming a sensor device (200) as a single chip. The sensor electrodes (320, 330) and the integrated circuit (420) are sealed inside the sensor device (200), and the sensor electrodes (320, 330) and external terminals of the integrated circuit (420) are led out to the back surface of the semiconductor substrate (400) through a side surface of the semiconductor substrate (400).

摘要翻译： 提供了一种用于封装具有接触感测表面的传感器结构（300）和处理传感器信号的信号处理LSI（420）的技术。 传感器结构（300）具有接触感测表面和传感器电极（320,330）。 信号处理集成电路（420）嵌入在半导体衬底（400）中。 传感器结构（300）和半导体衬底（400）通过接合层（500）接合，形成作为单个芯片的传感器装置（200）。 传感器电极（320,330）和集成电路（420）被密封在传感器装置（200）内部，并且集成电路（420）的传感器电极（320,330）和外部端子被引出到背面 半导体衬底（400）的表面通过半导体衬底（400）的侧表面。