公开(公告)号：EP3276415A1

公开(公告)日：2018-01-31

申请号：EP16768697.1

申请日：2016-03-18

申请人： Toray Industries, Inc.

发明人： SHOJI, Yu ,  MASUDA, Yuki ,  KOYAMA, Yutaro ,  OKUDA, Ryoji

IPC分类号： G03F7/023 ,  C08G69/26 ,  G03F7/20

CPC分类号： C08G69/26 ,  C08K5/38 ,  C08K5/39 ,  C08L79/02 ,  G03F7/023 ,  G03F7/20 ,  H01L21/02118

摘要： A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

摘要翻译： 提供一种能够提供具有低应力性，高伸长率和对金属材料的优异粘合性的固化膜，其中包括铜的高灵敏度光敏树脂组合物。 一种感光性树脂组合物，其含有具有来源于脂肪族二胺的有机基团的碱可溶性树脂。

公开(公告)号：EP3363843A1

公开(公告)日：2018-08-22

申请号：EP16855238.8

申请日：2016-09-21

申请人： Toray Industries, Inc.

发明人： MASUDA, Yuki ,  SHOJI, Yu ,  ISOBE, Kimio ,  OKUDA, Ryoji

IPC分类号： C08G73/10 ,  G03F7/20

CPC分类号： C08G73/10 ,  G03F7/20

摘要： A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

公开(公告)号：EP3358407A1

公开(公告)日：2018-08-08

申请号：EP16851263.0

申请日：2016-09-20

申请人： Toray Industries, Inc.

发明人： SHOJI, Yu ,  MASUDA, Yuki ,  ISOBE, Kimio ,  OKUDA, Ryoji

IPC分类号： G03F7/023 ,  C08G69/02 ,  G03F7/20 ,  G03F7/40

CPC分类号： G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/023 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

摘要： Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.