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公开(公告)号:EP3476515A3
公开(公告)日:2019-05-22
申请号:EP18201946.3
申请日:2018-10-23
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , TE Connectivity Germany GmbH , MEAS France , Kunshan League Automechanism Co., Ltd. , Shenzhen AMI Technology Co. Ltd
发明人: DENG, Yingcong , ZHANG, Dandan , HU, Lvhai , GLASER, Karlheinz , SKURJATIN, Valentin , BOUMEDDANE, Hamza , WIECHERT, Sebastian , PECQUET, Nicolas Christophe R , BROCH, Eric , LIU, Yun , LU, Roberto Francisco-Yi , WU, Haidong , ZENG, Qinglong
摘要: A soldering system includes a first robot (100), a second robot (210), a fixation device (300) and a vision system (210). When the alignment tolerance between a first lead (11) and a second lead (12) detected by the vision system is larger than a predetermined tolerance value, the first robot moves at least one of the first lead and the second lead by a first tool (110) to reduce the alignment tolerance; when the alignment tolerance between the first lead and the second lead detected by the vision system is within the predetermined tolerance value, the first robot presses or holds the first lead and the second lead by a second tool (120); and when the alignment tolerance between the first lead and the second lead is within the predetermined tolerance value and the first lead and the second lead have been pressed or held by the second tool, the second robot moves a laser solder head (220) to a predetermined position under guidance of the vision system, and solders the first lead and the second lead together by the laser solder head. The soldering system may automatically complete operation of soldering the first lead and the second lead together.
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公开(公告)号:EP3476515A2
公开(公告)日:2019-05-01
申请号:EP18201946.3
申请日:2018-10-23
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , TE Connectivity Germany GmbH , MEAS France , Kunshan League Automechanism Co., Ltd. , Shenzhen AMI Technology Co. Ltd
发明人: DENG, Yingcong , ZHANG, Dandan , HU, Lvhai , GLASER, Karlheinz , SKURJATIN, Valentin , BOUMEDDANE, Hamza , WIECHERT, Sebastian , PECQUET, Nicolas Christophe R , BROCH, Eric , LIU, Yun , LU, Roberto Francisco-Yi , WU, Haidong , ZENG, Qinglong
摘要: A soldering system includes a first robot (100), a second robot (210), a fixation device (300) and a vision system (210). When the alignment tolerance between a first lead (11) and a second lead (12) detected by the vision system is larger than a predetermined tolerance value, the first robot moves at least one of the first lead and the second lead by a first tool (110) to reduce the alignment tolerance; when the alignment tolerance between the first lead and the second lead detected by the vision system is within the predetermined tolerance value, the first robot presses or holds the first lead and the second lead by a second tool (120); and when the alignment tolerance between the first lead and the second lead is within the predetermined tolerance value and the first lead and the second lead have been pressed or held by the second tool, the second robot moves a laser solder head (220) to a predetermined position under guidance of the vision system, and solders the first lead and the second lead together by the laser solder head. The soldering system may automatically complete operation of soldering the first lead and the second lead together.
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公开(公告)号:EP3477798A1
公开(公告)日:2019-05-01
申请号:EP18202092.5
申请日:2018-10-23
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , TE Connectivity Germany GmbH , MEAS France , Kunshan League Automechanism Co., Ltd. , Shenzhen AMI Technology Co., Ltd
发明人: DENG, Yingcong , ZHANG, Dandan , HU, Lvhai , GLASER, Karlheinz , SKURJATIN, Valentin , BOUMEDDANE, Hamza , WIECHERT, Sebastian , PECQUET, Nicolas Christophe R , BROCH, Eric , LIU, Yun , LU, Roberto Francisco-Yi , WU, Haidong , ZENG, Qinglong
摘要: An assembly system, includes: an assembly mechanism comprising a fixation device for fixing a housing and a first lead assembly mechanism and a second lead assembly mechanism provided at both sides of the fixation device, respectively, wherein the first lead assembly mechanism is adapted to insert a first lead into the housing, the second lead assembly mechanism is adapted to insert a second lead into the housing, and the first lead is inserted into the housing before the second lead. The assembly system further comprises a pressing mechanism adapted to hold the first lead inserted into the housing at a correct installation position, so as to prevent the first lead from being offset from its correct installation position and hindering operation of inserting the second lead during inserting the second lead. The assembly system may automatically complete the task of assembling the first lead and the second lead into the housing, improving the efficiency of inserting the leads into the housing, and increasing the quality of the assembly product.
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公开(公告)号:EP3163984B1
公开(公告)日:2018-08-08
申请号:EP16195933.3
申请日:2016-10-27
申请人: Tyco Electronics (Dongguan) Ltd. , Tyco Electronics (Shanghai) Co., Ltd. , Shenzhen AMI Technology Co. Ltd , TE Connectivity Germany GmbH
CPC分类号: H05K3/403 , B23K1/0016 , B23K1/20 , B23K3/08 , H05K1/117 , H05K3/101 , H05K3/3405 , H05K2201/09381 , H05K2201/09745 , H05K2201/10287 , H05K2203/0165 , H05K2203/0195 , H05K2203/0278 , H05K2203/0392 , H05K2203/1105 , H05K2203/16
摘要: The present disclosure discloses pre-tin system shaping system and method. The pre-tin shaping system is adapted to shape a pre-tin on a pad (5) of a circuit board (4). The pre-tin shaping system includes: a board holding unit (2) for securely holding the circuit board; a heat-press unit (1) for performing a heat-press operation to the pre-tin on the pad of the circuit board so as to shape the pre-tin; and a motion unit (3) for moving the heat-press unit relative to the board holding unit; wherein the heat-press unit includes a heat presser (10) for shaping the pre-tin on the pad of the circuit board. With the pre-tin system shaping system and method provided herein, by performing a shaping operation to the pre-tin on the pad of the circuit board, position of an electrical contact on the pad of the circuit board during soldering will be precisely controlled, thereby guaranteeing soldering quality and reducing a risk of dry joint or faulty joint and the like.
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公开(公告)号:EP3257618A1
公开(公告)日:2017-12-20
申请号:EP17173364.5
申请日:2017-05-30
申请人: Tyco Electronics (Shanghai) Co., Ltd. , Measurement Specialties (Chengdu) Ltd , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人: DENG, Yingcong , GONG, Lan , YING, Qian , ZHANG, Dandan , HU, Lvhai , LIU, Yun , ZENG, Qinglong , YAN, Yong , LU, Roberto Francisco-Yi
IPC分类号: B23K37/053 , B23K26/21 , B23K26/08 , B23K26/042 , B23K26/03 , B23K101/32
CPC分类号: B23K26/22 , B23K26/032 , B23K26/042 , B23K26/0853 , B23K26/123 , B23K26/1435 , B23K26/21 , B23K37/0452 , B23K37/053 , B23K2201/32
摘要: A welding system configured to weld a first elongated element (10) and a second elongated element (20) together, and comprising: a first moving mechanism (510); a first fixture (410) adapted to fix the first elongated element (10); a second moving mechanism (520); a second fixture (420) adapted to fix the second elongated element (20); and a laser welding head (100) adapted to emit a laser beam (110), wherein the first fixture (410) is mounted on the first moving mechanism (510), and the first moving mechanism (510) is configured to move the first fixture (410), so that the first elongated element (10) fixed on the first fixture (410) is aligned with the second elongated element (20) fixed on the second fixture (420), and wherein the first moving mechanism (510) and the second fixture (420) are mounted on the second moving mechanism (520), and the second moving mechanism (520) is configured to move the first moving mechanism (510) and the second fixture (420), so that an ideal welding center point (C') of the aligned first and second elongated elements (10, 20) is accurately located at a focal point (C) of the laser beam (110) from the laser welding head (100). The ideal welding center point of the aligned first and second elongated elements may be quickly and accurately moved to the focal point of the laser beam emitted from the laser welding head by the second moving mechanism.
摘要翻译: 一种焊接系统,其被配置成将第一细长元件(10)和第二细长元件(20)焊接在一起,并且包括:第一移动机构(510);以及第二移动机构 适于固定所述第一细长元件(10)的第一固定件(410); 第二移动机构(520); 适于固定第二细长元件(20)的第二固定件(420); 和适于发射激光束(110)的激光焊接头(100),其中所述第一固定装置(410)安装在所述第一移动机构(510)上,并且所述第一移动机构(510)构造成移动所述第一固定装置 使得固定在第一固定件410上的第一细长元件10与固定在第二固定件420上的第二细长元件20对齐, 和第二固定件(420)安装在第二移动机构(520)上,并且第二移动机构(520)构造成移动第一移动机构(510)和第二固定件(420),从而理想的焊接 对准的第一和第二细长元件(10,20)的中心点(C')精确地位于来自激光焊接头(100)的激光束(110)的焦点(C)处。 对齐的第一和第二细长元件的理想焊接中心点可以通过第二移动机构快速且准确地移动到从激光焊接头发射的激光束的焦点。
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公开(公告)号:EP3315900B1
公开(公告)日:2019-09-04
申请号:EP17198913.0
申请日:2017-10-27
申请人: Tyco Electronics (Shanghai) Co., Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
IPC分类号: G01B11/06
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公开(公告)号:EP3338123A1
公开(公告)日:2018-06-27
申请号:EP16763578.8
申请日:2016-08-17
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人: XIE, Fengchu , ZENG, Qinglong , ZHANG, Yu , ZHANG, Dandan , HU, Lvhai , LU, Roberto Francisco-Yi
IPC分类号: G02B6/38
CPC分类号: G02B6/3861 , G02B6/3843 , G02B6/3866 , G02B6/3885 , G02B6/4226
摘要: An automatic injection system for injecting an adhesive into a plurality of bores of a multi-bore ferrule comprises an injector, a first clamp holding the ferrule at a first adhesive injection station, and a second clamp holding the ferrule at a second adhesive injection station. The injector injects the adhesive into an injection opening in the ferrule. A plurality of optical fibers are not disposed in the bores of the ferrule and the injector injects the adhesive into the ferrule until the bores are fully filled with the adhesive at the first adhesive injection station. The optical fibers are disposed in the bores of the ferrule filled with the adhesive and the injector again injects the adhesive into the ferrule at the second adhesive station to compensate for a loss of adhesive during an insertion of the optical fibers into the bores.
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公开(公告)号:EP3338118A1
公开(公告)日:2018-06-27
申请号:EP16760794.4
申请日:2016-08-17
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
发明人: XIE, Fengchu , ZENG, Qinglong , ZHANG, Yu , ZHANG, Dandan , HU, Lvhai , LU, Roberto Francisco-Yi
IPC分类号: G02B6/25
CPC分类号: B08B1/008 , B08B3/02 , B08B2240/02 , G02B6/25 , G02B6/3866 , G02B6/3885 , G02B6/4403
摘要: An automatic fiber cleaning system comprises a first cleaning module, a second cleaning module, and a sprayer. Each of the first cleaning module and the second cleaning module has a cleaning belt, a driven belt wheel on which an unused portion of the cleaning belt is wound, a driving belt wheel on which a used portion of the cleaning belt is wound, and a pressing tool on which the cleaning belt is tightened. The sprayer sprays a cleaning agent onto the cleaning belts. The pressing tools press the cleaning belts on both sides of an optical fiber and clamp the optical fiber. The cleaning belts move relative to the optical fiber by the driving belt wheels to wipe the optical fiber.
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公开(公告)号:EP3315904B1
公开(公告)日:2019-08-07
申请号:EP17198960.1
申请日:2017-10-27
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公开(公告)号:EP3315904A1
公开(公告)日:2018-05-02
申请号:EP17198960.1
申请日:2017-10-27
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd
CPC分类号: G01B11/06 , G01B11/0691 , G01B21/042 , G01B2210/44 , G05B19/401
摘要: A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line; and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. In the present disclosure, the motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thereby, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without needing of debugging online. Thus, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.
摘要翻译: 1。一种厚度检测实验平台,其特征在于,包括:运动模拟模块,用于驱动待检测产品执行模拟所述产品在实际生产线上的各种运动的预定模拟运动; 以及厚度检测模块,适于检测由运动模拟模块驱动的产品的厚度。 在本公开中,运动模拟模块可以驱动待检测产品以模拟实际生产线上的产品的各种运动。 因此,实际生产线上的产品条件可以在实验室中模拟和复制。 因此,厚度检测实验平台可以在实验室离线调试,无需在线调试。 因此,实际生产线的正常生产不受影响,厚度检测实验平台的调试变得更容易。
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