-
1.发明公开METHOD FOR MANUFACTURING MULTILAYER FILM, AND MULTILAYER FILM 审中-公开VERFAHREN ZUR HERSTELLUNG EINER MEHRSCHICHIGEN FOLIE UND MEHRSCHICHTIGE FOLIE
公开(公告)号：EP3118347A4
公开(公告)日：2017-09-13
申请号：EP15761219
申请日：2015-03-03
申请人： ULVAC INC
发明人： KOBAYASHI HIROKI , HENMI MITSUNORI , HIROSE MITSUTAKA , TSUKAGOSHI KAZUYA , KIMURA ISAO , SUU KOUKOU
IPC分类号： C23C14/08 , C23C14/18 , C23C14/35 , H01L21/02 , H01L21/316 , H01L41/187 , H01L41/316 , H01L41/319
CPC分类号： H01L41/319 , C23C14/083 , C23C14/088 , C23C14/185 , C23C14/34 , C23C14/35 , H01L21/02197 , H01L21/02266 , H01L41/1876 , H01L41/316
-
2.发明公开
公开(公告)号：EP1662556A4
公开(公告)日：2012-05-09
申请号：EP04772141
申请日：2004-08-25
申请人： ULVAC INC
发明人： NISHIOKA YUTAKA , KAJINUMA MASAHIKO , YAMADA TAKAKAZU , MASUDA TAKESHI , UEMATSU MASAKI , SUU KOUKOU
IPC分类号： H01L21/316 , C23C16/40 , C23C16/448 , C23C16/452
CPC分类号： C23C16/4482 , C23C16/409 , C23C16/452 , H01L21/3165
-
公开(公告)号：EP2053643A4
公开(公告)日：2011-01-19
申请号：EP07791669
申请日：2007-07-31
申请人： ULVAC INC
发明人： MASUDA TAKESHI , KAJINUMA MASAHIKO , NISHIOKA YUTAKA , KIMURA ISAO , KIKUCHI SHIN , YAMADA TAKAKAZU , SUU KOUKOU
IPC分类号： H01L21/316
CPC分类号： H01L21/31691 , C04B35/491 , C04B2235/441 , C04B2235/787 , H01G4/1245 , H01G4/33 , H01L21/02197 , H01L21/02271 , H01L28/55 , H01L28/65 , H01L41/1876 , H01L41/316
-
公开(公告)号：EP2149899A4
公开(公告)日：2010-05-26
申请号：EP08777376
申请日：2008-06-19
申请人： ULVAC INC
发明人： KOKAZE YUTAKA , ENDOU MITSUHIRO , UEDA MASAHISA , SUU KOUKOU , MIYAZAKI TOSHIYA , NAKAMURA TOSHIYUKI
IPC分类号： H01L21/3065 , C23F4/00 , H01L21/683 , H01L21/8246 , H01L27/105
CPC分类号： H01L21/68735 , C23F4/00 , G11C11/22 , H01J37/321 , H01J37/32568 , H01J37/32642 , H01J37/3266 , H01J2237/022 , H01J2237/2001 , H01L21/31122 , H01L21/32136 , H01L21/67069 , H01L27/11507 , H01L27/1159
-
公开(公告)号：EP3163641A4
公开(公告)日：2018-02-28
申请号：EP15811571
申请日：2015-06-11
申请人： ULVAC INC
发明人： HIROSE MITSUTAKA , KOBAYASHI HIROKI , HENMI MITSUNORI , TSUKAGOSHI KAZUYA , TSUYUKI TATSURO , KIMURA ISAMU , SUU KOUKOU
IPC分类号： H01L41/319 , C23C14/08 , C23C14/34 , H01L41/047 , H01L41/29 , H01L41/316
CPC分类号： H01L41/0477 , C23C14/08 , C23C14/088 , C23C14/165 , C23C14/34 , C23C14/3464 , H01L41/0815 , H01L41/29 , H01L41/316 , H01L41/319
摘要： The present invention provides a technology for preventing the generation of a pyrochlore phase, which is an impurity phase, in forming a PZT thin film by sputtering, without using a conventional seed layer. The present invention provides a PZT thin film laminate including: a Si substrate 10; a TiOx layer 4 serving as a platinum-adhesion layer on the Si substrate 10; a Pt electrode layer 5 on the TiOx layer 4; a Ti thin film layer 6 on the Pt electrode layer 5; and a PZT thin film layer 7 on the Ti thin film layer 6. The Ti thin film layer 6 can have a thickness of 1 nm or more and 10 nm or less.
-
公开(公告)号：EP3159159A4
公开(公告)日：2018-01-17
申请号：EP15810304
申请日：2015-06-11
申请人： ULVAC INC
发明人： KOBAYASHI HIROKI , HENMI MITSUNORI , HIROSE MITSUTAKA , MASHIMA SHINNOSUKE , KIMURA ISAO , SUU KOUKOU
IPC分类号： B32B15/00 , B41J2/14 , C23C14/04 , C23C14/08 , C23C14/18 , C23C14/35 , C23C14/56 , C23C14/58 , H01L41/047 , H01L41/29 , H01L41/316
CPC分类号： H01L41/083 , B32B15/00 , B41J2/14 , C23C14/04 , C23C14/088 , C23C14/185 , C23C14/34 , C23C14/35 , C23C14/566 , C23C14/568 , C23C14/588 , H01L41/0471 , H01L41/0805 , H01L41/29 , H01L41/297 , H01L41/314 , H01L41/316
摘要： A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.
-
公开(公告)号：EP2466627A4
公开(公告)日：2015-06-24
申请号：EP10808085
申请日：2010-08-12
申请人： ULVAC INC
发明人： MORIKAWA YASUHIRO , SUU KOUKOU
IPC分类号： H01L21/3065
CPC分类号： H01L21/30655
-
公开(公告)号：EP2157601A4
公开(公告)日：2011-05-18
申请号：EP08764810
申请日：2008-05-28
申请人： ULVAC INC
发明人： UEDA MASAHISA , KOKAZE YUTAKA , ENDOU MITSUHIRO , SUU KOUKOU
IPC分类号： H01L21/3065 , H01L21/8246 , H01L27/105 , H01L41/187 , H01L41/22
CPC分类号： H01J37/32091 , H01J37/321 , H01J37/32862 , Y10S428/905
-
公开(公告)号：EP2063463A4
公开(公告)日：2010-11-24
申请号：EP07806776
申请日：2007-09-05
申请人： ULVAC INC
发明人： MORIKAWA YASUHIRO , SUU KOUKOU
IPC分类号： H01L21/3065
CPC分类号： H01J37/3266 , H01J37/32091 , H01J37/32642 , H01J2237/334
-
公开(公告)号：EP2148360A4
公开(公告)日：2010-07-21
申请号：EP08752425
申请日：2008-05-08
申请人： ULVAC INC
发明人： MORIKAWA YASUHIRO , SUU KOUKOU , HAYASHI TOSHIO , SATOU TADAYUKI
IPC分类号： H01L21/306 , H01L21/3065 , H01L41/18 , H01L41/22 , H01L41/332 , H03H3/02
CPC分类号： H01L21/306 , H01L41/332 , H03H3/02
摘要： A dry etching method by which a substrate can be dry-etched on both sides without a crack is provided. The dry etching method includes: introducing an etching gas having a fluorocarbon gas and a rare gas into a vacuum chamber; generating plasma in the vacuum chamber having a predetermined pressure; and etching a substrate to be processed adhered on an adhesive surface of a heat-conductive sheet disposed on a substrate table.
-
-
-
-
-
-
-
-
-
搜索结果
30 条记录 (耗时 0.01 秒)
