公开(公告)号：EP0734586A4

公开(公告)日：1998-10-14

申请号：EP95904304

申请日：1994-12-07

申请人： UNIV CALIFORNIA

发明人： SMITH JOHN S ,  YEH HSI-JEN J

IPC分类号： H01L21/302 ,  B65G49/02 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/02 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/50 ,  H01L21/52 ,  H01L21/58 ,  H01L21/677 ,  H01L21/68 ,  H01L21/78 ,  H01L21/98 ,  H01L23/13 ,  H01L23/14 ,  H01L25/04 ,  H01L25/065 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L29/06 ,  H01L29/88 ,  H01L33/20 ,  H01S5/022 ,  H01S5/40

CPC分类号： H01L24/95 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/6835 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/13 ,  H01L23/147 ,  H01L24/24 ,  H01L24/26 ,  H01L24/82 ,  H01L24/83 ,  H01L25/04 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L33/20 ,  H01L2221/68359 ,  H01L2224/24227 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/183 ,  H01L2924/00

摘要： A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks (19) self-align into recessed regions (55) located on a substrate (50) such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface (53) of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

摘要翻译： 一种制造包括集成电路装置的成形块的方法，包括以下步骤：提供具有顶表面（15）和背面的基底（10） 生长覆盖所述顶表面的牺牲层（13）; 形成覆盖所述顶表面的阻挡层; 以及掩模和蚀刻所述阻挡层直到所述牺牲层，在所述牺牲层上形成和接触所述牺牲层，形成多个成形块（19）。