公开(公告)号：EP4425546A1

公开(公告)日：2024-09-04

申请号：EP22886672.9

申请日：2022-10-11

申请人： Kyocera Corporation

发明人： SUZUKI, Yuki

IPC分类号： H01L25/04 ,  H01L25/18

CPC分类号： H01L25/18 ,  H01L25/04

摘要： An electronic element mounting substrate includes a base having a first element mounting region for mounting a light receiving element serving as a first electronic element and a second element mounting region for mounting a light emitting element serving as a second electronic element. The first element mounting region and the second element mounting region have different heights in a cross-sectional view.

公开(公告)号：EP1463116A3

公开(公告)日：2007-12-05

申请号：EP04014244.0

申请日：1994-12-07

申请人： The Regents of the University of California

发明人： Smith, John Stephen ,  Yeh, Hsi-Jen J.

IPC分类号： H01L25/16 ,  H01L25/075 ,  H01L21/58 ,  H01L23/13 ,  H01L21/78 ,  H01L27/15 ,  H01L33/00

CPC分类号： H01L24/95 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/6835 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/13 ,  H01L23/147 ,  H01L24/24 ,  H01L24/26 ,  H01L24/82 ,  H01L24/83 ,  H01L25/04 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L33/20 ,  H01L2221/68359 ,  H01L2224/24227 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/183 ,  H01L2924/00

摘要： A method of assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks (19) self-align into recessed regions (55) located on a substrate (50) such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the substrate, self-aligns, and engages into a recessed region.

公开(公告)号：EP0747948A2

公开(公告)日：1996-12-11

申请号：EP96109018.0

申请日：1996-06-05

申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

发明人： Smith, John Stephen ,  Yeh, Hsi-Jen J.

IPC分类号： H01L21/98 ,  H01L25/00

CPC分类号： H01L25/50 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/6835 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/13 ,  H01L23/147 ,  H01L24/24 ,  H01L24/26 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L25/04 ,  H01L25/0655 ,  H01L25/0753 ,  H01L29/0657 ,  H01L33/20 ,  H01L2221/68359 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01S5/0207 ,  H01S5/0215 ,  H01S5/0217 ,  Y10T29/49895 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then dispensed evenly or circulated over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

摘要翻译： 一种通过流体输送将微结构组装在基底上的方法和装置。 被成形的微结构块自对准到位于基底上的凹陷区域，使得微结构与衬底成为一体。 改进的方法包括将成形块转移到流体中以产生浆料的步骤。 然后将这样的浆料均匀地分配或在其上具有凹陷区域的基底的顶表面上循环。 通过形状和流体的微观结构滚动到基板的表面上，自对准并接合到凹陷区域中。

公开(公告)号：EP3407378A1

公开(公告)日：2018-11-28

申请号：EP16891488.5

申请日：2016-02-25

申请人： Mitsubishi Electric Corporation

发明人： YOSHIOKA, Hideharu ,  HIROTA, Akimichi ,  YONEDA, Naofumi ,  ISHIBASHI, Hidenori ,  SHINJO, Shintaro ,  ISHIDA, Kiyoshi ,  MORISHIGE, Hideki

IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L23/02 ,  H01L23/28 ,  H01L23/36 ,  H01L23/50 ,  H01L25/04 ,  H01L25/18

CPC分类号： H01L23/00 ,  H01L23/02 ,  H01L23/12 ,  H01L23/28 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/04 ,  H01L25/18 ,  H01L2224/48137 ,  H01L2224/48247

摘要： A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

公开(公告)号：EP3190616A1

公开(公告)日：2017-07-12

申请号：EP16155801.0

申请日：2016-02-16

申请人： Shandong Prosperous Star Optoelectronics Co., Ltd

发明人： MA, Wenbo ,  LIAO, Qiurong ,  KONG, Yiping ,  YUAN, Xincheng ,  ZHOU, Minkang

IPC分类号： H01L25/04 ,  H01L25/075

CPC分类号： F21K9/237 ,  F21K9/232 ,  F21K9/238 ,  F21V3/02 ,  F21V31/03 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L25/04 ,  H01L25/0753

摘要： This invention discloses a LED light with omnidirectional light distribution comprising a light-emitting bulb and a lamp holder connecting with the light-emitting bulb. The lamp holder is set with a power driver, and external thread is set outside the lamp holder. The light-emitting bulb comprises a shell, a stem set inside the shell and a light-emitting component. One end of the stem is connected with the said power driver, and the other end of the stem is connected with the light-emitting component. The said stem is set with the wire. The angle between bar-type LED filaments is adjusted by changing the set height of support pillar and the sectional area of magnetic connecting piece, and the distribution curve fluxes of bar-type LED filaments are adjusted to obtain the LED lights with different distribution curve fluxes and make them meet different use requirements. The electrode of bar-type LED filament is connected with the wire by spot welding. The magnetic connecting piece adsorbs the die bond substrate through magnetic force to reduce the frequency of spot welding during production of LED lights with omnidirectional light distribution and greatly improve productivity and yield rate of LED lights.

摘要翻译： 本发明公开了一种全向配光的LED灯，包括发光灯泡和与发光灯泡连接的灯座。 灯座安装有电源驱动器，灯头外部设有外螺纹。 发光灯泡包括外壳，设置在外壳内的灯杆和发光元件。 所述杆的一端与所述电源驱动器连接，所述杆的另一端与所述发光元件连接。 所述杆与线一起设置。 通过改变支柱的设置高度和磁性连接件的截面积，调整条形LED灯丝之间的角度，调整条形LED灯丝的分布曲线通量，得到不同分布曲线通量的LED灯 并使其符合不同的使用要求。 条形LED灯丝的电极通过点焊与导线连接。 磁性连接件通过磁力吸附芯片键合衬底，减少全光配光LED灯生产过程中的点焊频率，大大提高LED灯的生产率和成品率。

公开(公告)号：EP3096366A3

公开(公告)日：2016-12-28

申请号：EP15173493.6

申请日：2015-06-24

申请人： MediaTek, Inc

发明人： YU, Long-Kun ,  CHANG, Chin-Chiang ,  CHI, Chia-Wei ,  YEH, Chia-Feng ,  CHEN, Tai-Yu

IPC分类号： H01L35/28 ,  H01L23/38

CPC分类号： H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

摘要翻译： 本发明提供一种便携式电子系统。 便携式电子系统包括半导体封装。 半导体封装包括衬底。 半导体管芯耦合到衬底。 热电装置芯片靠近半导体管芯设置，耦合到衬底。 热电装置芯片被配置为检测从半导体管芯产生的热能并将热能转换成再循环的电能。 电力系统耦合到半导体封装，被配置为存储再循环的电能。

公开(公告)号：EP0734586A4

公开(公告)日：1998-10-14

申请号：EP95904304

申请日：1994-12-07

申请人： UNIV CALIFORNIA

发明人： SMITH JOHN S ,  YEH HSI-JEN J

IPC分类号： H01L21/302 ,  B65G49/02 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/02 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/50 ,  H01L21/52 ,  H01L21/58 ,  H01L21/677 ,  H01L21/68 ,  H01L21/78 ,  H01L21/98 ,  H01L23/13 ,  H01L23/14 ,  H01L25/04 ,  H01L25/065 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L29/06 ,  H01L29/88 ,  H01L33/20 ,  H01S5/022 ,  H01S5/40

CPC分类号： H01L24/95 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/6835 ,  H01L21/78 ,  H01L21/7813 ,  H01L23/13 ,  H01L23/147 ,  H01L24/24 ,  H01L24/26 ,  H01L24/82 ,  H01L24/83 ,  H01L25/04 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L33/20 ,  H01L2221/68359 ,  H01L2224/24227 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/183 ,  H01L2924/00

摘要： A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks (19) self-align into recessed regions (55) located on a substrate (50) such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface (53) of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.

摘要翻译： 一种制造包括集成电路装置的成形块的方法，包括以下步骤：提供具有顶表面（15）和背面的基底（10） 生长覆盖所述顶表面的牺牲层（13）; 形成覆盖所述顶表面的阻挡层; 以及掩模和蚀刻所述阻挡层直到所述牺牲层，在所述牺牲层上形成和接触所述牺牲层，形成多个成形块（19）。

公开(公告)号：EP0179714B1

公开(公告)日：1989-01-18

申请号：EP85402004.7

申请日：1985-10-16

申请人： THOMSON-CSF

发明人： Daubresse, Francis

IPC分类号： H01L25/04

CPC分类号： H01L25/04 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/371 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12043 ,  H01L2924/13033 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099

公开(公告)号：EP3096366A2

公开(公告)日：2016-11-23

申请号：EP15173493.6

申请日：2015-06-24

申请人： MediaTek, Inc

发明人： YU, Long-Kun ,  CHANG, Chin-Chiang ,  CHI, Chia-Wei ,  YEH, Chia-Feng ,  CHEN, Tai-Yu

IPC分类号： H01L35/28 ,  H01L23/38

CPC分类号： H01L35/32 ,  H01L22/34 ,  H01L23/04 ,  H01L23/12 ,  H01L23/20 ,  H01L23/38 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/04 ,  H01L35/28 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/18161 ,  H02J7/0052 ,  H01L2924/00012 ,  H01L2924/00

摘要： The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

摘要翻译： 本发明提供了一种便携式电子系统。 便携式电子系统包括半导体封装。 该半导体封装包括衬底。 半导体管芯耦合到衬底。 热电器件芯片靠近半导体管芯设置，耦合到衬底。 热电器件芯片被配置为检测从半导体管芯产生的热能并将热能转换成回收的电能。 电力系统被耦合到半导体封装，被配置为存储回收的电能。

公开(公告)号：EP2765600A4

公开(公告)日：2015-06-10

申请号：EP12837253

申请日：2012-06-18

申请人： ROHM CO LTD

发明人： OKUMURA KEIJI

IPC分类号： H01L25/04 ,  H01L23/495 ,  H01L25/18

CPC分类号： H01L25/072 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/09 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/04 ,  H01L25/18 ,  H01L27/0629 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/48139 ,  H01L2224/48157 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/4903 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/00015 ,  H01L2924/00012

摘要： Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of which is connected to a unipolar device, said semiconductor device being capable of improving the reliability of wire bonding. A package (4) includes a die pad (61), a source lead (63), a first MOSFET (11), and a first Schottky barrier diode (21). A source electrode (11 S ) of the first MOSFET (11), an anode electrode (21 A ) of the first Schottky barrier diode (21), and the source lead (63) are electrically connected by the bonding wire (31), one end of which is bonded to the source electrode (11 S ) of the first MOSFET (11), the other end of which is bonded to the source lead (63), and the center of which is bonded to the anode electrode (21 A ) of the first Schottky barrier diode (21).