摘要:
The specification describes techniques for applying solder bumps to IC chips. The solder bump sites are first provided with under bump metallization (UBM) for solder bump interconnections to the Al bonding sites on the IC chip. The substrate, i.e. the capping layer of the IC chip, is coated with photoresist and patterned to expose the UBM and a peripheral portion of the capping layer around the UBM. The solder paste is then applied and reflowed to form the solder bump. Since the photoresist hardens and becomes difficult to remove after the reflow step, a sacrificial buffer layer is interposed between the photoresist and the capping layer to facilitate removal of the photoresist without attacking the IC chip surface.
摘要:
In accordance with the invention, an optical waveguide (34) comprising a longitudinally extending core (12) housing an optical grating (16) and a cladding layer (14) peripherally surrounding the core (12), is provided with an outer surface (36) of the cladding layer having one or more height perturbations. Each perturbation forming a smooth and connected taper, the height with respect to the core (12) varying by at least 0.1 times a Bragg wavelength of the grating (16) over a length of the taper equal to 0.5 times the grating's length whose lateral extent is less than about 100 Bragg wavelengths. The perturbations suppress cladding mode spectra and reduce short wavelength cladding mode loss.
摘要:
A multifrequency laser that uses a waveguide grating router (42) as the filter for frequency control and encloses it within a structure that forms at each selected frequency two paths of slightly different lengths to create a DiDomenico-type of laser that uses a pair of coupled cavities for frequency control. In one embodiment two sets, each of N optical amplifiers (50), are used to create two resonant paths at each frequency. In other embodiments, a portion of the output power is made to travel a second path to provide the second optical path.