THERMAL TRANSFER DEVICE AND ASSOCIATED SYSTEMS AND METHODS
    9.
    发明公开
    THERMAL TRANSFER DEVICE AND ASSOCIATED SYSTEMS AND METHODS 审中-公开
    传热装置及相关系统和方法

    公开(公告)号:EP2534432A2

    公开(公告)日:2012-12-19

    申请号:EP11742997.7

    申请日:2011-02-14

    IPC分类号: F24J3/08 F25B30/06

    摘要: Embodiments of thermal transfer devices and associated systems and methods are disclosed herein. In one embodiment, a thermal transfer system can include a conduit that has an input portion, an output portion, and a sidewall between the input and output portions. Heat can enter the conduit at the input portion and exit the conduit at the output portion. The thermal transfer system can further include an end cap proximate to a terminus of the conduit. A working fluid can circulate through the conduit utilizing a vaporization-condensation cycle. The thermal transfer device can also include an architectural construct having a plurality of parallel layers of a synthetic matrix characterization of a crystal.