公开(公告)号：EP2658938A1

公开(公告)日：2013-11-06

申请号：EP11853387.6

申请日：2011-12-22

申请人： 3M Innovative Properties Company

发明人： CORREA ARANTES, Vanessa ,  YAMASIHITA, Mitsuo M.

IPC分类号： C09J7/02 ,  C09J7/04 ,  C09J109/02

CPC分类号： C09J7/0214 ,  C08K3/013 ,  C08K3/26 ,  C08K3/34 ,  C08L9/02 ,  C08L57/02 ,  C08L2205/025 ,  C08L2205/03 ,  C09J7/383 ,  C09J11/02 ,  C09J11/04 ,  C09J11/08 ,  C09J109/02 ,  C09J2427/006

摘要： Pressure sensitive tape for anticorrosion steel pipe protection used primarily in cases of repair and maintenance, comprising vinyl base-tape laminated with a nitrile rubber-based adhesive of the following composition: about 30.7 to about 34.0% (w/w) solid butadiene acrylonitrile rubber (NBR); about 0.57 to about 0.63% (w/w) antioxidant; about 9.7 to about 12.9% (w/w) hydrocarbon resin; about 1.52 to about 1.68% (w/w) zinc oxide; about 8.7 to about 9.5% (w/w) liquid butadiene acrylonitrile rubber. (NBR); about 4.0 to about 4.4% (w/w) aluminium hydrosilicate; about 5.5 to about 7.5% (w/w) diisononyl phthalate; about 0.66 to about 0.74% (w/w) carbon black; about 1.5 to about 1.7% (w/w) amorphous silica; and about 25.8 to about 38.8% (w/w) magnesium and calcium carbonate. The tape exhibits a good ability to conform to irregular surfaces, good elasticity, good impact resistance, excellent pipe adhesion and good cathodic detachment. The tape is ideally used in conjunction with a primer that improves adhesion between the pipe and the adhesive portion of the tape.

公开(公告)号：EP2194105B1

公开(公告)日：2013-05-08

申请号：EP08833717.5

申请日：2008-09-05

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： HISHA, Yuki ,  YODA, Kimihiko

IPC分类号： C09J4/00 ,  C08F2/48 ,  C09J5/00 ,  C09J11/06 ,  C09J109/02 ,  C09J133/20 ,  C08L9/02 ,  C08L33/08 ,  C08L33/10 ,  C08L33/12 ,  C09J109/00 ,  C09J4/06 ,  C08L9/00

CPC分类号： C09J109/02 ,  C08K5/098 ,  C08K5/14 ,  C08K5/17 ,  C08K5/29 ,  C08L9/02 ,  C08L33/20 ,  C08L2666/04 ,  C09J4/06

摘要： To provide an adhesive composition having high adhesion and quick curing properties on the second time scale, and having a high retention in a durability test such as a high temperature and high humidity test. A two-part type adhesive composition which comprises a first agent comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second agent comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, preferably, an adhesive composition wherein the first agent contains a photopolymerization initiator, and a bonding method using it.

公开(公告)号：EP1659161B1

公开(公告)日：2011-11-23

申请号：EP03816006.5

申请日：2003-08-27

申请人： NOK CORPORATION

发明人： FUKASAWA, Kiyofumi, NOK Corporation ,  KAISE, Tomohiro, NOK Corporation

IPC分类号： C09J165/00 ,  C09J161/08 ,  C09J109/02 ,  B32B15/06 ,  B32B25/14

CPC分类号： C09J109/02 ,  B32B15/06 ,  C08L9/02 ,  C08L23/286 ,  C08L27/04 ,  C08L61/06 ,  C08L65/04 ,  C08L2666/02 ,  C08L2666/06 ,  C08L2666/12 ,  C08L2666/16 ,  C08L2666/22 ,  C09J123/286 ,  C09J161/06 ,  C09J165/04 ,  Y10T428/31688 ,  Y10T428/31696

摘要： A vulcanizable adhesive composition, which comprises 100 parts by weight of phenolxylylene resin or phenolbiphenyl resin, 10 to 1,000 parts by weight of resol-type phenol resin, 0 to 1,000 parts by weight of novolak-type phenol resin, 10 to 1,000 parts by weight of unvulcanized nitrile rubber and 10 to 500 parts by weight of chlorinated polyethylene, is effectively applied to (hydrogenated) nitrile rubber with a nitrile content of 18 to 48%, and has a suppression effect on a decrease in the adhesiveness even if exposed to dip in various cryogenic liquids such as flon gas, polyalkylene glycol, water, etc. for a long time.

公开(公告)号：EP1048709A1

公开(公告)日：2000-11-02

申请号：EP99949415.6

申请日：1999-10-26

申请人： Mitsui Chemicals, Inc.

发明人： YAMASAKI, Susumu Mitsui Chemicals Inc. ,  SUETSUGU, Toshio Mitsui Chemicals Inc. ,  SOEJIMA, Wataru Mitsui Chemicals Inc. ,  ISHIGURO, Masaharu Mitsui Chemicals Inc.

IPC分类号： C09J163/00 ,  C09J109/02 ,  C09J161/10 ,  H05K1/03

CPC分类号： H05K3/386 ,  C08L2666/02 ,  C08L2666/14 ,  C08L2666/28 ,  C09J109/02 ,  C09J163/00 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0355

摘要： An adhesive composition comprising (1) a phosphoric acid ester specified by general formula (I), (2) a phenolic hydroxyl-containing aromatic compound having a softening point of 60 to 200°C, (3) an epoxy resin and (4) a carboxyl-containing nitrile-butadine rubber, a ratio of the components (2), (3) and (4) being 0 . The composition is suitable for use in a printed circuit board, especially for a flexible printed circuit board.
The invention also provides a flexible printed circuit board prepared by using the adhesive composition.

摘要翻译： （1）通式（I）所示的磷酸酯，（2）软化点为60〜200℃的含酚羟基的芳香族化合物，（3）环氧树脂和（4） （2），（3）和（4）的比例为0 <组分（2）/（组分（3）+组分（4））<1的含羧基腈 - 丁二烯橡胶。 该组合物适用于印刷电路板，特别是用于柔性印刷电路板。 本发明还提供了一种使用该粘合剂组合物制备的柔性印刷电路板。

公开(公告)号：EP0361975B1

公开(公告)日：1995-05-24

申请号：EP89310015.6

申请日：1989-09-29

申请人： TOMOEGAWA PAPER CO. LTD.

发明人： Sakumoto, Yukinori c/o Tomoegawa Paper Co., Ltd. ,  Yokoyama, Shigeyuki c/o Tomoegawa Paper Co., Ltd. ,  Shibuya, Akihiro c/o Tomoegawa Paper Co., Ltd. ,  Koshimura, Atsushi c/o Tomoegawa Paper Co., Ltd.

IPC分类号： C09J7/02 ,  C09J161/06 ,  C09J109/02

CPC分类号： H01L23/49558 ,  C08L9/02 ,  C08L79/08 ,  C08L2666/02 ,  C08L2666/16 ,  C09J7/21 ,  C09J7/22 ,  C09J7/25 ,  C09J7/38 ,  C09J109/02 ,  C09J121/02 ,  C09J161/06 ,  C09J2201/122 ,  C09J2479/086 ,  H01L2924/0002 ,  Y10T29/49208 ,  Y10T156/1093 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/31721 ,  H01L2924/00

摘要： An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising (i) a resol type phenol resin, and (ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

公开(公告)号：EP0192365B1

公开(公告)日：1992-04-15

申请号：EP86300640.9

申请日：1986-01-30

申请人： Hitachi Chemical Co., Ltd.

发明人： Takahashi, Hiroshi ,  Morozumi, Naohiro ,  Takanezawa, Shin ,  Nakao, Kiyoshi

IPC分类号： C09J161/06 ,  C09J161/34

CPC分类号： H05K3/387 ,  C08G8/24 ,  C08L9/02 ,  C08L2666/08 ,  C08L2666/16 ,  C09J109/02 ,  C09J161/06 ,  C09J161/34 ,  H05K3/181 ,  H05K2201/0133 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31688 ,  Y10T428/31877 ,  Y10T428/31935 ,  Y10T428/31942

摘要： An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.

公开(公告)号：EP4435173A1

公开(公告)日：2024-09-25

申请号：EP22892910.5

申请日：2022-11-11

申请人： Kuraray Co., Ltd.

发明人： ASADA, Toru ,  ISHIDA, Eiichi ,  WASHITAKE, Yosuke

IPC分类号： D06M15/693 ,  B60C9/00 ,  C09J11/06 ,  C09J109/02 ,  D06M13/17 ,  D06M13/395 ,  D06M15/55

CPC分类号： B60C9/00 ,  C09J11/06 ,  C09J109/02 ,  D06M13/17 ,  D06M13/395 ,  D06M15/55 ,  D06M15/693

摘要： Provided are reinforcing fibers using an adhesive component that does not contain resorcin and formalin, particularly reinforcing fibers that are excellent in adhesiveness to a high-polar rubber adherend, a method for producing the same, and an elastomer product using the reinforcing fibers. Reinforcing fibers include an adhesive layer formed from an adhesive component containing a liquid conjugated diene-based rubber and a crosslinking agent on at least a part of a fiber surface, and a solubility parameter (SP value) of the liquid conjugated diene-based rubber that is calculated by a Fedors method is larger than 9.0 (cal/cm3)1/2.

公开(公告)号：EP3323837A1

公开(公告)日：2018-05-23

申请号：EP16830591.0

申请日：2016-07-28

申请人： Denka Company Limited

发明人： MIYAZAKI, Hayato ,  FUKAO, Kenji ,  UNO, Hiroki ,  GOTO, Yoshitsugu

IPC分类号： C08F2/44 ,  C09J4/02 ,  C09J11/00 ,  C09J109/02 ,  C09J157/04

CPC分类号： C09J4/06 ,  C08F2/44 ,  C08F279/02 ,  C08F290/048 ,  C09J5/00 ,  C09J11/00 ,  C09J109/02 ,  C09J133/066 ,  C09J157/04 ,  C09J2451/00 ,  C08L9/02 ,  C08L15/00 ,  C08L2205/03 ,  C08L33/18

摘要： A two-component (meth) acrylic adhesive excellent in peel strength at low temperature and impact resistance is provided. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; and (4) an elastomer having no polymerizable unsaturated double bond at the end and having 10 to 30 mol% of a (meth) acrylonitrile. A composition comprising components of (1) to (4): (1) a polymerizable vinyl monomer comprising (1-1) to (1-4); (2) a polymerization initiator; (3) a reducing agent; (4) an elastomer having a polymerizable unsaturated double bond at the end and having 10 to 30 mol% of a (meth) acrylonitrile; and (5) an elastomer having no polymerizable unsaturated double bond at the end.

公开(公告)号：EP2087056B1

公开(公告)日：2011-05-25

申请号：EP07822289.0

申请日：2007-11-07

申请人： TESA SE

发明人： HUSEMANN, Marc ,  HANNEMANN, Frank ,  KOOP, Matthias

IPC分类号： C09J7/00 ,  C09J7/02 ,  C09J109/02

CPC分类号： C09J109/02 ,  C08L61/00 ,  C08L61/06 ,  C08L61/28 ,  C08L63/00 ,  C08L75/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J7/10 ,  C09J7/35 ,  C09J2409/00 ,  Y10T428/2813

公开(公告)号：EP1819794B1

公开(公告)日：2008-11-26

申请号：EP05808150.6

申请日：2005-11-11

申请人： tesa AG

发明人： RING, Christian ,  KRAWINKEL, Thorsten

IPC分类号： C09J7/00 ,  C09J109/00

CPC分类号： H05K3/386 ,  C08C19/02 ,  C08L29/14 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/10 ,  C09J7/35 ,  C09J109/00 ,  C09J109/02 ,  C09J2201/61 ,  C09J2409/00 ,  C09J2431/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K1/0393 ,  H05K2201/0133

摘要： The invention relates to an adhesive strip that can be activated by heat and is used for the production and subsequent processing of flexible strip conductors. Said adhesive strip has an adhesive mass consisting of at least a) an acrylic nitrile butadiene copolymer having a weight percentage of between 40 and 80, b) a polyvinyl acetal having a weight percentage of between 2 and 30, c) an epoxide resin having a weight percentage of between 10 and 50, and d) a hardener. The epoxide groups are chemically cross-linked with the hardener at high temperatures.