公开(公告)号：EP2737996B1

公开(公告)日：2017-12-27

申请号：EP12817350.7

申请日：2012-07-27

Applicant: Toppan Printing Co., Ltd.

Inventor： KANO Mitsuru ,  SATO Jin ,  YOSHIHARA Toshiaki ,  KON Masato

IPC: B32B9/00 ,  C23C16/02 ,  C23C16/40 ,  C23C16/455 ,  B32B7/10 ,  C23C28/00 ,  B05D3/14 ,  B05D3/00 ,  B32B7/04 ,  C08K3/00 ,  C09J201/02 ,  C09J201/06 ,  C09J201/08 ,  C23C16/04 ,  C23C16/44 ,  C23C28/04 ,  B05D3/10

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).

公开(公告)号：EP1242494B1

公开(公告)日：2005-10-12

申请号：EP00981320.5

申请日：2000-11-29

Applicant: BASF Coatings AG

Inventor： BAUMGART, Hubert ,  MEISENBURG, Uwe ,  RINK, Heinz-Peter ,  HARRIS, Paul, J.

IPC: C08G18/67 ,  C08G18/38 ,  C09D201/02

CPC classification number: C09D201/025 ,  C08G18/3831 ,  C08G18/672 ,  C09J201/025 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31938

公开(公告)号：EP4437059A1

公开(公告)日：2024-10-02

申请号：EP22896910.1

申请日：2022-11-23

Applicant: The University of British Columbia

Inventor： GILMOUR, Damon J. ,  TOMKOVIC, Tanja ,  HATZIKIRIAKOS, Savvas G. ,  SCHAFER, Laurel L.

IPC: C09J7/30 ,  C08J7/043 ,  C09J7/24 ,  C09J201/02 ,  C09D5/16

CPC classification number: C09J7/30 ,  C08J7/043 ,  C09J7/24 ,  C09J201/025 ,  C08J7/042 ,  C08J2423/0220130101 ,  C08J2427/1220130101 ,  C08J2327/1820130101 ,  C08J2323/1220130101 ,  C09J2423/00620130101 ,  C09J2427/00620130101 ,  C09J2423/0020130101 ,  C09J2203/3520200801 ,  C09D5/1662

公开(公告)号：EP2737996A1

公开(公告)日：2014-06-04

申请号：EP12817350.7

申请日：2012-07-27

Applicant: Toppan Printing Co., Ltd.

Inventor： KANO Mitsuru ,  SATO Jin ,  YOSHIHARA Toshiaki ,  KON Masato

IPC: B32B9/00 ,  C23C16/02 ,  C23C16/40 ,  C23C16/455

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).

公开(公告)号：EP1736520B1

公开(公告)日：2014-04-30

申请号：EP05720935.5

申请日：2005-03-16

Applicant: Sumitomo Bakelite Company, Ltd.

Inventor： OKUBO, Hikaru, SUMITOMO BAKELITE COMPANY, LTD. ,  TANAKA, Nobuki, SUMITOMO BAKELITE COMPANY, LTD. ,  WATANABE, Itaru, SUMITOMO BAKELITE COMPANY, LTD.

IPC: C09J201/02 ,  C08F290/06 ,  H01L21/52 ,  C08G73/12 ,  C08L79/08

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

公开(公告)号：EP1736520A1

公开(公告)日：2006-12-27

申请号：EP05720935.5

申请日：2005-03-16

Applicant: Sumitomo Bakelite Company, Ltd.

Inventor： OKUBO, Hikaru, SUMITOMO BAKELITE COMPANY, LTD. ,  TANAKA, Nobuki, SUMITOMO BAKELITE COMPANY, LTD. ,  WATANABE, Itaru, SUMITOMO BAKELITE COMPANY, LTD.

IPC: C09J201/02 ,  C08F290/06 ,  H01L21/52

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.
A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当将树脂组合物用作半导体芯片附着材料时，具有优异的耐焊接裂纹性等可靠性的半导体器件 。 进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。 一种树脂组合物，其包含填料（A），包含由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含 光聚合引发剂。

公开(公告)号：EP3188905A2

公开(公告)日：2017-07-12

申请号：EP15766678.5

申请日：2015-09-01

Applicant: 3M Innovative Properties Company

Inventor： ZHANG, Ying ,  EVERAERTS, Albert I. ,  ZHU, Dong-Wei ,  BEHLING, Ross E. ,  CALDWELL, Gregg A.

IPC: B32B15/02 ,  C09J201/00 ,  C09J201/02

CPC classification number: C09J11/06 ,  C08K5/07 ,  C08K5/3435 ,  C08K5/3475 ,  C09D133/08 ,  C09J5/00 ,  C09J201/00 ,  C09J201/025 ,  C09J2433/00 ,  H01B1/02 ,  H01B1/026

Abstract: The present invention is an adhesive composition for stabilizing an electrical conductor. The adhesive composition includes a base polymer and an additive for absorbing UV light, such as a benzotriazole or a benzophenone. When the adhesive composition is in contact with the electrical conductor, the electrical conductor has less than about a 20% change in electrical resistance over a period of about 500 hours.

Abstract translation: 本发明是用于稳定电导体的粘合剂组合物。 该粘合剂组合物包含基础聚合物和用于吸收紫外线的添加剂，例如苯并三唑或二苯甲酮。 当粘合剂组合物与电导体接触时，电导体在约500小时的时间内具有小于约20％的电阻变化。

公开(公告)号：EP1799738B1

公开(公告)日：2017-05-03

申请号：EP05812179

申请日：2005-10-11

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： ZHU HUIDE D ,  KNEISEL ANDREW R ,  MAHDI SYED Z ,  SARACSAN JEFFREY W

IPC: C08G18/48 ,  C08G18/12 ,  C08G18/76 ,  C09J175/08

CPC classification number: C08G18/12 ,  C08G18/4812 ,  C08G18/7664 ,  C08G18/7671 ,  C08J5/124 ,  C08J2327/06 ,  C09J175/04 ,  C09J175/08 ,  C09J201/025 ,  C08G18/289 ,  C08G18/2825 ,  C08G18/307 ,  C08G18/792 ,  C08G18/2895

公开(公告)号：EP2737996A4

公开(公告)日：2015-04-15

申请号：EP12817350

申请日：2012-07-27

Applicant: TOPPAN PRINTING CO LTD

Inventor： KANO MITSURU ,  SATO JIN ,  YOSHIHARA TOSHIAKI ,  KON MASATO

IPC: B32B9/00 ,  B32B5/14 ,  B32B7/10 ,  C23C16/02 ,  C23C16/40 ,  C23C16/455 ,  C23C28/00 ,  C23C28/04

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/0008 ,  C08K3/0033 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).

Abstract translation: 本发明的层压体（1）包括在所述基材的外表面的至少一部分上形成的基材（2），薄膜状或膜状的底涂层（3或103） （2），并且在原子层沉积电影（4）没有形成在面的相反侧进入在厚度方向上与所述底涂层（3或103）的两个表面之间的基体材料（2）接触其表面的 ， 至少在原子层沉积电影（4）结合到所述底涂层（3或103）的前体，以及原子层沉积电影的部分（4）形成为膜形状覆盖所述底涂层（3或103） ，

公开(公告)号：EP2647686A3

公开(公告)日：2013-10-30

申请号：EP13165702.5

申请日：2005-03-16

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Okubo, Hikaru ,  Tanaka, Nobuki ,  Watanabe, Itaru

IPC: C09J201/02 ,  C08F290/06 ,  H01L21/52 ,  C08G73/12 ,  C08L79/08

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.
A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.