公开(公告)号：EP3214104A4

公开(公告)日：2018-07-25

申请号：EP15869741

申请日：2015-11-24

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： KOBAYASHI TAKASHI ,  TAKANO KENTARO ,  KATAGIRI MASAYUKI ,  TOKUZUMI KEITA ,  SHIMA TATSUYA

IPC: C08G61/02 ,  C08G14/12 ,  C08G73/06 ,  C08J5/24 ,  C08L61/00 ,  C08L61/34 ,  C08L63/00 ,  C08L71/02 ,  C08L79/04 ,  C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J161/00 ,  C09J161/34 ,  C09J163/00 ,  C09J165/04 ,  C09J179/04 ,  C09J201/06 ,  C09K3/10

CPC classification number: C08G14/12 ,  C08G61/02 ,  C08G73/0655 ,  C08J5/24 ,  C08L61/00 ,  C08L61/34 ,  C08L63/00 ,  C08L71/02 ,  C08L79/04 ,  C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J161/00 ,  C09J161/34 ,  C09J163/00 ,  C09J165/04 ,  C09J179/04 ,  C09J201/06 ,  C09K3/10

Abstract: The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.

公开(公告)号：EP2064251B1

公开(公告)日：2017-10-25

申请号：EP07813826.0

申请日：2007-08-06

Applicant: Kensey Nash Corporation

Inventor： LEE, Bruce, P.

IPC: C08F8/00 ,  C08G61/02

CPC classification number: C08G69/40 ,  C08F8/00 ,  C08G65/33389 ,  C08G71/04 ,  C09D5/1637 ,  C09J171/02 ,  C09J175/04 ,  C09J201/06

公开(公告)号：EP2813557B1

公开(公告)日：2017-06-07

申请号：EP13746806.2

申请日：2013-01-18

Applicant: Mitsui Chemicals, Inc.

Inventor： IMAI, Akihiro ,  UCHIDA, Takashi ,  DINH, Hoang Yen ,  HONMA, Shirou

IPC: C09J201/06 ,  B32B27/00 ,  C09J11/04 ,  C09J11/06 ,  C09J175/04

CPC classification number: C09J175/04 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/02 ,  B32B2250/242 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2307/518 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2553/00 ,  C08G18/0823 ,  C08G18/12 ,  C08G18/283 ,  C08G18/44 ,  C08G18/706 ,  C08G18/724 ,  C08G18/73 ,  C08G18/757 ,  C08G2170/80 ,  C09J11/04 ,  C09J11/06 ,  C09J201/06 ,  C09J2475/00 ,  C08G18/3271

公开(公告)号：EP2737996A1

公开(公告)日：2014-06-04

申请号：EP12817350.7

申请日：2012-07-27

Applicant: Toppan Printing Co., Ltd.

Inventor： KANO Mitsuru ,  SATO Jin ,  YOSHIHARA Toshiaki ,  KON Masato

IPC: B32B9/00 ,  C23C16/02 ,  C23C16/40 ,  C23C16/455

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body (1) of the present invention includes a base material (2), a film-like or a membrane-like undercoat layer (3 or 103) that is formed in at least a portion of the outer surface of the base material (2), and an atomic layer deposition film (4) that is formed on a surface opposite to a surface coming into contact with the base material (2) among both surfaces of the undercoat layer (3 or 103) in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film (4) bind to the undercoat layer (3 or 103), and the atomic layer deposition film (4) is formed into a membrane shape covering the undercoat layer (3 or 103).

公开(公告)号：EP1890324A3

公开(公告)日：2008-06-11

申请号：EP07114390.3

申请日：1998-03-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Watanabe, Itsuo ,  Fujinawa, Tohru ,  Arifuku, Motohiro ,  Sutou, Hoko ,  Kuwano, Atsushi

IPC: H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料，该电路连接材料介于彼此面对的电路电极之间，并且通过将相对的电极彼此按压而在按压方向上电连接电极; （1）加热时能够产生自由基的固化剂，（2）分子量为10,000或更高的含羟基的树脂和（3）可自由基聚合的物质 。 还提供了利用这种材料的电路端子连接结构和电路端子连接方法。

公开(公告)号：EP1890324A2

公开(公告)日：2008-02-20

申请号：EP07114390.3

申请日：1998-03-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Watanabe, Itsuo ,  Fujinawa, Tohru ,  Arifuku, Motohiro ,  Kanazawa, Hoko Reserch & Development Center, ,  Kuwano, Atsushi

IPC: H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料的所有其电路电极之间插入海誓山盟面对并电在通过彼此压靠的相对的电极挤压方向连接的电极; 所述电路连接材料包括作为主要组分（1）通过加热产生游离自由基的固化剂，（2），其具有10000或更多，（3）自由基聚合性物质的分子量的含羟基基团的树脂 ， 这样提供了一个电路端子连接结构和连接方法的电路端子，这使得使用寻求的材料制成。

公开(公告)号：EP1144532B1

公开(公告)日：2004-05-06

申请号：EP99964185.5

申请日：1999-12-09

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： TAKEDA, Yasuyuki

IPC: C09J133/06 ,  C09J201/06 ,  C09J7/02 ,  C09J175/04 ,  C08G18/62

CPC classification number: C09J201/06 ,  C08G18/348 ,  C08G18/6229 ,  C08G2290/00 ,  C08L2666/34 ,  C09D175/04 ,  C09J7/22 ,  C09J7/28 ,  C09J7/29 ,  C09J7/38 ,  C09J133/066 ,  C09J175/04 ,  C09J2203/334 ,  C09J2400/163 ,  C09J2433/00

Abstract: The adhesive composition comprises a hydroxyl group-containing adhesive polymer having little or no carboxylic groups in the molecule, and a separate compound that is an aromatic carboxylic acid compound. This composition prevents the corrosion of a metal layer without requiring formation of a protective film in the production of an adhesive sheet comprising a metal layer.

公开(公告)号：EP1260555A1

公开(公告)日：2002-11-27

申请号：EP02010754.6

申请日：2002-05-14

Applicant: Kyowa Yuka Co., Ltd.

Inventor： Hotta, Iwao ,  Murayama, Toshikazu ,  Hagino, Harufumi ,  Moriyama, Satoshi ,  Murata, Shigeru ,  Shimizu, Ikuo

IPC: C08L101/06 ,  C09D201/06 ,  C08J3/24

CPC classification number: C09J201/06 ,  C08L101/06 ,  C09D201/06

Abstract: An object of the present invention is to provide a composition which provides a hardened product exhibiting superior electrical insulating properties, adhesiveness, or the like at the time of hardening the composition. The present invention provides a composition comprising a compound having a group represented by the general formula (I):
(in the formula, R 1 , R 2 , and R 3 are identical or different, and represent a hydrogen atom or a lower alkyl group; X, Y, and Z are identical or different, and represent an oxygen atom or a sulfur atom, and at least two of X, Y, and Z represent a sulfur atom), and a compound having two or more acidic groups.

Abstract translation: 本发明的目的是提供一种在硬化组合物时提供表现出优异的电绝缘性，粘合性等的硬化产物的组合物。 本发明提供了包含具有由通式（I）表示的基团的化合物的组合物：（在式中，R 1，R 2和R 3相同或不同，以及 表示氢原子或低级烷基; X，Y和Z相同或不同，表示氧原子或硫原子，X，Y和Z中的至少两个表示硫原子），和 具有两个或多个酸性基团的化合物。

公开(公告)号：EP1242554A1

公开(公告)日：2002-09-25

申请号：EP99968455.8

申请日：1999-11-05

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro ,  TAKAMATSU, Yorinobu ,  YAMAGUCHI, Hitoshi ,  MURAMATSU, Akito

IPC: C09J7/02 ,  C09J201/06 ,  C09J133/14

CPC classification number: C09J133/066 ,  C08L67/04 ,  C08L2666/14 ,  C09J7/10 ,  C09J201/06 ,  C09J2201/61 ,  C09J2433/00 ,  C09J2467/00

Abstract: The present invention provides thermally activated adhesive compositions comprising adhesive polymer and polyester, wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.

公开(公告)号：EP0743970A1

公开(公告)日：1996-11-27

申请号：EP95911679.0

申请日：1995-02-09

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： GSCHNEIDNER, David ,  BOLDIZAR, Leslie ,  JACOBS, William, III ,  ALEXANIAN, Vazken

IPC: C09D5 ,  C09D133 ,  C09D161 ,  C09D167 ,  C09D201 ,  C09J201

CPC classification number: C09D201/06 ,  C08L2666/16 ,  C09D5/032 ,  C09D167/00 ,  C09J201/06 ,  C08L61/20 ,  C08L2666/28

Abstract: Described is a curable powder coating composition that provides a durable decorative wrinkle finish after curing, as well as a method of coating a substrate and a substrate so coated. The powder coating composition includes a specific triazine-type amino resin crosslinking agent, a hydroxyl functional resin and an amine blocked non-halogenated sulfonic acid catalyst.