公开(公告)号：EP4420809A1

公开(公告)日：2024-08-28

申请号：EP23158821.1

申请日：2023-02-27

Applicant: Richemont International S.A.

Inventor： BIHR, Jean Claude ,  STIEFVATER, Jean-Karl ,  GIRAUD, Damien

IPC: B22F3/10 ,  B22F3/22 ,  B22F10/10 ,  B33Y10/00 ,  C22C1/04 ,  C22C5/00 ,  C22C5/08

CPC classification number: B22F10/10 ,  B22F3/225 ,  C22C1/0466 ,  C22C5/00 ,  C22C5/08 ,  B33Y10/00 ,  B22F3/1021

Abstract: La présente invention concerne un procédé de fabrication d'une pièce en métal comprenant les étapes suivantes :
(a) mise en forme d'un mélange comprenant une poudre métallique et un liant,
la poudre métallique comprenant des particules d'un alliage choisi dans le groupe constitué des alliages suivants :
∗ alliages d'or contenant au moins 583 %o en poids d'or, et entre 7,5 et 300 %o en poids de cuivre ; la quantité d'or et de cuivre n'excédant pas 1000 %o,
∗ alliages d'argent contenant au moins 900 %o en poids d'argent, et 10 à 100 %o en poids de cuivre ; la quantité d'argent et de cuivre n'excédant pas 1000 %o,
∗ alliages de platine contenant au moins 930 %o de platine, et 7,5 à 50 %o de cuivre ; la quantité de platine et de cuivre n'excédant pas 1000 ‰,
la mise en forme du mélange permettant de former une pièce verte,

(b) déliantage et oxydation de la pièce verte pour former une pièce marron,
le déliantage étant réalisé par voie thermique ou par voie chimique,
l'oxydation étant réalisée en présence d'oxygène,

(c) désoxydation de la pièce marron sous atmosphère réductrice,
(d) frittage de la pièce déliantée,
(e) optionnellement, compaction isostatique à chaud de la pièce frittée.

公开(公告)号：EP3658698B1

公开(公告)日：2024-08-28

申请号：EP18750326.3

申请日：2018-07-25

IPC: C23C14/16 ,  C23C14/35 ,  C23C14/34 ,  H01J37/34 ,  C22C1/04 ,  B22F7/06 ,  B22F3/105 ,  B22F3/24

CPC classification number: C23C14/16 ,  C23C14/3414 ,  C23C14/35 ,  H01J37/3426 ,  B22F2003/105120130101 ,  B22F7/06 ,  B22F7/062 ,  C22C1/0466 ,  C22C1/0483 ,  B22F2003/24720130101 ,  B22F2202/1320130101 ,  B22F2998/1020130101 ,  B22F2999/0020130101 ,  C22C1/047

公开(公告)号：EP3192596A4

公开(公告)日：2018-04-11

申请号：EP15839679

申请日：2015-09-09

Applicant: UNIV KYOTO ,  UNIV OITA ,  KYUSHU UNIV NATIONAL UNIV CORPORATION

Inventor： KITAGAWA HIROSHI ,  KUSADA KOHEI ,  KOBAYASHI HIROKAZU ,  NAGAOKA KATSUTOSHI ,  SATO KATSUTOSHI ,  MATSUMURA SYO ,  YAMAMOTO TOMOKAZU

IPC: B22F1/00 ,  B01J23/46 ,  B01J37/16 ,  B22F9/24 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  F01N3/10 ,  F01N3/28

CPC classification number: B01J23/462 ,  B01J23/46 ,  B01J37/16 ,  B22F1/00 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/25 ,  B22F2998/10 ,  C22C1/0466 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  F01N3/10 ,  F01N3/28

Abstract: The present invention provides an alloy fine particle including palladium and ruthenium, the alloy fine particle including at least one first phase in which the palladium is more abundant than the ruthenium and at least one second phase in which the ruthenium is more abundant than the palladium, the at least one first phase and the at least one second phase being separated by a phase boundary, the palladium and the ruthenium being distributed in the phase boundary in such a manner that the molar ratio of the palladium and the ruthenium continually changes, a plurality of crystalline structures being present together in the phase boundary.

公开(公告)号：EP3187289A4

公开(公告)日：2017-08-30

申请号：EP15830315

申请日：2015-08-07

Applicant: TANAKA PRECIOUS METAL IND

Inventor： WAGAWA AKITOSHI ,  NAGAOKA AKIO ,  KAWAI TAKEHIKO ,  YAMAZAKI TAKAHISA

IPC: B22F9/30 ,  B01J23/42 ,  B22F1/00 ,  B22F9/20

CPC classification number: C22C1/0466 ,  B01J23/42 ,  B22F1/0014 ,  B22F1/0018 ,  B22F9/20 ,  B22F9/30 ,  B22F2301/25 ,  B22F2998/10 ,  C22C5/04 ,  C22F1/14 ,  B22F2009/041 ,  B22F1/0088

Abstract: The present invention relates to a method for producing a platinum-based alloy powder, the method comprising a heat treatment of a mixed powder containing a platinum-based powder composed of at least one selected from the group consisting of platinum and platinum compound, a platinum group metal-based powder composed of at least one selected from the group consisting of iridium, rhodium, palladium, and compound containing at least one of them, and an alkaline-earth metal compound, wherein specific surface area of the platinum group metal-based powder is 30 m 2 /g or more and D90 of the mixed powder is 1.0 µm or less. According to the method for producing a platinum-based alloy powder of the invention, it is possible to produce a platinum-based alloy powder that has a desired particle diameter, also has a sharp particle size distribution, and has high purity and crystallinity.

Abstract translation: 铂系合金粉末的制造方法技术领域本发明涉及一种铂系合金粉末的制造方法，该方法包括对含有铂系粉末的混合粉末进行热处理，所述铂系粉末由选自铂和铂化合物中的至少一种，铂 由选自铱，铑，钯和含有它们中的至少一种的化合物中的至少一种和碱土金属化合物组成的组中的至少一种金属基粉末，其中所述铂族金属基的比表面积 粉末为30m 2 / g以上，混合粉末的D 90为1.0μm以下。 根据本发明的铂系合金粉末的制造方法，能够制造具有期望的粒径，且粒度分布窄且纯度和结晶性高的铂系合金粉末。

公开(公告)号：EP3142814A1

公开(公告)日：2017-03-22

申请号：EP15732379.1

申请日：2015-05-18

Applicant: Progold S.p.A.

Inventor： ZITO, Damiano

IPC: B22F3/105 ,  A44C27/00 ,  C22C1/04 ,  C22C5/02 ,  C22C9/00

CPC classification number: A44C27/003 ,  B22F3/1055 ,  B23K26/342 ,  B23K2203/08 ,  B23K2203/12 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C1/0425 ,  C22C1/0466 ,  C22C5/02 ,  C22C9/00 ,  C22C30/02 ,  Y02P10/295

Abstract: A method of manufacturing yellow, red or white gold jewelry items layer by layer by selective laser melting (SLM) of a 18K, 14K, 10K or 9K gold powder alloy. The alloy comprises: (A) 37.5% to 38.5% by weight or 41.7% to 42.5% by weight or 58.5% to 59.5% by weight or 75% to 76% by weight of gold; and (D) 0.01% to 5% by weight, preferably 0.01% to 3% by weight of at least one metalloid, which may be germanium, silicon, boron, tellurium, phosphorous and selenium.

Abstract translation: 一种通过18K，14K，10K或9K金粉末合金的选择性激光熔化（SLM）逐层制造黄色，红色或白色金首饰项目的方法。 该合金包括：（A）37.5％至38.5重量％或41.7重量％至42.5重量％或58.5重量％至59.5重量％或75重量％至76重量％的金; 和（D）0.01重量％至5重量％，优选0.01重量％至3重量％的至少一种准金属，其可以是锗，硅，硼，碲，磷和硒。

公开(公告)号：EP2538423A4

公开(公告)日：2016-11-09

申请号：EP11853723

申请日：2011-04-11

Applicant: WENZHOU HONGFENG ELECTRICAL ALLOY CO LTD

Inventor： CHEN LESHENG ,  CHEN XIAO ,  QI GENGXIN ,  MU CHENGFA

IPC: H01H1/0237 ,  B22F3/16 ,  C22C1/04 ,  C22C5/06

CPC classification number: H01H1/0237 ,  B22F3/04 ,  B22F3/10 ,  B22F3/14 ,  B22F3/20 ,  C22C1/0466 ,  C22C5/06 ,  C22C32/0021 ,  C22C49/02 ,  C22C49/14 ,  H01H1/02372 ,  H01H1/02374 ,  H01H1/02376 ,  Y10T428/249921

Abstract: In the present invention, a method of preparing Ag-based oxide contact materials with directionally arranged reinforcing particles is disclosed, comprising steps of: a) preparing evenly dispersed composite powders by chemical co-precipitation method combining with roasting, b) granulating the composite powders by high energy ball milling, and sieving the powders, c) mixing the powders and Ag matrix in a powder mixing machine, d) cold isostatic pressing, e) sintering, f) hot-pressing, g) hot-extruding to obtain Ag-based oxide contact materials with directionally arranged reinforcing particles. This method can obtain particle reinforced Ag-based material with good electrical performance even when the reinforced (oxide) particles are very small. This method is simple, easy to operate, and does not require special equipment. The resistance to welding and arc erosion, electric conductivity and the processability of the material prepared through this present invention can be greatly improved.

公开(公告)号：EP2929975A4

公开(公告)日：2016-07-06

申请号：EP13860327

申请日：2013-11-27

Applicant: MITSUBISHI MATERIALS CORP

Inventor： ISHIKAWA MASAYUKI ,  YAMAMOTO YOSHIFUMI

IPC: B23K35/22 ,  B22F1/00 ,  B22F9/08 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K35/02 ,  B23K35/30 ,  B23K101/36 ,  B23K101/42 ,  C22C1/04 ,  C22C5/02

CPC classification number: B23K35/3013 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/22 ,  B23K35/30 ,  B23K2201/36 ,  C22C1/0466 ,  C22C5/02

Abstract: The present invention provides to an Au-Sn-Bi alloy film which has an excellent bondability on a metalized layer formed on an LED element or a substrate as a bonding layer made of the Au-Sn-Bi alloy and is uniform and thin. In the present invention, an Au-Sn-Bi alloy thin film which has the thickness of 5 µm or less and includes at least a eutectic structure can be formed by using an Au-Sn-Bi alloy powder paste that mixes the Au-Sn alloy powder containing 20 wt% to 25 wt% of Sn, 0.1 wt% to 5.0 wt% of Bi, and a balance of Au, and having a particle diameter of 10 µm or less with an RA flux of 15 wt% to 30 wt%, screen printing the Au-Sn-Bi alloy powder paste in a predetermined region on the Au metallized layer, and subsequently, heating, melting and then solidifying the Au-Sn-Bi alloy powder.

公开(公告)号：EP2810310A4

公开(公告)日：2016-01-20

申请号：EP13743614

申请日：2013-01-25

Applicant: BAKER HUGHES INC

Inventor： KÄHLER JULIAN ,  KRUSPE THOMAS ,  JUNG SEBASTIAN ,  STRANZ ANDREJ ,  WAAG ANDREAS ,  PEINER ERWIN

IPC: H01L35/02 ,  B22F7/06 ,  B23K35/02 ,  B23K35/30 ,  B32B15/01 ,  C01B31/06 ,  C22C1/04 ,  C22C5/06 ,  H01L23/373 ,  H01L23/38 ,  H01L35/08 ,  H01L35/34 ,  H05K1/09

CPC classification number: H01L35/08 ,  B22F7/064 ,  B23K35/0244 ,  B23K35/3006 ,  B32B15/018 ,  C22C1/0466 ,  C22C5/06 ,  H01L23/3732 ,  H01L23/38 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/00014

公开(公告)号：EP2898945A1

公开(公告)日：2015-07-29

申请号：EP13838282.5

申请日：2013-09-18

Applicant: Japan Science and Technology Agency

Inventor： KITAGAWA, Hiroshi ,  KUSADA, Kohei ,  NAGAOKA, Katsutoshi ,  SATO, Katsutoshi ,  KUTUBI, Md. Shahajahan

IPC: B01J23/46 ,  B01D53/94 ,  B22F1/00 ,  B22F9/24 ,  C07C1/32 ,  C07C15/14 ,  C07B61/00

CPC classification number: B01J23/462 ,  B01D53/9418 ,  B01D53/945 ,  B01D2255/1023 ,  B01D2255/1026 ,  B01J23/63 ,  B01J35/0013 ,  B01J35/002 ,  B01J37/0009 ,  B01J37/0036 ,  B01J37/0063 ,  B01J37/0211 ,  B01J37/08 ,  B01J37/16 ,  B22F1/0018 ,  B22F9/24 ,  B82Y30/00 ,  C07B37/04 ,  C07C1/321 ,  C07C37/16 ,  C07C45/61 ,  C07C45/64 ,  C07C2523/44 ,  C07C2523/46 ,  C22C1/0466 ,  Y02A50/2324 ,  Y02A50/2325 ,  Y02T10/22 ,  C07C15/14

Abstract: The catalyst disclosed is a catalyst including palladium-ruthenium alloy fine particles in which palladium and ruthenium form a solid solution. The palladium-ruthenium alloy fine particles used in this catalyst can be produced by a production method including the step of maintaining a solution containing a protective agent, a reducing agent, a palladium compound or palladium ions, and a ruthenium compound or ruthenium ions at a temperature equal to or higher than a predetermined temperature.

Abstract translation: 所公开的催化剂是包含钯 - 钌合金微粒的催化剂，其中钯和钌形成固溶体。 在该催化剂中使用的钯 - 钌合金微粒可以通过包括以下步骤的制备方法来制备，所述方法包括：保持包含保护剂，还原剂，钯化合物或钯离子的溶液，以及钌化合物或钌离子 温度等于或高于预定温度。

公开(公告)号：EP2703101A4

公开(公告)日：2014-10-01

申请号：EP12776408

申请日：2012-04-17

Applicant: UNIV TOHOKU

Inventor： NAKAYAMA KOJI ,  YOKOYAMA YOSHIHIKO

IPC: B22F9/08 ,  B01J23/755 ,  B01J27/185 ,  B01J35/02 ,  C22C45/00 ,  C22C45/02 ,  C22C45/04 ,  C22C45/10

CPC classification number: B01J27/1853 ,  B01J21/066 ,  B01J23/42 ,  B01J23/44 ,  B01J23/755 ,  B01J35/06 ,  B22F1/0025 ,  B22F9/002 ,  B22F9/082 ,  B22F2999/00 ,  B82Y30/00 ,  C22C1/002 ,  C22C1/03 ,  C22C1/0433 ,  C22C1/0458 ,  C22C1/0466 ,  C22C28/00 ,  C22C33/003 ,  C22C33/02 ,  C22C38/002 ,  C22C45/00 ,  C22C45/003 ,  C22C45/02 ,  C22C45/04 ,  C22C45/10 ,  B22F2202/03