Abstract:
In applying infrared heating to a mass production process of car body components, it is desirable that reduction in the temperature elevating time is compatible to energy saving and that an infrared furnace is simplified in structure. The infrared furnace includes a plurality of infrared lamps arrayed on one surface side of a work and a reflective surface provided on its opposite surface side. Outputs of the infrared lamps are locally adjusted, or intensity of the infrared rays incident on one work surface is locally adjusted by a member disposed between the infrared lamps and the one surface of the work. In this manner, variations in strength may be imparted to one and the same car part.
Abstract:
A device for redensifying articles made of an expanded thermoplastic material, particularly polystyrene, including a conveying system comprising a reflective metal surface supporting the moving articles and passing successively through a heating chamber (2) with an infrared heating assembly (5) facing said metal surface, and a post-heating chamber (23) having no infrared heating assembly but comprising a reflector (24) arranged above and facing said metal surface. The conveying system is preferably a conveyor belt (4) consisting of a thin continuous reflective metal strip, e.g. a thin tin-coated mild steel sheet, which is flexible enough to be looped, stretched around a number of drums and rotated.
Abstract:
The invention concerns an apparatus and a processs for soldering components (34, 26) onto boards (180, with at least one preheating zone (10) and one soldering zone (12) as well as a transport device (16) by means of which the boards (18) can be moved from one zone (10) to the next. It is proposed that in the preheating zone (10) infrared radiators (22) are arranged to extend in the direction of transport (20) and in the soldering zone (12) infrared radiators are arranged to extend diagonally to the direction of transport (20), with the radiation striking the board surface essentially at a slant. As a result, less radiation is absorbed at the board surface and at the surfaces of the components (34, 36) than at the lateral walls of the appropriate components (34, 38). It is further proposed that soldering ovens are adjusted using sensors (54, 56) mounted on test boards (18') and in the oven (10, 12).
Abstract:
An oven for heating can ends comprising a generally elongate heating chamber having walls which closely surround a conveyor for conveying the can ends through the chamber, a source of infra-red heat arranged in the upper region of said chamber and having a parabolic reflector by means of which radiant heat is directed downwardly onto a generally narrow band which corresponds in width to the width of the region of the can end to which sealant and/or repair lacquer has been applied, said conveyor being constructed from a plurality of interconnected slat-like elements having upturned edges the spacing between the upturned edges being selected so that the edges engage narrow portions of the curled edge of the can end whereby the can end is supported with the surface to which sealant or lining compound has been applied directed downwardly so thatthe heat source principally heats the upwardly directed surface of the can ends, a cooling chamber of similar dimensions to said heating chamber following said heating chamber, said cooling chamber including a cooling air outlet which directs a stream of cool air onto a central region of each can end as it is conveyed through said cooling region.
Abstract:
Known devices for drying and sintering metal-containing ink on a substrate have a plurality of optical radiators for irradiating the substrate and a reflector for reflecting radiation onto the substrate. In said known devices, the radiators and the substrate can be moved in relation to each other in a transport direction. In order to specify an efficient device for drying and sintering metal-containing ink on the basis of said known devices, which device enables homogeneous irradiation of the substrate, has a compact construction, and also is simple and economical to produce, the optical radiators according to the invention are infrared radiators having a cylindrical radiator tube and a radiator-tube longitudinal axis, which emit radiation having a radiation component of IR-B radiation of at least 30% and a radiation component of IR-C radiation of at least 5% of the total radiator power. Said infrared radiators are arranged in a radiator module in such a way that the radiator-tube longitudinal axes of the radiators extend parallel to each other and transversely to the transport direction and irradiate an irradiation field on the surface of the substrate in such a way that the irradiation field is divided into a drying zone and a sintering zone arranged downstream of the drying zone as viewed in the transport direction, wherein the drying zone is exposed along a centre axis extending in the transport direction to an at least 15% lower average irradiation density than the sintering zone.
Abstract:
The invention concerns an apparatus and a processs for soldering components (34, 26) onto boards (180, with at least one preheating zone (10) and one soldering zone (12) as well as a transport device (16) by means of which the boards (18) can be moved from one zone (10) to the next. It is proposed that in the preheating zone (10) infrared radiators (22) are arranged to extend in the direction of transport (20) and in the soldering zone (12) infrared radiators are arranged to extend diagonally to the direction of transport (20), with the radiation striking the board surface essentially at a slant. As a result, less radiation is absorbed at the board surface and at the surfaces of the components (34, 36) than at the lateral walls of the appropriate components (34, 38). It is further proposed that soldering ovens are adjusted using sensors (54, 56) mounted on test boards (18') and in the oven (10, 12).
Abstract:
The invention relates to a method and to an apparatus for impressing a temperature profile onto a sheet steel component (200), wherein in one or more first areas (210), a temperature below the AC3 temperature can be impressed on the sheet steel component (200), and in one or more second areas (220), a temperature above the AC3 temperature can be impressed on the sheet steel component (200), and is characterized in that the sheet steel component (200) is firstly preheated in a production furnace (110), the sheet steel component (200) is then transferred into a thermal re-treatment station (150), wherein a radiant heat source (151) is moved over the component in the thermal re-treatment station (150), by means of which the one or more first areas (210) of the sheet steel component (200) can optionally be kept at a temperature above the AC3 temperature or or cooled down further, and the one or more second areas (220) of the sheet steel component (200) can optionally be heated to or or kept at temperature above the AC3 temperature.
Abstract:
The time and temperature profile of a substrate carrying components to be soldered passing through a reflow oven (10) divided into sections (11 to 20) is controlled by scanning the substrate as it passes between the sections of the oven with an infrared scanner (SP 1 to SP 5 ) to determine the temperature at selected points of the substrate, computing therefrom the actual solder temperatures beneath the components, comparing these with a desired theoretical solder paste curve, and adjusting the oven section temperatures and/or the substrate speed in accordance with the comparison.