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1.发明授权HF-CHIPMODUL, HF-BAUGRUPPE UND VERFAHREN ZUR HERSTELLUNG EINER HF-BAUGRUPPE 有权RF芯片模块，RF模块和用于生产RF模块的方法
公开(公告)号：EP2206149B1
公开(公告)日：2017-11-15
申请号：EP08804103.3
申请日：2008-09-12
申请人： Robert Bosch GmbH
CPC分类号： H01L23/66 , G01S7/032 , H01L23/645 , H01L24/97 , H01L2223/6677 , H01L2224/0401 , H01L2224/06134 , H01L2224/06135 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/142 , H01L2924/15151 , H01L2924/15192 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01Q21/08 , H05K1/0204 , H05K1/181 , H05K3/0061 , H05K2201/09054 , H05K2201/10522 , H05K2201/10727 , H05K2203/167 , Y02P70/611 , H01L2224/16225 , H01L2924/00 , H01L2224/81 , H01L2224/83
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2.发明公开HF-CHIPMODUL, HF-BAUGRUPPE UND VERFAHREN ZUR HERSTELLUNG EINER HF-BAUGRUPPE 有权HF-CHIPMODUL，HF-BAUGRUPPE UND VERFAHREN ZUR HERSTELLUNG EINER HF-BAUGRUPPE
公开(公告)号：EP2206149A2
公开(公告)日：2010-07-14
申请号：EP08804103.3
申请日：2008-09-12
申请人： Robert Bosch GmbH
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , G01S7/032 , H01L23/645 , H01L24/97 , H01L2223/6677 , H01L2224/0401 , H01L2224/06134 , H01L2224/06135 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/142 , H01L2924/15151 , H01L2924/15192 , H01L2924/19042 , H01L2924/19103 , H01L2924/19104 , H01Q21/08 , H05K1/0204 , H05K1/181 , H05K3/0061 , H05K2201/09054 , H05K2201/10522 , H05K2201/10727 , H05K2203/167 , Y02P70/611 , H01L2224/16225 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： The invention relates to an HF chip module comprising a planar strip substrate (2) having a front surface (VS) and a rear surface (RS); at least one HF chip (1) having a front (V) and a rear (R), which chip is mounted on the front surface (V) of the substrate (2) via its front (V); the front (V) of the HF chip (1) comprising at least one antenna element (3a) or at least one antenna connection (8b) which is connected to an antenna element (3b) on the rear surface (RS) of the substrate (2); the front (V) of the HF chip (1) having contact surfaces (8a) which are connected to strip conductors (6) on the front surface (VS) of the substrate (2); the strip conductors (6) leading to corresponding connecting zones (7a; 7b) which are provided at least on the front surface (VS) of the substrate (2), off-set from the HF chip (1) in the longitudinal direction of the substrate (2). The invention also relates to an HF assembly and to a method for producing said HF assembly.
摘要翻译： 本发明涉及一种包括具有前表面（VS）和后表面（RS）的平面条形基片（2）的HF芯片模块; 至少一个具有前（V）和后（R）的HF芯片（1），该芯片经由其前（V）安装在基板（2）的前表面（V）上; HF芯片（1）的前部（V）包括至少一个天线元件（3a）或至少一个天线连接（8b），其连接到基板的背面（RS）上的天线元件（3b） （2）; 所述HF芯片（1）的前面（V）具有与所述基板（2）的前表面（VS）上的带状导体（6）连接的接触表面（8a） 通过至少设置在基板（2）的前表面（VS）上的相应连接区域（7a; 7b）的带状导体（6）从HF芯片（1）的纵向方向偏离 基板（2）。 本发明还涉及HF组件和用于生产所述HF组件的方法。
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