公开(公告)号：EP4435152A2

公开(公告)日：2024-09-25

申请号：EP24191899.4

申请日：2017-10-25

申请人： Adeia Semiconductor Technologies LLC

发明人： UZOH, Cyprian, Emeka

IPC分类号： C25D7/12

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/1308420130101 ,  H01L2224/1626520130101 ,  H01L2224/1385520130101 ,  H01L2224/1162220130101 ,  H01L2224/1626820130101 ,  H01L2224/1605920130101 ,  H01L24/80 ,  H01L2224/040120130101 ,  H01L2224/055720130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/0561620130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/1146220130101 ,  H01L2224/1146420130101 ,  H01L2224/114720130101 ,  H01L2224/1300720130101 ,  H01L2224/1301920130101 ,  H01L2224/1310520130101 ,  H01L2224/1310920130101 ,  H01L2224/1311120130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1356220130101 ,  H01L2224/1356420130101 ,  H01L2224/1365520130101 ,  H01L2224/1368420130101 ,  H01L2224/1380920130101 ,  H01L2224/1381120130101 ,  H01L2224/1384720130101 ,  H01L2224/1605820130101 ,  H01L2224/1614820130101 ,  H01L2224/291920130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/8106520130101 ,  H01L2224/8107520130101 ,  H01L2224/8109120130101 ,  H01L2224/8119320130101 ,  H01L2224/8120320130101 ,  H01L2224/818120130101 ,  H01L2224/818420130101 ,  H01L2225/105820130101 ,  H01L2924/1531120130101 ,  H01L2224/810920130101 ,  H01L2224/0556820130101 ,  H01L2224/0391220130101 ,  H01L2224/8109920130101 ,  H01L2224/1100920130101 ,  H01L2225/0651320130101 ,  H01L2224/1650320130101 ,  H01L2224/0300920130101 ,  H01L2224/1380520130101 ,  H01L2224/8108520130101 ,  H01L2224/8035720130101 ,  H01L2224/055820130101 ,  H01L2224/0556220130101 ,  H01L2224/0556420130101 ,  H01L2224/0557120130101 ,  H01L2224/0557220130101 ,  H01L23/552 ,  H01L2224/8385620130101 ,  H01L2224/8386220130101 ,  H01L2224/9212520130101 ,  H01L2224/808120130101 ,  H01L2224/8098620130101 ,  H01L2224/1623720130101 ,  H01L2224/1614720130101 ,  H01L2224/0823720130101 ,  H01L2224/0514720130101 ,  H01L2224/0558220130101 ,  H01L2224/0558320130101 ,  H01L2224/0584720130101 ,  H01L2224/0584420130101 ,  H01L2224/0585520130101 ,  H01L2224/7310420130101 ,  H01L2224/7320420130101 ,  H05K3/4007 ,  H05K3/3436 ,  H05K2201/1024220130101 ,  H01L2224/803420130101 ,  H01L2224/8014120130101 ,  H01L2224/0814520130101 ,  C25D7/123 ,  C25D5/022 ,  C23C18/1653 ,  C25D5/48 ,  C25D5/10 ,  C25D5/18 ,  C25D3/38 ,  C25D5/605 ,  C25D5/12 ,  C23C18/1658

摘要： A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.