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公开(公告)号：EP3753749B1
公开(公告)日：2024-08-14
申请号：EP18906353.0
申请日：2018-12-20
CPC分类号： C25D5/10 , C25D5/50 , D07B1/066 , D07B1/0666 , D07B2205/308920130101 , D07B2205/306720130101 , D07B1/0626 , D07B1/0633 , B60C9/0007 , B60C9/2006 , B60C2009/207720130101 , B60C2009/209620130101 , B60C2001/006620130101 , C25D7/0607 , C25D5/12 , C25D3/38 , C25D9/08 , C25D5/605
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公开(公告)号：EP4299797A3
公开(公告)日：2024-05-08
申请号：EP23178762.3
申请日：2023-06-12
发明人： TING, Fai Lung , WU, Weigang
摘要： Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.
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公开(公告)号：EP4083272B1
公开(公告)日：2024-09-25
申请号：EP20904802.4
申请日：2020-11-10
IPC分类号： C25D7/06 , C25D5/12 , C23C28/00 , H01M4/66 , C25D5/00 , H01M4/02 , H05K1/09 , H05K3/38 , C25D3/12 , C25D3/38 , C25D3/58 , H01M10/0525
CPC分类号： C25D5/12 , C23C28/322 , C23C28/345 , H01M10/0525 , H01M2004/02720130101 , H01M4/661 , H01M4/667 , H01M4/662 , C25D7/0614 , C25D3/12 , C25D3/38 , C25D3/58 , C25D5/605 , Y02E60/10 , H05K1/09 , H05K2201/035520130101 , H05K3/384 , H05K3/389
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公开(公告)号：EP4403674A1
公开(公告)日：2024-07-24
申请号：EP24151241.7
申请日：2024-01-10
IPC分类号： C25D5/00 , C25D7/00 , H01L23/495
CPC分类号： C25D3/46 , C25D7/00 , C25D5/605 , H01L23/49582 , H01L23/49548 , H01L23/3142 , H01L23/3107 , H01L23/562
摘要： Provided is a metal component that is used for manufacturing a semiconductor device, the metal component including a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a lumpy protrusion on a surface of the noble metal plating layer.
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6.发明授权
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公开(公告)号：EP4435152A2
公开(公告)日：2024-09-25
申请号：EP24191899.4
申请日：2017-10-25
发明人： UZOH, Cyprian, Emeka
IPC分类号： C25D7/12
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/1308420130101 , H01L2224/1626520130101 , H01L2224/1385520130101 , H01L2224/1162220130101 , H01L2224/1626820130101 , H01L2224/1605920130101 , H01L24/80 , H01L2224/040120130101 , H01L2224/055720130101 , H01L2224/0560920130101 , H01L2224/0561120130101 , H01L2224/0561620130101 , H01L2224/0562420130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0568420130101 , H01L2224/1146220130101 , H01L2224/1146420130101 , H01L2224/114720130101 , H01L2224/1300720130101 , H01L2224/1301920130101 , H01L2224/1310520130101 , H01L2224/1310920130101 , H01L2224/1311120130101 , H01L2224/1311620130101 , H01L2224/1312420130101 , H01L2224/1313920130101 , H01L2224/1314420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/1318420130101 , H01L2224/1356220130101 , H01L2224/1356420130101 , H01L2224/1365520130101 , H01L2224/1368420130101 , H01L2224/1380920130101 , H01L2224/1381120130101 , H01L2224/1384720130101 , H01L2224/1605820130101 , H01L2224/1614820130101 , H01L2224/291920130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/8106520130101 , H01L2224/8107520130101 , H01L2224/8109120130101 , H01L2224/8119320130101 , H01L2224/8120320130101 , H01L2224/818120130101 , H01L2224/818420130101 , H01L2225/105820130101 , H01L2924/1531120130101 , H01L2224/810920130101 , H01L2224/0556820130101 , H01L2224/0391220130101 , H01L2224/8109920130101 , H01L2224/1100920130101 , H01L2225/0651320130101 , H01L2224/1650320130101 , H01L2224/0300920130101 , H01L2224/1380520130101 , H01L2224/8108520130101 , H01L2224/8035720130101 , H01L2224/055820130101 , H01L2224/0556220130101 , H01L2224/0556420130101 , H01L2224/0557120130101 , H01L2224/0557220130101 , H01L23/552 , H01L2224/8385620130101 , H01L2224/8386220130101 , H01L2224/9212520130101 , H01L2224/808120130101 , H01L2224/8098620130101 , H01L2224/1623720130101 , H01L2224/1614720130101 , H01L2224/0823720130101 , H01L2224/0514720130101 , H01L2224/0558220130101 , H01L2224/0558320130101 , H01L2224/0584720130101 , H01L2224/0584420130101 , H01L2224/0585520130101 , H01L2224/7310420130101 , H01L2224/7320420130101 , H05K3/4007 , H05K3/3436 , H05K2201/1024220130101 , H01L2224/803420130101 , H01L2224/8014120130101 , H01L2224/0814520130101 , C25D7/123 , C25D5/022 , C23C18/1653 , C25D5/48 , C25D5/10 , C25D5/18 , C25D3/38 , C25D5/605 , C25D5/12 , C23C18/1658
摘要： A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.
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公开(公告)号：EP4423321A1
公开(公告)日：2024-09-04
申请号：EP22813171.0
申请日：2022-10-28
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9.发明公开
公开(公告)号：EP4414477A2
公开(公告)日：2024-08-14
申请号：EP24179203.5
申请日：2014-03-17
申请人： Modumetal, Inc.
发明人： WHITAKER, John D. , LOMASNEY, Christina A. , CALDWELL, Richard J. , KRUPPS, William , UNGER, Jesse
IPC分类号： C23C18/16
CPC分类号： B82Y40/00 , C25D5/18 , C23C18/1689 , B82Y30/00 , C23C18/1653 , C25D5/627 , C25D5/14 , C25D5/617 , C25D5/605 , Y02P10/25
摘要： Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.
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搜索结果
9 条记录 (耗时 0.009 秒)
