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公开(公告)号：EP3963631B1
公开(公告)日：2024-09-18
申请号：EP20936072.6
申请日：2020-05-29
CPC分类号： H01L25/0657 , H01L25/18 , H01L25/50 , H01L2225/0654820130101 , H01L2225/0656220130101 , H01L23/58 , H01L2224/0814520130101 , H01L24/73 , H01L24/08 , H01L2224/0502520130101 , H01L2224/0554720130101 , H01L2224/060320130101 , H01L2224/8035720130101 , H01L2224/0918120130101 , H01L2224/920220130101 , H10B43/50 , H10B43/40 , H10B43/27
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公开(公告)号：EP4435152A2
公开(公告)日：2024-09-25
申请号：EP24191899.4
申请日：2017-10-25
发明人： UZOH, Cyprian, Emeka
IPC分类号： C25D7/12
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/1308420130101 , H01L2224/1626520130101 , H01L2224/1385520130101 , H01L2224/1162220130101 , H01L2224/1626820130101 , H01L2224/1605920130101 , H01L24/80 , H01L2224/040120130101 , H01L2224/055720130101 , H01L2224/0560920130101 , H01L2224/0561120130101 , H01L2224/0561620130101 , H01L2224/0562420130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0568420130101 , H01L2224/1146220130101 , H01L2224/1146420130101 , H01L2224/114720130101 , H01L2224/1300720130101 , H01L2224/1301920130101 , H01L2224/1310520130101 , H01L2224/1310920130101 , H01L2224/1311120130101 , H01L2224/1311620130101 , H01L2224/1312420130101 , H01L2224/1313920130101 , H01L2224/1314420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/1318420130101 , H01L2224/1356220130101 , H01L2224/1356420130101 , H01L2224/1365520130101 , H01L2224/1368420130101 , H01L2224/1380920130101 , H01L2224/1381120130101 , H01L2224/1384720130101 , H01L2224/1605820130101 , H01L2224/1614820130101 , H01L2224/291920130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/8106520130101 , H01L2224/8107520130101 , H01L2224/8109120130101 , H01L2224/8119320130101 , H01L2224/8120320130101 , H01L2224/818120130101 , H01L2224/818420130101 , H01L2225/105820130101 , H01L2924/1531120130101 , H01L2224/810920130101 , H01L2224/0556820130101 , H01L2224/0391220130101 , H01L2224/8109920130101 , H01L2224/1100920130101 , H01L2225/0651320130101 , H01L2224/1650320130101 , H01L2224/0300920130101 , H01L2224/1380520130101 , H01L2224/8108520130101 , H01L2224/8035720130101 , H01L2224/055820130101 , H01L2224/0556220130101 , H01L2224/0556420130101 , H01L2224/0557120130101 , H01L2224/0557220130101 , H01L23/552 , H01L2224/8385620130101 , H01L2224/8386220130101 , H01L2224/9212520130101 , H01L2224/808120130101 , H01L2224/8098620130101 , H01L2224/1623720130101 , H01L2224/1614720130101 , H01L2224/0823720130101 , H01L2224/0514720130101 , H01L2224/0558220130101 , H01L2224/0558320130101 , H01L2224/0584720130101 , H01L2224/0584420130101 , H01L2224/0585520130101 , H01L2224/7310420130101 , H01L2224/7320420130101 , H05K3/4007 , H05K3/3436 , H05K2201/1024220130101 , H01L2224/803420130101 , H01L2224/8014120130101 , H01L2224/0814520130101 , C25D7/123 , C25D5/022 , C23C18/1653 , C25D5/48 , C25D5/10 , C25D5/18 , C25D3/38 , C25D5/605 , C25D5/12 , C23C18/1658
摘要： A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.
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公开(公告)号：EP4401127A2
公开(公告)日：2024-07-17
申请号：EP24176697.1
申请日：2019-04-30
发明人： LIU, Jun
IPC分类号： H01L23/31
CPC分类号： G11C11/005 , G11C16/0483 , G11C11/401 , H01L25/18 , H01L25/50 , H01L23/3114 , H01L24/08 , H01L24/80 , H01L25/0657 , H01L2224/0559920130101 , H01L2224/0562420130101 , H01L2224/0564720130101 , H01L2224/0565720130101 , H01L2224/0568420130101 , H01L2224/0814520130101 , H01L2224/8035720130101 , H01L2224/9420130101 , H01L2225/0656520130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L27/0688 , H01L2225/0654120130101 , G11C11/5621 , G11C11/5678 , G11C2213/7120130101 , H01L24/05 , H01L24/29 , H01L24/83 , H01L2224/0564420130101 , H01L2224/2918620130101 , H01L2224/8389620130101 , H01L2224/8037920130101 , H10B63/30 , H10B63/84 , H10N70/231 , H10B12/50 , H10B43/40 , H10B43/27
摘要： Embodiments of three-dimensional (3D) memory devices with embedded dynamic random-access memory (DRAM) and methods for forming the 3D memory devices are disclosed. In an example, a 3D memory device includes a first semiconductor structure including a peripheral circuit, an array of embedded DRAM cells, and a first bonding layer including a plurality of first bonding contacts. The 3D memory device also further includes a second semiconductor structure including an array of 3D NAND memory strings and a second bonding layer including a plurality of second bonding contacts. The 3D memory device further includes a bonding interface between the first bonding layer and the second bonding layer. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.
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公开(公告)号：EP3939083B8
公开(公告)日：2024-07-17
申请号：EP20913066.5
申请日：2020-07-07
CPC分类号： H10B41/40 , H10B43/40 , H10B41/27 , H10B43/27 , G11C16/0483 , H01L24/08 , H01L24/80 , H01L25/18 , H01L2224/0237220130101 , H01L2224/0814520130101 , H01L2224/0918120130101 , H01L2224/8035720130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/920220130101 , H01L2225/0654120130101 , H10B41/50 , H10B43/50
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公开(公告)号：EP3891799B1
公开(公告)日：2024-06-19
申请号：EP19927324.4
申请日：2019-04-30
CPC分类号： G11C11/005 , G11C16/0483 , G11C11/401 , H01L25/18 , H01L25/50 , H01L23/3114 , H01L24/08 , H01L24/80 , H01L25/0657 , H01L2224/0559920130101 , H01L2224/0562420130101 , H01L2224/0564720130101 , H01L2224/0565720130101 , H01L2224/0568420130101 , H01L2224/0814520130101 , H01L2224/8035720130101 , H01L2224/9420130101 , H01L2225/0656520130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L27/0688 , H01L2225/0654120130101 , G11C11/5621 , G11C11/5678 , G11C2213/7120130101 , H01L24/05 , H01L24/29 , H01L24/83 , H01L2224/0564420130101 , H01L2224/2918620130101 , H01L2224/8389620130101 , H01L2224/8037920130101 , H10B63/30 , H10B63/84 , H10N70/231 , H10B12/50 , H10B43/40 , H10B43/27
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公开(公告)号：EP3706172B1
公开(公告)日：2024-09-11
申请号：EP20166179.0
申请日：2011-07-04
IPC分类号： H01L27/146 , H01L23/00
CPC分类号： H01L27/14634 , H01L27/1464 , H01L27/14687 , H01L27/14601 , H01L27/14645 , H01L27/1469 , H01L27/14636 , H01L27/14621 , H01L27/14685 , H01L24/05 , H01L2224/8089620130101 , H01L2224/8089520130101 , H01L2224/8035720130101 , H01L2224/0812120130101 , H01L2224/0564720130101 , H01L2224/0554720130101 , H01L2224/0512420130101 , H01L2224/0564420130101 , H01L2224/0518120130101 , H01L2224/0514920130101 , H01L2224/0517920130101 , H01L2224/0517120130101 , H01L2224/0518620130101 , H01L2224/0555720130101 , H01L2224/0360220130101 , H01L2224/039120130101 , H01L2224/0555420130101 , H01L24/08 , H01L24/80 , H01L2224/0502220130101 , H01L2224/803420130101 , H01L2224/8098620130101 , H01L2224/0554620130101 , H01L2224/0814520130101
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公开(公告)号：EP3939083B1
公开(公告)日：2024-06-12
申请号：EP20913066.5
申请日：2020-07-07
CPC分类号： G11C16/0483 , H01L25/18 , H01L2225/0654120130101 , H01L2224/0814520130101 , H01L24/80 , H01L24/08 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/0237220130101 , H01L2224/8035720130101 , H01L2224/0918120130101 , H01L2224/920220130101 , H10B41/50 , H10B41/27 , H10B43/50 , H10B43/27
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公开(公告)号：EP4428912A2
公开(公告)日：2024-09-11
申请号：EP24183950.5
申请日：2011-07-04
发明人： SHIMOTSUSA, Mineo
IPC分类号： H01L23/00
CPC分类号： H01L27/14634 , H01L27/1464 , H01L27/14687 , H01L27/14601 , H01L27/14645 , H01L27/1469 , H01L27/14636 , H01L27/14621 , H01L27/14685 , H01L24/05 , H01L2224/8089620130101 , H01L2224/8089520130101 , H01L2224/8035720130101 , H01L2224/0812120130101 , H01L2224/0564720130101 , H01L2224/0554720130101 , H01L2224/0512420130101 , H01L2224/0564420130101 , H01L2224/0518120130101 , H01L2224/0514920130101 , H01L2224/0517920130101 , H01L2224/0517120130101 , H01L2224/0518620130101 , H01L2224/0555720130101 , H01L2224/0360220130101 , H01L2224/039120130101 , H01L2224/0555420130101 , H01L24/08 , H01L24/80 , H01L2224/0502220130101 , H01L2224/803420130101 , H01L2224/8098620130101 , H01L2224/0554620130101 , H01L2224/0814520130101
摘要： A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order.
Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.-
公开(公告)号：EP3925003B1
公开(公告)日：2024-09-04
申请号：EP20920028.6
申请日：2020-02-20
IPC分类号： H01L25/16 , H01L21/98 , H10B12/00 , H01L23/485
CPC分类号： H01L25/18 , H01L25/50 , H01L25/16 , H01L2224/0814520130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H10B12/315 , H10B12/03 , H10B12/09 , H01L24/08 , H01L24/80 , H01L24/94 , H01L24/92 , H01L24/05 , H01L24/03 , H01L2224/8009720130101 , H01L2224/8081520130101 , H01L2224/9420130101 , H01L2224/8035720130101 , H01L2224/8037920130101 , H01L2224/0812120130101
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