摘要:
The present invention relates to a semiconductor laser device capable of reliably suppressing degradation of an end face due to interface oxidation and distortion application, and to a manufacturing method of the same. The semiconductor laser device has a laser structure portion 107 having opposite resonator faces 108 and 109, and protecting films 110 and 120 formed on at least one of the opposite resonator end faces, wherein the protecting films 110 and 120 are formed of nitride dielectric films having a multistage structure including amorphous layers 111 and 121 and polycrystal layers 112 and 122 in crystal structure, respectively, from a side in contact with the resonator faces.
摘要:
A nitride semiconductor laser element has a ridge (24) formed on the top face (20) of a nitride semiconductor layer (20). Cavity planes (25a,25b) are formed at the ends of a waveguide region (26) provided beneath the ridge. Insulating film (30) is formed on the side faces of the ridge (24) an on the top face of the nitride semiconductor layer (20) such that its ends on the cavity plane side are spaced from cavity planes. End face protective films (70a,70b) made of AIGaN are formed on the cavity planes, a part of the upper face of the nitride semiconductor layer (20) and a part of the surface of insulating film (30), whereby a first region contacting the insulating film has a crystallinity different from a second region contacting semiconductor layer (20). Degradation of the cavity plane can be suppressed.
摘要:
Bei einem Hochleistungs-Diodenlaser enthalten einander gegenüberliegenden Facetten (26,28) jeweils ein aus Silicium und Kohlenstoff zusammengesetztes amorphes Schichtsystem, das die Funktion sowohl einer Passivierungsschicht (22) als auch der die Reflexion bestimmenden Funktionsschichten (24) übernimmt. Durch diese Maßnahme ist es möglich, einen Hochleistungs-Diodenlaser mit hoher COD-Schwelle bei zugleich hoher Standzeit mit einem vereinfachten Verfahren herzustellen.
摘要:
Methods of preparing front and back facets of a diode laser include controlling an atmosphere within a first chamber, such that an oxygen content and a water vapor content are controlled to within predetermined levels and cleaving the diode laser from a wafer within the controlled atmosphere of the first chamber to form a native oxide layer having a predetermined thickness on the front and back facets of the diode laser. After cleavage, the diode laser is transported from the first chamber to a second chamber within a controlled atmosphere, the native oxide layer on the front and back facets of the diode laser is partially removed, an amorphous surface layer is formed on the front and back facets of the diode laser, and the front and back facets of the diode laser are passivated.
摘要:
The aim of the invention is to simplify known passivation methods. According to said method, the semi-conductor elements are heated and cleaned in a high vacuum with a gaseous, reactive low-energy medium. A closed, insulating or slightly conductive, transparent protective layer is applied in-situ, said layer being inert in relation to the material on the mirror-type surface and the remaining components of a natural oxide. In a preferred embodiment, the optical semi-conductor element is a GaAs-based semi-conductor laser, the reactive and low-energy medium is an atomic hydrogen and the protective layer is made of ZnSe.