Abstract:
A method for preparing a VCSEL can use MBE for: growing a first conduction region over a first mirror region; growing an active region over the first conduction region opposite of the first mirror region, including: (a) growing a quantum well barrier having In1-xGaxP(As); (b) growing an transitional layer having one or more of GaP, GaAsP, or GaAs; (c) growing a quantum well layer having In1-zGazAsyP1-y; (d) growing another transitional layer have one or more of GaP, GaAsP, or GaAs; (e) repeating processes (a) through (d) over a plurality of cycles; and (f) growing a quantum well barrier having In1-xGaxP(As); growing a second conduction region over the active region opposite of the first conduction region, wherein: x ranges from 0.77 to 0.50; y ranges from 0.7 to 1; and z ranges from 0.7 to 0.99.
Abstract:
A vertical cavity surface emitting laser (VCSEL) includes a semiconductor substrate, a lower reflecting mirror formed thereon, an active layer formed on the lower reflecting mirror, a selective oxidization layer including a current confined structure, and an upper reflecting mirror. A mesa structure is formed in at least the active layer, selective oxidization layer, and the upper reflecting mirror. The VCSEL emits laser light perpendicularly to the plane of the semiconductor substrate when an electric current flows between an upper electrode and a lower electrode. The semiconductor substrate is inclined with respect to (100) plane, and the active layer includes a quantum well layer having a compressive strain with respect to the substrate, and a spacer layer. The spacer layer has either a compressive strain or a tensile strain with respect to the semiconductor substrate.
Abstract:
An S 3 -type laser diode includes a p-type cladding layer (36) formed on an active layer (35) such that an inclined surface region thereof has a carrier concentration level of 1 x 10 18 cm -3 or more, wherein the p-type cladding layer (36) has a thickness of 0.35µm or more.
Abstract translation:S 3型激光二极管包括形成在有源层(35)上的p型覆层(36),使得其倾斜表面区域的载流子浓度水平为1×10 18 cm -3 >以上,其中p型覆层(36)的厚度为0.35μm以上。
Abstract:
In a semiconductor laser provided with an active layer and a buried layer which absorbs the laser light emitted from the active layer, the oscillation wavelength of the laser light is in a 650-nm band and the oscillation mode is in a single transverse mode. In addition, the peak of the intensity distribution of the laser light is positioned oppsite to the buried layer with respect to the center of the active layer.
Abstract:
In a semiconductor laser provided with an active layer and a buried layer which absorbs the laser light emitted from the active layer, the oscillation wavelength of the laser light is in a 650-nm band and the oscillation mode is in a single transverse mode. In addition, the peak of the intensity distribution of the laser light is positioned oppsite to the buried layer with respect to the center of the active layer.
Abstract:
A red surface emitting laser element (3000) includes a first reflector (302), a second reflector (308) including a p-type semiconductor multilayer film, an active layer (305) between the first reflector (302) and the second reflector (308), and a p-type semiconductor spacer layer (307) between the active layer (305) and the second reflector (308), the p-type semiconductor spacer layer (307) having a thickness of 100 nm or more and 350 nm or less.