公开(公告)号：EP3379723A1

公开(公告)日：2018-09-26

申请号：EP16878907.1

申请日：2016-12-22

申请人： Murata Manufacturing Co., Ltd.

发明人： YAMAZAKI, Takuya ,  OHITSU, Toshikatsu ,  KAIDA, Hiroaki

IPC分类号： H03B5/32

CPC分类号： H03B5/04 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02023 ,  H03H9/02086 ,  H03H9/02102 ,  H03H9/0509 ,  H03H9/0552 ,  H03H9/1021 ,  H03H9/19 ,  H03H2003/022

摘要： A piezoelectric oscillation device 1 includes: a piezoelectric vibrator 50 that includes a piezoelectric vibration element 10; a heating element 60 that heats the piezoelectric vibration element 10; an electronic component 62 that is electrically connected to the piezoelectric vibration element 10; a substrate 70 on which the piezoelectric vibrator 50, the heating element 60, and the electronic component 62 are mounted; and a base member 90 to which the substrate 70 is attached with a prescribed spacing therebetween via a substrate holding member 94. The substrate holding member 94 includes a conductive part. The conductive part has a lower thermal conductivity than metal.

公开(公告)号：EP3224946A1

公开(公告)日：2017-10-04

申请号：EP15791317.9

申请日：2015-11-10

申请人： SnapTrack, Inc.

发明人： TAG, Andreas ,  BADER, Bernhard ,  PITSCHI, Maximilian

IPC分类号： H03H9/02 ,  H03H9/17

CPC分类号： H03H9/175 ,  H01L41/27 ,  H03H9/02102 ,  H03H9/706

摘要： The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

摘要翻译： 本发明涉及一种减少热量积聚的BAW谐振器。 通过热桥减少了热积聚，该热桥将热量从电声活性区域散发到支撑基板，而不会损害谐振器的声学特性。

公开(公告)号：EP3183811A1

公开(公告)日：2017-06-28

申请号：EP15735958.9

申请日：2015-07-09

申请人： SnapTrack, Inc.

发明人： RUILE, Werner ,  JÄGER, Philipp Michael ,  KNAPP, Matthias

IPC分类号： H03H9/02

CPC分类号： H03H9/02834 ,  H03H9/02102 ,  H03H9/14544 ,  H03H9/462

摘要： For a component that operates by means of acoustic waves, the invention proposes the compensation of a negative temperature coefficient of the frequency by the provision of a compensation coating on the component, said coating comprising a material based on a chemical compound of at least two elements, the compound having a negative thermal expansion coefficient.

摘要翻译： 对于通过声波操作的部件，本发明提出通过在部件上提供补偿涂层来补偿频率的负温度系数，所述涂层包括基于至少两种元素的化学化合物的材料 ，该化合物具有负热膨胀系数。

公开(公告)号：EP2892153A4

公开(公告)日：2016-02-24

申请号：EP13804060

申请日：2013-08-21

申请人： ZTE CORP ,  UNIV TIANJIN

发明人： ZHANG HAO ,  DU LIANGZHEN ,  PANG WEI ,  LI JIANBANG ,  HU NIANCHU ,  KANG KAI

IPC分类号： H03H9/02 ,  H01L41/18

CPC分类号： H03H9/02102 ,  H01L41/0477 ,  H01L41/18 ,  H01L41/183

摘要： A piezoelectric acoustic resonator with an adjustable temperature compensation capability is disclosed. The piezoelectric acoustic resonator includes: a piezoelectric acoustic reflection structure, a first electrode, a second electrode, a piezoelectric layer between the first electrode and the second electrode, and a temperature compensation layer; wherein the temperature compensation layer is a single-layer temperature compensation layer formed of Si x O y material, or a composite temperature compensation layer formed by stacking material with a positive temperature coefficient of sound velocity and material with a negative temperature coefficient of sound velocity; and the temperature compensation layer is configured to: perform reverse compensation for a temperature frequency shift caused by the first electrode, the piezoelectric layer and the second electrode in the piezoelectric acoustic resonator; wherein x:y is not equal to 1:2.

公开(公告)号：EP2284628B1

公开(公告)日：2015-03-25

申请号：EP10172464.9

申请日：2010-08-11

申请人： ETA SA Manufacture Horlogère Suisse

发明人： Cusin, Pierre ,  Cabezas Jurin, Andrés

IPC分类号： G04B17/06 ,  H03H3/04 ,  H03H9/21

CPC分类号： G04B17/066 ,  H03H3/0076 ,  H03H9/02102

公开(公告)号：EP1968127B1

公开(公告)日：2013-02-27

申请号：EP06811027.9

申请日：2006-10-02

申请人： MURATA MANUFACTURING CO., LTD.

发明人： OGAWA, Hirozumi ,  SAWADA, Takuya ,  KIMURA, Masahiko ,  SHIRATSUYU, Kosuke ,  ANDO, Akira

IPC分类号： H01L41/187 ,  H01L41/43 ,  H03H9/17

CPC分类号： H01L41/43 ,  H01L41/1878 ,  H03H9/02031 ,  H03H9/02102 ,  H03H9/176 ,  H03H9/178 ,  Y10T29/42

摘要： A piezoelectric ceramic whose resonance frequency temperature characteristic can be easily adjusted is provided. A piezoelectric ceramic (2) is comprises first and second parts (11 and 12) which are layers and are alternately stacked. The first and second parts (11 and 12) are each composed of a compound having a bismuth layer structure, such as a complex oxide containing at least Sr, Bi, and Nb, and have degrees of c-axis orientation different from each other. Since the resonance frequency temperature characteristics change according to the degree of orientation, the first and second parts (11 and 12) having different degrees of orientation are adequately combined so that the resonance frequency temperature characteristics of the piezoelectric ceramic (2) as a whole can be easily adjusted.

公开(公告)号：EP1548768B1

公开(公告)日：2012-02-22

申请号：EP04078526.3

申请日：2004-12-24

申请人： IMEC

发明人： Tilmans, Hendrikus A.C. ,  Pan, Wanling

IPC分类号： H03H3/04 ,  H01G5/14 ,  H03H9/02 ,  H03H9/17 ,  H03H3/02

CPC分类号： H03H9/172 ,  H01G5/18 ,  H01G5/38 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02102 ,  H03H2003/022 ,  H03H2003/027 ,  H03H2009/241

摘要： The present invention provides an FBAR device with a means for internally varying a capacitance. The device comprises a bottom electrode and a top electrode, said bottom electrode and said top electrode have an overlap area A, the overlap being defined by the projection of the top electrode onto the bottom electrode in a direction substantially perpendicular to the plane of the bottom electrode. Furthermore, the device comprises a piezoelectric layer in between said bottom electrode and said top electrode and a dielectric layer in between the piezoelectric layer and the bottom electrode. The device also comprises means for reversibly varying an internal impedance of the device. The capacitance may be tuned by either varying the thickness of the dielectric layer, by changing the overlap between the bottom electrode and the top electrode or by shifting a different dielectric material between the electrodes.

公开(公告)号：EP2276172A1

公开(公告)日：2011-01-19

申请号：EP10171212.3

申请日：2005-10-17

申请人： Seiko Epson Corporation

发明人： Tanaya, Hideo

IPC分类号： H03H9/21

CPC分类号： H03H9/02102 ,  G01C19/5607 ,  H03H9/02086 ,  H03H9/0519 ,  H03H9/0595 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  H03H2003/0492

摘要： A piezoelectric resonator element including: a base (51) formed by a piezoelectric material, having a given length; a plurality of vibration arms (35,36) extended from one end of the base; and a supporting arm extended from the other end apart from the one end of the base by the given length to a width direction so as to be extended to a same direction of the vibration arms at an outside of the vibration arms.

摘要翻译： 一种压电振动片，其特征在于，具有：由压电材料形成的规定长度的基体（51） 多个振动臂（35,36），从基座的一端延伸; 以及支撑臂，该支撑臂从所述基座的所述一端远离所述给定长度地从所述另一端延伸到宽度方向，以便在所述振动臂的外侧延伸到所述振动臂的相同方向。

公开(公告)号：EP2091078A4

公开(公告)日：2010-03-24

申请号：EP07831416

申请日：2007-11-08

申请人： NIHON DEMPA KOGYO CO

发明人： YAMADA HIROAKI

IPC分类号： H01L23/12 ,  H03H9/02 ,  H05K3/34

CPC分类号： H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP2027435A1

公开(公告)日：2009-02-25

申请号：EP07725761.6

申请日：2007-06-01

申请人： Albert-Ludwigs-Universität Freiburg

发明人： LOSCHONSKY, Marc ,  DADGAR, Armin ,  REINDL, Leonhard

IPC分类号： G01B17/02

CPC分类号： H03H9/02102 ,  G01B7/066

摘要： The present invention relates to a layer thickness sensor for monitoring deposition processes and to a method for monitoring layer deposition processes in microsystem technology and nanotechnology. In order to provide an improved sensor which makes it possible to determine layer thicknesses in the region of less than approximately 0.2 nm, the invention proposes using mass-sensitive, piezoelectric thin-film resonators which are polarized both longitudinally and transversally for such layer thickness measuring systems. Temperature compensation can be additionally carried out by exciting at least two different oscillation modes at different frequencies and with a different temperature response and by means of corresponding calculation.