公开(公告)号：EP2668833A1

公开(公告)日：2013-12-04

申请号：EP12703144.1

申请日：2012-01-27

Applicant: Novalia Ltd

Inventor： STONE, Kate

IPC: H05K1/02 ,  H05K1/11 ,  H01H13/702 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01H13/52 ,  H01H13/7006 ,  H01H13/79 ,  H01H2203/02 ,  H01H2203/022 ,  H05K1/0293 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/118 ,  H05K1/16 ,  H05K2201/0385 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/10053

Abstract: An electronic component such as a push button switch or a connector comprises a flexible planar substrate (fig 1, 2) which is substantially non-stretchable, that has at least two slits 14 to allow a portion 15 of the substrate supporting a region of conductive material 12 to be moved apart from another portion of the substrate. There can be three or more slits which can be arcuate and overlap an adjacent slit forming a bridge 17 between them. The conducting region 12 can be isolated, and short out two further pads 7,8 on a second substrate 3 or connected to a conductive track (fig 7, 13) and formed from conductive ink. The slits can allow movement out of the plane of the substrate, and in the same plane as the substrate to form a flexible connector (fig 11 and 12) where the slits can extend from opposite edges. The substrate can comprise a laminate, paper, card or plastic membrane and the device can be used in an electronic circuit (fig 9), as part of a game (fig 10), a book, poster, calendar, greetings card or product packaging or point of sale display.

公开(公告)号：EP2668833B1

公开(公告)日：2016-05-04

申请号：EP12703144.1

申请日：2012-01-27

Applicant: Novalia Ltd

Inventor： STONE, Kate

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H01H13/79 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01H13/52 ,  H01H13/7006 ,  H01H13/79 ,  H01H2203/02 ,  H01H2203/022 ,  H05K1/0293 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/118 ,  H05K1/16 ,  H05K2201/0385 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/10053

公开(公告)号：EP1107654A4

公开(公告)日：2006-05-24

申请号：EP00922937

申请日：2000-05-01

Applicant: MITSUI MINING & SMELTING CO ,  SUZUKI CO LTD

Inventor： NAKAMURA TOSHIYUKI ,  TANAKA HIDETO ,  ICHIRYU AKIRA ,  TAKAHASHI M ,  ISHII MASATO ,  ARAI DAISUKE

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L21/60 ,  H01L23/12

CPC classification number: H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A sheet for forming a printed wiring board which comprises a resin sheet (18) having a through-hole in the thickness direction and a metallic chip (46) inserted into the through-hole, and a method of manufacturing this sheet. The resin sheet (18) and a conductive metallic sheet (44) are placed in this order on a die base (16) having a die hole (14), then a hole is formed in the conductive metal sheet (44) with a punch (10) from the conductive metal sheet (44) side. At the same time, a hole (20) is also formed in the resin sheet, the conductive metal chip (46) formed by the punching from the conductive metal sheet (44) is inserted into the through-hole formed in the resin sheet (18). Thus, the sheet is manufactured. The front and rear surfaces of the sheet can be electrically interconnected by inserting this conductive metal chip (46) into the through-hole, and many substrates are stacked and by protruding and inserting the conductive metal chip (46). Thereby, the sheets can be electrically connected in the thickness direction by this protruded conductive metal chip (46) and a multilayer laminated board can be easily manufactured.

公开(公告)号：EP1107654A1

公开(公告)日：2001-06-13

申请号：EP00922937.8

申请日：2000-05-01

Applicant: Mitsui Mining & Smelting Co., Ltd. ,  Suzuki Co., Ltd

Inventor： NAKAMURA, Toshiyuki, Suzuki Co., Ltd ,  TANAKA, Hideto, Suzuki Co., Ltd. ,  ICHIRYU, Akira, Mitsui Mining & Smelting Co., Ltd ,  TAKAHASHI, M., Mitsui Min. & Smelt. Co., Ltd ,  ISHII, Masato ,  ARAI, Daisuke, Mitsui Mining & Smelting Co., Ltd

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L23/12 ,  H01L21/60

CPC classification number: H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: The present invention provides a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole, and a process for producing the sheet. The sheet is produced by placing a resin sheet and a conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole also in the resin sheet, and inserting the punched conductive metal chip in the through hole of the resin sheet. By the insertion of the conductive metal chip in the through hole, the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet and if a large number of such substrates are laminated, electrical connection in the thickness direction can be readily made by virtue of the protruded conductive metal chips, and a multi-layer board can be readily produced.

Abstract translation: 本发明提供一种印刷电路板，形成片，其包括具有在厚度方向上的通孔并插入所述通孔的金属片，及其制造片材的方法的树脂片材。 片材是通过将树脂片和导电金属薄片在此订单中的具有基产生的孔中，从该导电性金属片侧进行冲孔以形成在导电金属片冲孔和以形成冲孔 所以在树脂片，和插入在所述树脂片的通孔中的导电冲压金属芯片。 通过在通孔内的导电金属片的插入，前，片材的后表面可以电连接到海誓山盟。 如果导电金属片被如此插入做它的尖端从片材的表面突出，并且如果大量搜索基板的层叠时，在厚度方向的电连接可以容易地借助于突出导电金属片制成，并且 多层板可以容易地制造。