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    VERFAHREN ZUM PARTIELLEN LÖSEN EINER DEFINIERTEN FLÄCHE EINER LEITFÄHIGEN SCHICHT
    3.
    发明公开
    VERFAHREN ZUM PARTIELLEN LÖSEN EINER DEFINIERTEN FLÄCHE EINER LEITFÄHIGEN SCHICHT 有权
    方法导电层的已定义区域的部分释放

    公开(公告)号：EP2567601A1

    公开(公告)日：2013-03-13

    申请号：EP11723862.6

    申请日：2011-03-23

    Applicant: LPKF Laser & Electronics AG

    Inventor： VAN AALST, Jan ,  KOVACIC, Drago ,  PODOBNIK, Bostjan

    IPC: H05K3/02 ,  B23K26/36

    CPC classification number: H05K3/027 ,  B23K26/36 ,  B23K2201/38 ,  H05K2201/062 ,  H05K2201/09363

    Abstract: The invention relates to a method for partially stripping a defined area of a conductive layer from a substrate (1). For this purpose, in a first method step, the area is firstly subdivided into regions (4) by means of a laser beam (3). For this purpose, the laser beam parameters are set in such a way that only the conductive layer is removed, without the underlying substrate (1) that carries the conductive layer also being impaired at the same time in the process. For this purpose, each of these strip-shaped regions (4) is thermally insulated from the adjoining regions (4) of the conductive layer by the introduction of a linear cutout (5) along a respective periphery of the regions (4). For this purpose, the cutouts (5) are introduced as substantially parallel straight lines that form an acute angle (α) of 22.5° with the principal axes (X, Y) determined by the known course of the conductor track (2). In this way, a parallel course of the cutouts (5) with respect to a conductor track (2) is approximately precluded in practice, such that a thermal energy input parallel to the conductor track (2) during the process of stripping away the region (4) adjacent to the conductor track (2) and thus damage to the latter are avoided. In a subsequent method step, the regions (4) are removed upon simultaneous heating by means of a fluid flow, the orientation of which relative to the cutouts (5) is set in such a way that the fluid flow impinges on the cutouts (5) neither parallel nor orthogonally.

    PRINTED CIRCUIT FABRICATION
    4.
    发明授权
    PRINTED CIRCUIT FABRICATION 有权
    线路板生产

    公开(公告)号：EP1195082B1

    公开(公告)日：2003-09-17

    申请号：EP00942271.8

    申请日：2000-07-05

    Applicant: ISIS INNOVATION LIMITED

    Inventor： BAND, Cyril William

    IPC: H05K3/06

    CPC classification number: H05K3/06 ,  H05K3/0002 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2203/056

    Abstract: A mask for producing a printed circuit board is defined in which the conductor elements of the printed circuit pattern are delineated by a constant width etch band (20). This means that all conductors (3a, 3b, 9) are separated from neighbouring areas of conductive material (22) by the same distance. Thus etch rates across the printed circuit pattern do not vary according to the separation of the conductors (3a, 3b, 9).

    Printed wiring board
    10.
    发明公开
    Printed wiring board 审中-公开
    印刷线路板

    公开(公告)号：EP1983809A3

    公开(公告)日：2010-07-21

    申请号：EP08007057.6

    申请日：2008-04-09

    Applicant: YAZAKI CORPORATION

    Inventor： Masaoki, Yoshida ,  Nakayama, Takuya ,  Ueyama, Koji

    IPC: H05K1/11

    CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

    Abstract: The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

    Abstract translation: 本发明提供一种能够可靠地防止由端子引起的导体图案的损伤的印刷布线板。 印刷线路板具有板，导电图案，通孔和非导电区域。 将安装在印刷线路板上的电阻引线插入到通孔4中。引线从电路板的表面突出，并弯曲靠近表面。 非导电区域形成为从通孔的中心向引线的末端扩大的扇形形状。 由于弯曲引线布置在非导电区域上，因此非导电区域可以防止由于引线接触导电图案而导致的导电图案的损坏。

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