专利检索 cpc:"H05K2201/0982720130101" 第 1 页

1.

发明授权
BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD 有权

公开(公告)号：EP3860317B1

公开(公告)日：2024-07-24

申请号：EP19867041.6

申请日：2019-09-27

IPC分类号： H05K1/02 , H01L23/36 , H01L23/373 , H05K3/38 , H05K1/03

CPC分类号： H01L23/3735 , H05K2201/0915420130101 , H05K1/0306 , H05K2201/09820130101 , H05K2201/035520130101 , H05K3/38 , H05K2201/0982720130101

2.

发明授权
CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURFACE AND PLATE THEREFOR 有权

公开(公告)号：EP4133911B1

公开(公告)日：2024-06-12

申请号：EP21717579.3

申请日：2021-04-01

IPC分类号： H05K3/04 , H05K3/14

CPC分类号： H05K3/14 , H05K2203/052820130101 , H05K2203/10720130101 , H05K2201/016220130101 , H05K2201/0903620130101 , H05K2201/0982720130101

3.

发明授权
CIRCUIT BOARD AND SEMICONDUCTOR MODULE 有权转让

公开(公告)号：EP3493253B1

公开(公告)日：2024-05-29

申请号：EP17834475.0

申请日：2017-07-27

IPC分类号： H05K1/02 , H01L23/13 , H01L23/36 , H01L23/498 , H01L23/00 , H01L23/15 , H01L23/373 , H05K1/03 , H05K3/40

CPC分类号： H01L23/13 , H01L23/36 , H05K1/0306 , H05K1/0271 , H05K2201/200920130101 , H05K2201/0913620130101 , H05K1/0265 , H05K1/0209 , H05K2201/09820130101 , H05K2201/036720130101 , H05K2201/0915420130101 , H05K3/4015 , H05K2201/103120130101 , H05K2201/1031820130101 , H05K2203/028520130101 , H05K2203/027820130101 , H05K2203/036920130101 , H01L24/32 , H01L24/29 , H01L23/49811 , H01L2924/351120130101 , H01L2224/29120130101 , H01L2224/3222520130101 , H01L2224/8020520130101 , H01L2224/8020320130101 , H01L2224/8381520130101 , H01L2224/0822520130101 , H01L24/80 , H01L24/83 , H01L23/3735 , H01L23/15 , H05K2201/0982720130101 , Y02P70/50