公开(公告)号：EP3491898B1

公开(公告)日：2024-09-25

申请号：EP17754863.3

申请日：2017-07-26

IPC: H05K1/02 ,  G06F13/40

CPC classification number: G06F13/4086 ,  H05K1/0225 ,  H05K1/025 ,  H05K1/0253 ,  H05K2201/02920130101 ,  H05K2201/0972720130101 ,  H05K2201/1015920130101 ,  H05K1/0236

公开(公告)号：EP4371040A1

公开(公告)日：2024-05-22

申请号：EP23754838.3

申请日：2023-07-28

Applicant: Srivastava, Ankur

Inventor： Srivastava, Ankur

IPC: G06N10/00 ,  G06N7/02 ,  H05K1/14

CPC classification number: G06N7/02 ,  G06N10/00 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/1015920130101

公开(公告)号：EP4420121A1

公开(公告)日：2024-08-28

申请号：EP22884753.9

申请日：2022-10-24

Applicant: Tachyum Ltd.

Inventor： DANILAK, Radoslav ,  MULLENDORE, Rodney ,  RADKE, William ,  TO, Chi

IPC: G11C5/02 ,  H05K3/36 ,  G11C8/12

CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/025 ,  H05K2201/1015920130101 ,  H05K2201/1051520130101

公开(公告)号：EP4412405A1

公开(公告)日：2024-08-07

申请号：EP23215109.2

申请日：2023-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： KO, Byunghan ,  KONG, Doil ,  ZHAO, Hu

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/433 ,  H05K1/18 ,  H05K3/34 ,  H05K7/20 ,  H01L23/373

CPC classification number: H05K2201/1015920130101 ,  H05K2201/1073420130101 ,  H05K2201/1054520130101 ,  H05K3/3415 ,  H05K1/181 ,  H05K2201/1020420130101 ,  H05K1/0209 ,  H05K2201/06620130101 ,  H05K2201/1096920130101 ,  H05K2201/203620130101 ,  H05K1/0206 ,  H01L23/3736 ,  H01L23/367 ,  H05K2203/157220130101 ,  H01L23/42 ,  H01L25/18 ,  H01L25/105

Abstract: The present disclosure provides semiconductor assemblies including dummy packages. In some embodiments, the semiconductor assembly includes a solid-state drive (SSD) device including a printed circuit board (20) including a memory region, a plurality of memory packages (200) disposed on the memory region, and at least one dummy package (100) disposed on the memory region. The at least one dummy package (100) is electrically coupled with the printed circuit board (20). The at least one dummy package (100) includes a first pad (150) constituting a heat path through which heat of the printed circuit board (20) is dissipated.

公开(公告)号：EP4371154A1

公开(公告)日：2024-05-22

申请号：EP22741674.0

申请日：2022-06-14

Applicant: QUALCOMM INCORPORATED

Inventor： PATIL, Aniket ,  BUOT, Joan Rey Villarba ,  WE, Hong Bok

IPC: H01L23/66 ,  H05K1/02

CPC classification number: H01L23/49827 ,  H05K1/0253 ,  H05K1/0219 ,  H05K2201/1015920130101 ,  H01L25/105 ,  H01L25/18