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    METHOD FOR DETERRMINING A COOLING STRUCTURE
    5.
    发明公开
    METHOD FOR DETERRMINING A COOLING STRUCTURE 审中-公开

    公开(公告)号：EP4345679A1

    公开(公告)日：2024-04-03

    申请号：EP22386065.1

    申请日：2022-09-28

    申请人： Corintis SA

    发明人： Van Erp, Remco ,  Salazar De Troya, Miguel Angel ,  Boutsikakis, Athanasios

    IPC分类号： G06F30/28 ,  F28C3/04 ,  F28F13/18 ,  G06F1/20 ,  H02K5/20 ,  H05K7/20 ,  G06F111/06 ,  G06F113/18 ,  G06F119/08

    摘要： The invention relates to a method for determining a manufacturable cooling structure (6,6') for cooling a semiconductor device (9,13) during operation, wherein the method receives as input (10) at least i) physical parameters of the semiconductor device, wherein the physical parameters are related to physical properties of the semiconductor device, and ii) an array of numbers (1) indicative of a spatial power distribution of the semiconductor device, wherein the method comprises the following steps: 1) determining (11), using an optimization algorithm, a cooling structure (6,6') based on the received input (10), and 2) providing as output (12) the determined cooling structure (6,6') in a data format based on which the determined cooling structure (6,6') can be physically manufactured (9).

    RELIABILITY ASSESSMENT OF AN ELECTRONIC COMPONENT CARRIER OR A PACKAGE COMPRISING IT USING AI-SUPPORTED FINITE ELEMENT ANALYSIS
    8.
    发明公开
    RELIABILITY ASSESSMENT OF AN ELECTRONIC COMPONENT CARRIER OR A PACKAGE COMPRISING IT USING AI-SUPPORTED FINITE ELEMENT ANALYSIS 审中-实审

    公开(公告)号：EP4357961A1

    公开(公告)日：2024-04-24

    申请号：EP22201845.9

    申请日：2022-10-17

    申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

    发明人： Krivec, Thomas ,  Zuendel, Julia ,  Tao, Qi

    IPC分类号： G06F30/17 ,  G06F30/23 ,  G06F30/27 ,  G06F119/02 ,  G06F113/18 ,  G06F115/12

    CPC分类号： G06F2119/0220200101 ,  G06F30/17 ,  G06F30/23 ,  G06F30/27 ,  G06F2113/1820200101 ,  G06F2115/1220200101

    摘要： A method for a reliability assessment of an electronic component carrier or a package comprising an electronic component carrier (1). The method comprises: providing a global simulation model of the component carrier or package (1), wherein a predetermined number of geometric properties of the component carrier or package (1) and of its constituent parts made of different materials and of physical properties of materials used in said constituent parts are defined as independent variables in a parameter space of the global simulation model; and wherein the global simulation model is configured to receive input data including a point in the parameter space and is configured to output data indicative of resulting geometric and/or physical properties within a global volume of the resulting component carrier or package (1). The method comprises running a simulation of the global simulation model and identifying, in its output data, boundary conditions for a plurality of local sub-portions (2) of the component carrier or package (1). The method further comprises providing at least one data-based local model for said local sub-portions (2), each data-based local model being trained to receive said boundary conditions as input data and provide a criticality value indicative of a reliability of the respective local sub-portion (2) as output data; running the at least one local data-based model for each of said local sub-portions (2) and identifying, in the respective output data, those local sub-portions (2) whose criticality value is above at least one predetermined threshold.