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    SEMICONDUCTOR PACKAGE
    5.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：EP4290985A1

    公开(公告)日：2023-12-13

    申请号：EP22750079.0

    申请日：2022-02-07

    Applicant: LG Innotek Co., Ltd.

    Inventor： LEE, Jin Hak ,  SEONG, Dae Hyeon ,  SHIN, Ga Hui

    IPC: H05K1/02 ,  H05K1/11 ,  H01L23/538 ,  H01L23/367

    Abstract: A semiconductor package according to an embodiment includes a first insulating layer; a first pad disposed on a first surface of the first insulating layer; a second pad disposed on a second surface of the first insulating layer opposite to the first surface; and a first through part passing through the first insulating layer, wherein the first through part comprises a first-first through electrode disposed in a first region of the first insulating layer; and a first-second through electrode disposed in a second region of the first insulating layer, wherein the second region is adjacent to an outer side surface of the first insulating layer, wherein an outer side surface of the first-second through electrode is positioned on the same plane as the outer side surface of the first insulating layer, and wherein the first pad extends from the first region of the first insulating layer to the second region to connect the first-first through electrode and the first-second through electrode.

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